David CONKLIN

Person

Saratoga Springs, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-situ lithography pattern enhancement with localized stress treat...
- Patent number 12,204,253
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Andrew Weloth
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
In-situ lithography pattern enhancement with localized stress treat...
- Patent number 11,994,807
- Issue date May 28, 2024
- Tokyo Electron Limited
- Andrew Weloth
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Coaxial see-through alignment imaging system
- Patent number 11,526,088
- Issue date Dec 13, 2022
- Tokyo Electron Limited
- Anton J. Devilliers
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND COMPOSITIONS FOR TRENCH FORMATION USING ADVANCED TRACK-...
- Publication number 20250029837
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- David Conklin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF SUB-LITHOGRAPHIC MANDREL PATTERNS USING REVERSIBLE OVE...
- Publication number 20240419074
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Michael Murphy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
INORGANIC/HYBRID STRESS FILMS
- Publication number 20240363340
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Charlotte Cutler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MULTIPLE LOCATION COMPRESSING BONDED ARM-POISEDON...
- Publication number 20240203797
- Publication date Jun 20, 2024
- TOKYO ELECTRON LIMITED
- Andrew WELOTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...
- Publication number 20240201601
- Publication date Jun 20, 2024
- TOKYO ELECTRON LIMITED
- Andrew WELOTH
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPARATUS AND METHOD FOR WAFER ALIGNMENT
- Publication number 20240203778
- Publication date Jun 20, 2024
- TOKYO ELECTRON LIMITED
- David POWER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Semiconductor Features
- Publication number 20240168384
- Publication date May 23, 2024
- TOKYO ELECTRON LIMITED
- Michael Murphy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Patterning Method Using Secondary Resist Surface Functionalization...
- Publication number 20240030029
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Charlotte Cutler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...
- Publication number 20230359128
- Publication date Nov 9, 2023
- TOKYO ELECTRON LIMITED
- Andrew WELOTH
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-2...
- Publication number 20230352343
- Publication date Nov 2, 2023
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dry Developing Metal-Free Photoresists
- Publication number 20230350303
- Publication date Nov 2, 2023
- TOKYO ELECTRON LIMITED
- Charlotte Cutler
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HYBRID PATTERNING-BONDING SEMICONDUCTOR TOOL
- Publication number 20230326814
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHUCK COMPENSATION VIA WAFER SHAPE CONTROL
- Publication number 20230326738
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SHAPE CONTROL FOR W2W BONDING
- Publication number 20230326767
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Aligned Multiple Patterning Method
- Publication number 20230290676
- Publication date Sep 14, 2023
- TOKYO ELECTRON LIMITED
- David Power
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deprotection via Dye Diffusion
- Publication number 20230251570
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Michael MURPHY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CORRECTING WAFER BOW USING A DIRECT WRITE STRESS FILM
- Publication number 20220336226
- Publication date Oct 20, 2022
- TOKYO ELECTRON LIMITED
- Charlotte CUTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL SEE-THROUGH INSPECTION SYSTEM
- Publication number 20220050386
- Publication date Feb 17, 2022
- TOKYO ELECTRON LIMITED
- Anton J. DEVILLIERS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COAXIAL SEE-THROUGH ALIGNMENT IMAGING SYSTEM
- Publication number 20220050388
- Publication date Feb 17, 2022
- TOKYO ELECTRON LIMITED
- Anton J. DEVILLIERS
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

David CONKLIN

Person

Patents Grantslast 30 patents

In-situ lithography pattern enhancement with localized stress treat...

In-situ lithography pattern enhancement with localized stress treat...

Coaxial see-through alignment imaging system

Patents Applicationslast 30 patents

METHODS AND COMPOSITIONS FOR TRENCH FORMATION USING ADVANCED TRACK-...

FORMATION OF SUB-LITHOGRAPHIC MANDREL PATTERNS USING REVERSIBLE OVE...

INORGANIC/HYBRID STRESS FILMS

THREE-DIMENSIONAL MULTIPLE LOCATION COMPRESSING BONDED ARM-POISEDON...

IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...

APPARATUS AND METHOD FOR WAFER ALIGNMENT

Patterning Semiconductor Features

Patterning Method Using Secondary Resist Surface Functionalization...

IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...

TOP-DOWN SELF-ALIGNMENT OF VIAS IN A SEMICONDUCTOR DEVICE FOR SUB-2...

Dry Developing Metal-Free Photoresists

HYBRID PATTERNING-BONDING SEMICONDUCTOR TOOL

METHOD FOR CHUCK COMPENSATION VIA WAFER SHAPE CONTROL

WAFER SHAPE CONTROL FOR W2W BONDING

Self Aligned Multiple Patterning Method

Selective Deprotection via Dye Diffusion

METHOD OF CORRECTING WAFER BOW USING A DIRECT WRITE STRESS FILM

COAXIAL SEE-THROUGH INSPECTION SYSTEM

COAXIAL SEE-THROUGH ALIGNMENT IMAGING SYSTEM