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David C. H. Cheng
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Taoyuan Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Circuit board structure
Patent number
9,237,643
Issue date
Jan 12, 2016
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing process for a circuit board
Patent number
8,365,400
Issue date
Feb 5, 2013
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical interconnect structure and process thereof and circuit b...
Patent number
8,288,663
Issue date
Oct 16, 2012
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Embedded chip package process
Patent number
8,153,472
Issue date
Apr 10, 2012
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Embedded chip package process
Patent number
7,888,174
Issue date
Feb 15, 2011
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package substrate
Patent number
7,772,703
Issue date
Aug 10, 2010
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Embedded chip package structure
Patent number
7,663,249
Issue date
Feb 16, 2010
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process of fabricating conductive column
Patent number
7,284,323
Issue date
Oct 23, 2007
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming IC package having upward-facing chip cavity
Patent number
6,709,897
Issue date
Mar 23, 2004
Unimicron Technology Corp.
Jao-Chin Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hole metal-filling method
Patent number
6,638,858
Issue date
Oct 28, 2003
Unimicron Taiwan Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating a multi-chip module package
Patent number
6,506,633
Issue date
Jan 14, 2003
Unimicron Technology Corp.
Jao-Chin Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming IC package having downward-facing chip cavity
Patent number
6,506,632
Issue date
Jan 14, 2003
Unimicron Technology Corp.
Jao-Chin Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making mechanical-laser structure
Patent number
6,353,999
Issue date
Mar 12, 2002
Unimicron Taiwan Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating a solder resist mask
Patent number
6,210,746
Issue date
Apr 3, 2001
Unimicron Taiwan Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board with thermal conductive structure
Patent number
6,201,300
Issue date
Mar 13, 2001
World Wiser Electronics Inc.
Tzyy-Jang Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal vias-provided cavity-down IC package structure
Patent number
6,175,497
Issue date
Jan 16, 2001
World Wiser Electronics Inc.
T. J. Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming thermal conductive structure on printed circuit b...
Patent number
6,032,355
Issue date
Mar 7, 2000
World Wiser Electronics, Inc.
Tzyy-Jang Tseng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CIRCUIT BOARD STRUCTURE
Publication number
20130105202
Publication date
May 2, 2013
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PROCESS FOR FABRICATING CIRCUIT BOARD
Publication number
20120124830
Publication date
May 24, 2012
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EMBEDDED CHIP PACKAGE PROCESS
Publication number
20110076802
Publication date
Mar 31, 2011
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STRUCTURE AND MANUFACTURING PROCESS FOR CIRCUIT BOARD
Publication number
20090284935
Publication date
Nov 19, 2009
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRICAL INTERCONNECT STRUCTURE AND PROCESS THEREOF AND CIRCUIT B...
Publication number
20090282674
Publication date
Nov 19, 2009
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND PROCESS THEREOF
Publication number
20090273907
Publication date
Nov 5, 2009
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND PROCESS THEREOF
Publication number
20090166059
Publication date
Jul 2, 2009
Unimicron Technology Corp.
Tsung-Yuan Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND PROCESS FOR FABRICATING THE SAME
Publication number
20090144972
Publication date
Jun 11, 2009
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EMBEDDED CHIP PACKAGE PROCESS
Publication number
20090023246
Publication date
Jan 22, 2009
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE SUBSTRATE
Publication number
20080036058
Publication date
Feb 14, 2008
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EMBEDDED CHIP PACKAGE PROCESS AND CIRCUIT BOARD WITH EMBEDDED CHIP
Publication number
20080029890
Publication date
Feb 7, 2008
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
EMBEDDED CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
Publication number
20070290366
Publication date
Dec 20, 2007
Unimicron Technology Corp.
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PROCESS OF FABRICATING CONDUCTIVE COLUMN AND CIRCUIT BOARD WITH CON...
Publication number
20060021794
Publication date
Feb 2, 2006
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of forming IC package having upward-facing chip cavity
Publication number
20030134455
Publication date
Jul 17, 2003
Jao-Chin Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hole metal-filling method
Publication number
20030082896
Publication date
May 1, 2003
David C. H. Cheng
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Mechanical -laser structure on printed circuit board and carrier
Publication number
20010006117
Publication date
Jul 5, 2001
David C. H. Cheng
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Package board structure and manufacturing method thereof
Publication number
20010000156
Publication date
Apr 5, 2001
David C. H. Cheng
H01 - BASIC ELECTRIC ELEMENTS