David Daycock

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,029,032
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming terminations in stacked memory arrays
- Patent number 11,756,826
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,631,684
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevationally-extending string of memory cells and methods of formi...
- Patent number 11,616,075
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies which include stacked memory decks, and metho...
- Patent number 11,569,258
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Liu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures with liners
- Patent number 11,355,607
- Issue date Jun 7, 2022
- Micron Technology, Inc.
- Christopher J. Larsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of termination structures in stacked memory arrays
- Patent number 11,177,279
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming terminations in stacked memory arrays
- Patent number 11,121,146
- Issue date Sep 14, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures
- Patent number 11,081,495
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state memory component
- Patent number 11,010,058
- Issue date May 18, 2021
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated structures and NAND memory arrays
- Patent number 10,998,336
- Issue date May 4, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,998,326
- Issue date May 4, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevationally-extending string of memory cells and methods of formi...
- Patent number 10,923,492
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND with integral drain-end select gate (SGD)
- Patent number 10,790,290
- Issue date Sep 29, 2020
- Intel Corporation
- David A. Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer memory
- Patent number 10,762,939
- Issue date Sep 1, 2020
- Intel Corporation
- Christopher J. Larsen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated assemblies which include stacked memory decks, and metho...
- Patent number 10,748,921
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Liu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,734,395
- Issue date Aug 4, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of termination structures in stacked memory arrays
- Patent number 10,658,380
- Issue date May 19, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevationally-extending string of memory cells individually compris...
- Patent number 10,658,382
- Issue date May 19, 2020
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry and 3D memory
- Patent number 10,608,003
- Issue date Mar 31, 2020
- Micron Technology, Inc.
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays, and methods of forming memory arrays
- Patent number 10,541,252
- Issue date Jan 21, 2020
- Micron Technology, Inc.
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,483,270
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated structures
- Patent number 10,453,858
- Issue date Oct 22, 2019
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures
- Patent number 10,355,018
- Issue date Jul 16, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state memory component
- Patent number 10,318,170
- Issue date Jun 11, 2019
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory arrays, and methods of forming memory arrays
- Patent number 10,304,853
- Issue date May 28, 2019
- Micron Technology, Inc.
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevationally-extending string of memory cells individually compris...
- Patent number 10,283,520
- Issue date May 7, 2019
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures
- Patent number 10,256,249
- Issue date Apr 9, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,229,923
- Issue date Mar 12, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry and 3D memory
- Patent number 10,224,336
- Issue date Mar 5, 2019
- Micron Technology, Inc.
- David Daycock
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
DIGIT LINE / CELL PLATE ISOLATION
- Publication number 20240407154
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Albert Daen Liao
Information Patent Application
Memory Circuitry And Methods Used In Forming Memory Circuitry
- Publication number 20240315001
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Kamal M. Karda
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240315018
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH CONDUCTIVE EXTENSIONS BETWEEN UPPER ST...
- Publication number 20240274538
- Publication date Aug 15, 2024
- Lodestar Licensing Group LLC
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY FORMATION TECHNIQUES
- Publication number 20240188299
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Christopher J. Larsen
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING PILLARS WITH PARTIALLY-CIRCULAR U...
- Publication number 20240057337
- Publication date Feb 15, 2024
- Lodestar Licensing Group LLC
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STRINGS OF MEMORY CELLS AND RELATED SYSTEMS
- Publication number 20230380193
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- David A. Daycock
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230209822
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevationally-Extending String of Memory Cells and Methods of Formi...
- Publication number 20230157024
- Publication date May 18, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING TERMINATIONS IN STACKED MEMORY ARRAYS
- Publication number 20210408029
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures
- Publication number 20210343743
- Publication date Nov 4, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210233922
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevationally-Extending String of Memory Cells and Methods of Formi...
- Publication number 20210175250
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20200350333
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- Liu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20200321347
- Publication date Oct 8, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS
- Publication number 20200279867
- Publication date Sep 3, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Stacked Memory Decks, and Metho...
- Publication number 20200135751
- Publication date Apr 30, 2020
- Micron Technology, Inc.
- Liu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING TERMINATIONS IN STACKED MEMORY ARRAYS
- Publication number 20200119036
- Publication date Apr 16, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS
- Publication number 20200119040
- Publication date Apr 16, 2020
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20200058663
- Publication date Feb 20, 2020
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures and NAND Memory Arrays
- Publication number 20200013802
- Publication date Jan 9, 2020
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures
- Publication number 20190333934
- Publication date Oct 31, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE MEMORY COMPONENT
- Publication number 20190294330
- Publication date Sep 26, 2019
- Intel Corporation
- Jun Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Memory Arrays, and Methods of Forming Memory Arrays
- Publication number 20190267396
- Publication date Aug 29, 2019
- Micron Technology, Inc.
- David Daycock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevationally-Extending String Of Memory Cells Individually Compris...
- Publication number 20190244972
- Publication date Aug 8, 2019
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20190206883
- Publication date Jul 4, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures
- Publication number 20190198528
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry And 3D Memory
- Publication number 20190172833
- Publication date Jun 6, 2019
- Micron Technology, Inc.
- David Daycock
- G11 - INFORMATION STORAGE
Information Patent Application
3D NAND WITH INTEGRAL DRAIN-END SELECT GATE (SGD)
- Publication number 20190103410
- Publication date Apr 4, 2019
- Intel Corporation
- DAVID A. DAYCOCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER MEMORY
- Publication number 20190005996
- Publication date Jan 3, 2019
- Intel Corporation
- Christopher J. Larsen
- G11 - INFORMATION STORAGE

David Daycock

Person

Patents Grantslast 30 patents

Integrated assemblies and methods of forming integrated assemblies

Forming terminations in stacked memory arrays

Integrated assemblies and methods of forming integrated assemblies

Elevationally-extending string of memory cells and methods of formi...

Integrated assemblies which include stacked memory decks, and metho...

Semiconductor device structures with liners

Formation of termination structures in stacked memory arrays

Forming terminations in stacked memory arrays

Integrated structures

Solid state memory component

Integrated structures and NAND memory arrays

Integrated assemblies and methods of forming integrated assemblies

Elevationally-extending string of memory cells and methods of formi...

3D NAND with integral drain-end select gate (SGD)

Computer memory

Integrated assemblies which include stacked memory decks, and metho...

Integrated assemblies and methods of forming integrated assemblies

Formation of termination structures in stacked memory arrays

Elevationally-extending string of memory cells individually compris...

Integrated circuitry and 3D memory

Memory arrays, and methods of forming memory arrays

Integrated assemblies and methods of forming integrated assemblies

Methods of forming integrated structures

Integrated structures

Solid state memory component

Memory arrays, and methods of forming memory arrays

Elevationally-extending string of memory cells individually compris...

Integrated structures

Integrated assemblies and methods of forming integrated assemblies

Integrated circuitry and 3D memory

Patents Applicationslast 30 patents

DIGIT LINE / CELL PLATE ISOLATION

Memory Circuitry And Methods Used In Forming Memory Circuitry

Integrated Assemblies and Methods of Forming Integrated Assemblies

MICROELECTRONIC DEVICES WITH CONDUCTIVE EXTENSIONS BETWEEN UPPER ST...

THREE-DIMENSIONAL MEMORY ARRAY FORMATION TECHNIQUES

MICROELECTRONIC DEVICES INCLUDING PILLARS WITH PARTIALLY-CIRCULAR U...

MEMORY DEVICES INCLUDING STRINGS OF MEMORY CELLS AND RELATED SYSTEMS

Integrated Assemblies and Methods of Forming Integrated Assemblies

Elevationally-Extending String of Memory Cells and Methods of Formi...

FORMING TERMINATIONS IN STACKED MEMORY ARRAYS

Integrated Structures

Integrated Assemblies and Methods of Forming Integrated Assemblies

Elevationally-Extending String of Memory Cells and Methods of Formi...

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

Integrated Assemblies and Methods of Forming Integrated Assemblies

FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS

Integrated Assemblies Which Include Stacked Memory Decks, and Metho...

FORMING TERMINATIONS IN STACKED MEMORY ARRAYS

FORMATION OF TERMINATION STRUCTURES IN STACKED MEMORY ARRAYS

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Structures and NAND Memory Arrays

Integrated Structures

SOLID STATE MEMORY COMPONENT

Memory Arrays, and Methods of Forming Memory Arrays

Elevationally-Extending String Of Memory Cells Individually Compris...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Structures

Integrated Circuitry And 3D Memory

3D NAND WITH INTEGRAL DRAIN-END SELECT GATE (SGD)

COMPUTER MEMORY