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David CHIN

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  • Cupertino, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Leadless leadframe and semiconductor device package therefrom
    • Patent number 11,855,001
    • Issue date Dec 26, 2023
    • Texas Instruments Incorporated
    • Mohammad Waseem Hussain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thin foil semiconductor package
    • Patent number 8,857,047
    • Issue date Oct 14, 2014
    • Texas Instruments Incorporated
    • Jaime A. Bayan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Universal chip carrier and method
    • Patent number 8,650,748
    • Issue date Feb 18, 2014
    • National Semiconductor Corporation
    • Artur Darbinyan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of making foil based semiconductor package
    • Patent number 8,375,577
    • Issue date Feb 19, 2013
    • National Semiconductor Corporation
    • Will Wong
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Thin foil semiconductor package
    • Patent number 8,341,828
    • Issue date Jan 1, 2013
    • National Semiconductor Corporation
    • Jaime A. Bayan
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Foil based semiconductor package
    • Patent number 8,101,470
    • Issue date Jan 24, 2012
    • National Semiconductor Corporation
    • Anindya Poddar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Thin foil semiconductor package
    • Patent number 7,836,586
    • Issue date Nov 23, 2010
    • National Semiconductor Corporation
    • Jaime A. Bayan
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

  • Information Patent Application

    LEADLESS LEADFRAME AND SEMICONDUCTOR DEVICE PACKAGE THEREFROM
    • Publication number 20220139847
    • Publication date May 5, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Mohammad Waseem Hussain
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Thin Foil Semiconductor Package
    • Publication number 20130019469
    • Publication date Jan 24, 2013
    • TEXAS INSTRUMENTS INCORPORATED
    • Jaime A. Bayan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNIVERSAL CHIP CARRIER AND METHOD
    • Publication number 20120285730
    • Publication date Nov 15, 2012
    • National Semiconductor Corporation
    • Artur DARBINYAN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PACKAGE FOR SYSTEM LEVEL ELECTRONIC PRODUCTS
    • Publication number 20120057313
    • Publication date Mar 8, 2012
    • National Semiconductor Corporation
    • Artur DARBINYAN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FOIL BASED SEMICONDUCTOR PACKAGE
    • Publication number 20110074003
    • Publication date Mar 31, 2011
    • National Semiconductor Corporation
    • Anindya PODDAR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN FOIL SEMICONDUCTOR PACKAGE
    • Publication number 20110023293
    • Publication date Feb 3, 2011
    • National Semiconductor Corporation
    • Jaime A. BAYAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN FOIL SEMICONDUCTOR PACKAGE
    • Publication number 20100046188
    • Publication date Feb 25, 2010
    • National Semiconductor Corporation
    • Jaime A. BAYAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FOIL BASED SEMICONDUCTOR PACKAGE
    • Publication number 20090305076
    • Publication date Dec 10, 2009
    • National Semiconductor Corporation
    • Will Wong
    • H01 - BASIC ELECTRIC ELEMENTS