David Chong

Person

Bayan Leaps, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conductive chip disposed on lead semiconductor package
- Patent number 8,525,321
- Issue date Sep 3, 2013
- Fairchild Semiconductor Corporation
- Jatinder Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making and designing lead frames for semiconductor packages
- Patent number 8,110,447
- Issue date Feb 7, 2012
- Fairchild Semiconductor Corporation
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging system for semiconductor devices
- Patent number 7,579,680
- Issue date Aug 25, 2009
- Fairchild Semiconductor Corporation
- David Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging system for semiconductor devices
- Patent number 7,323,361
- Issue date Jan 29, 2008
- Fairchild Semiconductor Corporation
- David Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging system for die-up connection of a die-down oriented integ...
- Patent number 6,891,257
- Issue date May 10, 2005
- Fairchild Semiconductor Corporation
- David Chong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS...
- Publication number 20130307134
- Publication date Nov 21, 2013
- Fairchild Semiconductor Corporation
- Jatinder KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS...
- Publication number 20130009309
- Publication date Jan 10, 2013
- Jatinder Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120181675
- Publication date Jul 19, 2012
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20100258925
- Publication date Oct 14, 2010
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AND DESIGNING LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20090236711
- Publication date Sep 24, 2009
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Semiconductor Package
- Publication number 20090189261
- Publication date Jul 30, 2009
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging System For Semiconductor Devices
- Publication number 20080036054
- Publication date Feb 14, 2008
- David Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package and method for making the same
- Publication number 20070001278
- Publication date Jan 4, 2007
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and method for packaging an integrated circuit die
- Publication number 20050275089
- Publication date Dec 15, 2005
- Rajeev Dinkar Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging system for semiconductor devices
- Publication number 20030214019
- Publication date Nov 20, 2003
- David Chong
- H01 - BASIC ELECTRIC ELEMENTS

David Chong

Person

Patents Grantslast 30 patents

Semiconductor die package and method for making the same

Semiconductor die package and method for making the same

Conductive chip disposed on lead semiconductor package

Method of making and designing lead frames for semiconductor packages

Packaging system for semiconductor devices

Packaging system for semiconductor devices

Packaging system for die-up connection of a die-down oriented integ...

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS...

CONDUCTIVE CHIP DISPOSED ON LEAD SEMICONDUCTOR PACKAGE AND METHODS...

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

METHOD OF MAKING AND DESIGNING LEAD FRAMES FOR SEMICONDUCTOR PACKAGES

Ultra-Thin Semiconductor Package

Packaging System For Semiconductor Devices

Semiconductor die package and method for making the same

Package and method for packaging an integrated circuit die

Packaging system for semiconductor devices