David Doiron

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Ashburnham, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming hermetic package for a power semiconductor
- Patent number 11,721,600
- Issue date Aug 8, 2023
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for power semiconductor
- Patent number 10,903,128
- Issue date Jan 26, 2021
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability module
- Patent number 7,453,708
- Issue date Nov 18, 2008
- International Rectifier Corporation
- David Doiron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module
- Patent number 6,078,501
- Issue date Jun 20, 2000
- Omnirel LLC
- John Catrambone
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
LOW-PROFILE SEALED SURFACE-MOUNT PACKAGE
- Publication number 20230360990
- Publication date Nov 9, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming hermetic package for a power semiconductor
- Publication number 20210159130
- Publication date May 27, 2021
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGE FOR POWER SEMICONDUCTOR
- Publication number 20200266118
- Publication date Aug 20, 2020
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High reliability module
- Publication number 20050111798
- Publication date May 26, 2005
- David Doiron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR