David Gani

Person

Choa Chu kang, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip package
- Patent number 12,136,608
- Issue date Nov 5, 2024
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level proximity sensor
- Patent number 11,996,397
- Issue date May 28, 2024
- STMicroelectronics Pte Ltd
- David Gani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Slanted glass edge for image sensor package
- Patent number 11,942,496
- Issue date Mar 26, 2024
- STMicroelectronics Pte Ltd
- Laurent Herard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a wafer level chip scale package (WLCSP)
- Patent number 11,908,831
- Issue date Feb 20, 2024
- STMicroelectronics Pte Ltd
- Chun Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor with integrated ALS
- Patent number 11,828,875
- Issue date Nov 28, 2023
- STMicroelectronics Pte Ltd
- David Gani
- G01 - MEASURING TESTING
Information Patent Grant
WLCSP with transparent substrate and method of manufacturing the same
- Patent number 11,742,437
- Issue date Aug 29, 2023
- STMicroelectronics Ltd.
- David Gani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack detection integrity check
- Patent number 11,585,847
- Issue date Feb 21, 2023
- STMicroelectronics Pte Ltd
- Pedro Jr Santos Peralta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package
- Patent number 11,581,289
- Issue date Feb 14, 2023
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
WLCSP package with different solder volumes
- Patent number 11,581,280
- Issue date Feb 14, 2023
- STMicroelectronics Pte Ltd
- David Gani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with protected sidewall and method of forming...
- Patent number 11,562,937
- Issue date Jan 24, 2023
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a support substrate and stacked electr...
- Patent number 11,527,511
- Issue date Dec 13, 2022
- STMicroelectronics Pte Ltd
- David Gani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor chip using a dummy sidewall layer
- Patent number 11,502,029
- Issue date Nov 15, 2022
- STMicroelectronics Pte Ltd
- Laurent Herard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 11,404,355
- Issue date Aug 2, 2022
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack detection integrity check
- Patent number 11,366,156
- Issue date Jun 21, 2022
- STMicroelectronics Pte Ltd
- Pedro Jr Santos Peralta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrical interconnection bridge
- Patent number 11,270,946
- Issue date Mar 8, 2022
- STMicroelectronics Pte Ltd
- Yong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor with integrated ALS
- Patent number 11,226,399
- Issue date Jan 18, 2022
- STMicroelectronics Pte Ltd
- David Gani
- G01 - MEASURING TESTING
Information Patent Grant
Ambient light sensor with light protection
- Patent number 11,193,821
- Issue date Dec 7, 2021
- STMicroelectronics Pte Ltd
- Laurent Herard
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level proximity sensor
- Patent number 11,069,667
- Issue date Jul 20, 2021
- STMicroelectronics Pte Ltd
- David Gani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with protected sidewall and method of forming...
- Patent number 10,910,287
- Issue date Feb 2, 2021
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 10,763,194
- Issue date Sep 1, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor with integrated ALS
- Patent number 10,422,860
- Issue date Sep 24, 2019
- STMicroelectronics Pte Ltd
- David Gani
- G01 - MEASURING TESTING
Information Patent Grant
Overmold proximity sensor and associated methods
- Patent number 10,147,834
- Issue date Dec 4, 2018
- STMicroelectronics Pte Ltd
- Laurent Herard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air venting on proximity sensor
- Patent number 9,793,427
- Issue date Oct 17, 2017
- STMicroelectronics Pte Ltd
- David Gani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device with different width cell layers and related me...
- Patent number 9,768,216
- Issue date Sep 19, 2017
- STMicroelectronics Pte Ltd
- Dave Alexis Delacruz
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Optical assembly including electrically conductive coupling member...
- Patent number 9,671,671
- Issue date Jun 6, 2017
- STMicroelectronics Pte Ltd
- Wee Chin Judy Lim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Proximity and ranging sensor
- Patent number 9,525,094
- Issue date Dec 20, 2016
- STMicroelectronics (Grenoble 2) SAS
- Eric Saugier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact having an angled portion
- Patent number 9,244,334
- Issue date Jan 26, 2016
- STMicroelectronics Pte Ltd
- Hk Looi
- G02 - OPTICS
Information Patent Grant
Method and system for shielding semiconductor devices from light
- Patent number 8,642,119
- Issue date Feb 4, 2014
- STMicroelectronics Pte Ltd
- Wingshenq Wong
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Electromagnetic interference shielding on semiconductor devices
- Patent number 8,576,574
- Issue date Nov 5, 2013
- STMicroelectronics Pte Ltd
- Wingshenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wafer level optical package structure and manufacturing me...
- Patent number 8,492,181
- Issue date Jul 23, 2013
- STMicroelectronics Pte Ltd
- Anandan Ramasamy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332436
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Yiying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL
- Publication number 20240332328
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Hui-Tzu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE
- Publication number 20240194709
- Publication date Jun 13, 2024
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145258
- Publication date May 2, 2024
- STMicroelectronics Pte Ltd
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES
- Publication number 20230307302
- Publication date Sep 28, 2023
- STMicroelectronics LTD
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS
- Publication number 20230230949
- Publication date Jul 20, 2023
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20230197688
- Publication date Jun 22, 2023
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK DETECTION INTEGRITY CHECK
- Publication number 20220291277
- Publication date Sep 15, 2022
- STMicroelectronics Pte Ltd
- Pedro Jr Santos PERALTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DIE PACKAGE
- Publication number 20220208819
- Publication date Jun 30, 2022
- STMicroelectronics LTD
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20220122941
- Publication date Apr 21, 2022
- STMicroelectronics Pte Ltd
- Chun Yi TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR WITH INTEGRATED ALS
- Publication number 20220107392
- Publication date Apr 7, 2022
- STMicroelectronics Pte Ltd
- David GANI
- G01 - MEASURING TESTING
Information Patent Application
SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE
- Publication number 20210384241
- Publication date Dec 9, 2021
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROXIMITY SENSOR
- Publication number 20210327863
- Publication date Oct 21, 2021
- STMicroelectronics Pte Ltd
- David GANI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WLCSP WITH TRANSPARENT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210305438
- Publication date Sep 30, 2021
- STMicroelectronics LTD
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WLCSP PACKAGE WITH DIFFERENT SOLDER VOLUMES
- Publication number 20210202419
- Publication date Jul 1, 2021
- STMicroelectronics Pte Ltd
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PROTECTED SIDEWALL AND METHOD OF FORMING...
- Publication number 20210159136
- Publication date May 27, 2021
- STMicroelectronics Pte Ltd
- Yun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICAL INTERCONNECTION BRIDGE
- Publication number 20210066198
- Publication date Mar 4, 2021
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE
- Publication number 20210035952
- Publication date Feb 4, 2021
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A THIN SEMICONDUCTOR CHIP USING A DUMMY SID...
- Publication number 20210020555
- Publication date Jan 21, 2021
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20200365492
- Publication date Nov 19, 2020
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK DETECTION INTEGRITY CHECK
- Publication number 20200241068
- Publication date Jul 30, 2020
- STMicroelectronics Pte Ltd
- Pedro Jr Santos PERALTA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE COMPRISING A SUPPORT SUBSTRATE AND STACKED ELECTR...
- Publication number 20200168582
- Publication date May 28, 2020
- STMicroelectronics Pte Ltd
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR WITH INTEGRATED ALS
- Publication number 20190361093
- Publication date Nov 28, 2019
- STMicroelectronics Pte Ltd
- David GANI
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE COMPRISING ELECTRONIC CHIPS
- Publication number 20190319157
- Publication date Oct 17, 2019
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PROTECTED SIDEWALL AND METHOD OF FORMING...
- Publication number 20190267302
- Publication date Aug 29, 2019
- STMicroelectronics Pte Ltd
- Yun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMBIENT LIGHT SENSOR WITH LIGHT PROTECTION
- Publication number 20190195685
- Publication date Jun 27, 2019
- STMicroelectronics Pte Ltd
- Laurent HERARD
- G01 - MEASURING TESTING
Information Patent Application
PROXIMITY SENSOR WITH INTEGRATED ALS
- Publication number 20190154801
- Publication date May 23, 2019
- STMicroelectronics Pte Ltd
- David GANI
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20190096788
- Publication date Mar 28, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROXIMITY SENSOR
- Publication number 20170287886
- Publication date Oct 5, 2017
- STMicroelectronics Pte Ltd
- David Gani
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MAKING AN INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTR...
- Publication number 20170186644
- Publication date Jun 29, 2017
- STMicroelectronics Pte Ltd
- Laurent HERARD
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multi-chip package

Wafer level proximity sensor

Slanted glass edge for image sensor package

Method for manufacturing a wafer level chip scale package (WLCSP)

Proximity sensor with integrated ALS

WLCSP with transparent substrate and method of manufacturing the same

Crack detection integrity check

Multi-chip package

WLCSP package with different solder volumes

Semiconductor package with protected sidewall and method of forming...

Electronic device comprising a support substrate and stacked electr...

Thin semiconductor chip using a dummy sidewall layer

Package with lead frame with improved lead design for discrete elec...

Crack detection integrity check

Package with electrical interconnection bridge

Proximity sensor with integrated ALS

Ambient light sensor with light protection

Wafer level proximity sensor

Semiconductor package with protected sidewall and method of forming...

Package with lead frame with improved lead design for discrete elec...

Proximity sensor with integrated ALS

Overmold proximity sensor and associated methods

Air venting on proximity sensor

Image sensor device with different width cell layers and related me...

Optical assembly including electrically conductive coupling member...

Proximity and ranging sensor

Contact having an angled portion

Method and system for shielding semiconductor devices from light

Electromagnetic interference shielding on semiconductor devices

Embedded wafer level optical package structure and manufacturing me...

Patents Applicationslast 30 patents

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE

PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES

SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS

MULTI-CHIP PACKAGE

CRACK DETECTION INTEGRITY CHECK

SENSOR DIE PACKAGE

METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)

PROXIMITY SENSOR WITH INTEGRATED ALS

SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE

WAFER LEVEL PROXIMITY SENSOR

WLCSP WITH TRANSPARENT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WLCSP PACKAGE WITH DIFFERENT SOLDER VOLUMES

SEMICONDUCTOR PACKAGE WITH PROTECTED SIDEWALL AND METHOD OF FORMING...

PACKAGE WITH ELECTRICAL INTERCONNECTION BRIDGE

MULTI-CHIP PACKAGE

METHOD OF MANUFACTURING A THIN SEMICONDUCTOR CHIP USING A DUMMY SID...

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

CRACK DETECTION INTEGRITY CHECK

ELECTRONIC DEVICE COMPRISING A SUPPORT SUBSTRATE AND STACKED ELECTR...

PROXIMITY SENSOR WITH INTEGRATED ALS

ELECTRONIC DEVICE COMPRISING ELECTRONIC CHIPS

SEMICONDUCTOR PACKAGE WITH PROTECTED SIDEWALL AND METHOD OF FORMING...

AMBIENT LIGHT SENSOR WITH LIGHT PROTECTION

PROXIMITY SENSOR WITH INTEGRATED ALS

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

WAFER LEVEL PROXIMITY SENSOR

METHOD FOR MAKING AN INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTR...