David CRAIG

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,749,628
- Issue date Sep 5, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low force liquid metal interconnect solutions
- Patent number 11,622,466
- Issue date Apr 4, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,527,501
- Issue date Dec 13, 2022
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
- Publication number 20230209759
- Publication date Jun 29, 2023
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAV...
- Publication number 20230074970
- Publication date Mar 9, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW FORCE LIQUID METAL INTERCONNECT SOLUTIONS
- Publication number 20210392774
- Publication date Dec 16, 2021
- Intel Corporation
- Karumbu MEYYAPPAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR