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David G. Swoboda
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Chippewa Falls, MN, US
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last 30 patents
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Patent Grant
Printed wiring board with high density inner layer structure
Patent number
6,586,687
Issue date
Jul 1, 2003
TTM Technologies, Inc.
Bruce W. Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Printed wiring board with high density inner layer structure
Publication number
20030047355
Publication date
Mar 13, 2003
Bruce W. Lee
H01 - BASIC ELECTRIC ELEMENTS