David Fraser Rae

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising passive device configured as electromagnetic int...
- Patent number 11,670,599
- Issue date Jun 6, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising multi-level vertically stacked redistribution po...
- Patent number 11,502,049
- Issue date Nov 15, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate configured as a heat spreader
- Patent number 11,404,343
- Issue date Aug 2, 2022
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-low profile stacked RDL semiconductor package
- Patent number 11,393,808
- Issue date Jul 19, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal and electromagnetic interference shielding for die embedded...
- Patent number 10,410,971
- Issue date Sep 10, 2019
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus, and method for embedding a 3D component with an...
- Patent number 10,163,687
- Issue date Dec 25, 2018
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus, and method for embedding a device in a faceup wo...
- Patent number 9,985,010
- Issue date May 29, 2018
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar fan-out wafer level packaging
- Patent number 9,806,048
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit (IC) package comprising a plurality...
- Patent number 9,679,873
- Issue date Jun 13, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (POP) device comprising solder connections betwe...
- Patent number 9,601,472
- Issue date Mar 21, 2017
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded components and method of making...
- Patent number 9,601,435
- Issue date Mar 21, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with reduced height
- Patent number 9,484,327
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) integrated device comprising a plurality o...
- Patent number 9,355,898
- Issue date May 31, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INT...
- Publication number 20220013472
- Publication date Jan 13, 2022
- QUALCOMM Incorporated
- Jeahyeong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING MULTI-LEVEL VERTICALLY STACKED REDISTRIBUTION PO...
- Publication number 20210351145
- Publication date Nov 11, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...
- Publication number 20210280523
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER
- Publication number 20210249325
- Publication date Aug 12, 2021
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-LOW PROFILE STACKED RDL SEMICONDUCTOR PACKAGE
- Publication number 20210104507
- Publication date Apr 8, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPERED CORNER PACKAGE FOR EMI SHIELD
- Publication number 20190341352
- Publication date Nov 7, 2019
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL AND ELECTROMAGNETIC INTERFERENCE SHIELDING FOR DIE EMBEDDED...
- Publication number 20190067205
- Publication date Feb 28, 2019
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20170271289
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Lizabeth Ann KESER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...
- Publication number 20160372446
- Publication date Dec 22, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN...
- Publication number 20160343651
- Publication date Nov 24, 2016
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WO...
- Publication number 20160343635
- Publication date Nov 24, 2016
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWE...
- Publication number 20160315072
- Publication date Oct 27, 2016
- QUALCOMM Incorporated
- Lizabeth Ann Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...
- Publication number 20160218064
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...
- Publication number 20160148864
- Publication date May 26, 2016
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A PLURALITY O...
- Publication number 20160035622
- Publication date Feb 4, 2016
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT
- Publication number 20140264946
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

David Fraser Rae

Person

Patents Grantslast 30 patents

Package comprising passive device configured as electromagnetic int...

Package comprising multi-level vertically stacked redistribution po...

Package comprising a substrate configured as a heat spreader

Ultra-low profile stacked RDL semiconductor package

Thermal and electromagnetic interference shielding for die embedded...

System, apparatus, and method for embedding a 3D component with an...

System, apparatus, and method for embedding a device in a faceup wo...

Planar fan-out wafer level packaging

Low profile integrated circuit (IC) package comprising a plurality...

Package on package (POP) device comprising solder connections betwe...

Semiconductor package with embedded components and method of making...

Package-on-package structure with reduced height

Package on package (PoP) integrated device comprising a plurality o...

Patents Applicationslast 30 patents

PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INT...

PACKAGE COMPRISING MULTI-LEVEL VERTICALLY STACKED REDISTRIBUTION PO...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED META...

PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER

ULTRA-LOW PROFILE STACKED RDL SEMICONDUCTOR PACKAGE

TAPERED CORNER PACKAGE FOR EMI SHIELD

THERMAL AND ELECTROMAGNETIC INTERFERENCE SHIELDING FOR DIE EMBEDDED...

PLANAR FAN-OUT WAFER LEVEL PACKAGING

LOW PROFILE INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING A PLURALITY...

SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN...

SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WO...

PACKAGE ON PACKAGE (POP) DEVICE COMPRISING SOLDER CONNECTIONS BETWE...

SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...

INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...

PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A PLURALITY O...

PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT