DAVID D. SENK

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San Ramon, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board with non-plated hole interposed between plated holes...
- Patent number 10,631,407
- Issue date Apr 21, 2020
- Cisco Technology, Inc.
- Jennifer Oliver
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple layer printed circuit board with unplated vias
- Patent number 8,889,999
- Issue date Nov 18, 2014
- Cisco Technology, Inc.
- Aritharan Thurairajaratnam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structuring and circuitizing printed circuit board through-holes
- Patent number 7,935,895
- Issue date May 3, 2011
- Cisco Technology, Inc.
- David D. Senk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Printed Circuit Board Comprising Both Conductive Metal and Optical...
- Publication number 20140119703
- Publication date May 1, 2014
- Cisco Technology, Inc.
- Scott Hinaga
- G02 - OPTICS
Information Patent Application
METHOD AND APPARATUS FOR DETERMINING SURFACE ROUGHNESS OF METAL FOI...
- Publication number 20130108118
- Publication date May 2, 2013
- Cisco Technology, Inc.
- Scott T. Hinaga
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE LAYER PRINTED CIRCUIT BOARD
- Publication number 20130098671
- Publication date Apr 25, 2013
- ARITHARAN THURAIRAJARATNAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FORMING FILLED VIAS AND PLATED THROUGH HOLES
- Publication number 20090188710
- Publication date Jul 30, 2009
- Cisco Technology, Inc.
- David D. Senk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURING AND CIRCUITIZING PRINTED CIRCUIT BOARD THROUGH-HOLES
- Publication number 20080073113
- Publication date Mar 27, 2008
- Cisco Technology, Inc.
- DAVID D. SENK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR