David Daycock

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 12,010,836
- Issue date Jun 11, 2024
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,967,556
- Issue date Apr 23, 2024
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad connection layout
- Patent number 11,876,068
- Issue date Jan 16, 2024
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including isolation structures protruding i...
- Patent number 11,800,717
- Issue date Oct 24, 2023
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,791,202
- Issue date Oct 17, 2023
- Lingyu Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic devices, and related electronic devices
- Patent number 11,744,086
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- David A. Daycock
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,672,114
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,641,742
- Issue date May 2, 2023
- Micron Technology, Inc.
- Cole Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad connection layout
- Patent number 11,502,053
- Issue date Nov 15, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,417,681
- Issue date Aug 16, 2022
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including isolation structures protruding i...
- Patent number 11,322,516
- Issue date May 3, 2022
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,177,159
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Lingyu Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,158,577
- Issue date Oct 26, 2021
- Micron Technology, Inc.
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,152,388
- Issue date Oct 19, 2021
- Micron Technology, Inc.
- Cole Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,121,144
- Issue date Sep 14, 2021
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,037,944
- Issue date Jun 15, 2021
- Micron Technology, Inc.
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 10,985,179
- Issue date Apr 20, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20240145425
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20230026960
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH LINERS AND RELATED METHODS
- Publication number 20220278214
- Publication date Sep 1, 2022
- Micron Technologiy, Inc.
- Christopher J. Larsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES PROTRUDING I...
- Publication number 20220262820
- Publication date Aug 18, 2022
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ELECTRONIC DEVICES, AND RELATED ELECTRONIC DEVIC...
- Publication number 20220254834
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- David A. Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20220165701
- Publication date May 26, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES PROTRUDING I...
- Publication number 20220068955
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING MICROELECTRONIC DEVICES WITH CONTACTS TO CO...
- Publication number 20220045007
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20220028733
- Publication date Jan 27, 2022
- Micron Technology, Inc.
- Lingyu Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20210408039
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Cole Smith
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210375902
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210305267
- Publication date Sep 30, 2021
- Micron Technology, Inc.
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210257385
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING MICROELECTRONIC DEVICES WITH CONTACTS TO CO...
- Publication number 20210242131
- Publication date Aug 5, 2021
- Micron Technology, Inc.
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210143164
- Publication date May 13, 2021
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210143054
- Publication date May 13, 2021
- Micron Technology, Inc.
- Lingyu Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20210111184
- Publication date Apr 15, 2021
- Micron Technology, Inc.
- Cole Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Barrier Material Between Silicon-Conta...
- Publication number 20210091009
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Devesh Kumar Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210043644
- Publication date Feb 11, 2021
- Micron Technology, Inc.
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays And Methods Used In Forming A Memory Array Comprising...
- Publication number 20210013221
- Publication date Jan 14, 2021
- Micron Technology, Inc.
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS

David Daycock

Person

Patents Grantslast 30 patents

Memory arrays and methods used in forming a memory array comprising...

Methods for fabricating microelectronic devices with contacts to co...

Bond pad connection layout

Microelectronic devices including isolation structures protruding i...

Memory arrays and methods used in forming a memory array comprising...

Methods of forming electronic devices, and related electronic devices

Memory arrays and methods used in forming a memory array comprising...

Memory arrays and methods used in forming a memory array comprising...

Bond pad connection layout

Memory arrays and methods used in forming a memory array comprising...

Microelectronic devices including isolation structures protruding i...

Memory arrays and methods used in forming a memory array comprising...

Methods for fabricating microelectronic devices with contacts to co...

Memory arrays and methods used in forming a memory array comprising...

Memory arrays and methods used in forming a memory array comprising...

Memory arrays and methods used in forming a memory array comprising...

Memory arrays and methods used in forming a memory array comprising...

Patents Applicationslast 30 patents

BOND PAD CONNECTION LAYOUT

BOND PAD CONNECTION LAYOUT

SEMICONDUCTOR DEVICES WITH LINERS AND RELATED METHODS

MICROELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES PROTRUDING I...

METHODS OF FORMING ELECTRONIC DEVICES, AND RELATED ELECTRONIC DEVIC...

BOND PAD CONNECTION LAYOUT

MICROELECTRONIC DEVICES INCLUDING ISOLATION STRUCTURES PROTRUDING I...

METHODS FOR FABRICATING MICROELECTRONIC DEVICES WITH CONTACTS TO CO...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

METHODS FOR FABRICATING MICROELECTRONIC DEVICES WITH CONTACTS TO CO...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

Integrated Assemblies Having Barrier Material Between Silicon-Conta...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...

Memory Arrays And Methods Used In Forming A Memory Array Comprising...