David GUILLON

Person

Vorderthal, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Metal substrate structure for a semiconductor power module
- Patent number 12,218,192
- Issue date Feb 4, 2025
- HITACHI ENERGY LTD
- David Guillon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with free-floating packaging concept
- Patent number 12,094,791
- Issue date Sep 17, 2024
- HITACHI ENERGY LTD
- Jagoda Dobrzynska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module embedded in a mold compounded with an op...
- Patent number 11,362,008
- Issue date Jun 14, 2022
- Hitachi Energy Switzerland AG
- Dominik Trüssel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,854,524
- Issue date Dec 1, 2020
- ABB Schweiz AG
- David Guillon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage power electronics module for subsea applications under...
- Patent number 9,984,948
- Issue date May 29, 2018
- ABB Schweiz AG
- David Guillon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for ultrasonic welding with particles trapping
- Patent number 9,975,194
- Issue date May 22, 2018
- ABB Schweiz AG
- Venkatesh Sivasubramaniam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module with ultrasonically welded terminals
- Patent number 9,949,385
- Issue date Apr 17, 2018
- ABB Schweiz AG
- Samuel Hartmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...
- Publication number 20240186199
- Publication date Jun 6, 2024
- David GUILLON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...
- Publication number 20240063080
- Publication date Feb 22, 2024
- Hitachi Energy Switzerland AG
- David GUILLON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...
- Publication number 20230420271
- Publication date Dec 28, 2023
- Hitachi Energy Switzerland AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Substrate Structure for a Semiconductor Power Module
- Publication number 20220344456
- Publication date Oct 27, 2022
- Hitachi Energy Switzerland AG
- David Guillon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Method of Forming the Same
- Publication number 20220246577
- Publication date Aug 4, 2022
- Hitachi Energy Switzerland AG
- David Guillon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Device with Free-Floating Packaging Concept
- Publication number 20210384091
- Publication date Dec 9, 2021
- ABB Power Grids Switzerland AG
- Jagoda Dobrzynska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20200144140
- Publication date May 7, 2020
- ABB Schweiz AG
- Dominik Trüssel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20190363029
- Publication date Nov 28, 2019
- ABB Schweiz AG
- David Guillon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Power Electronics Module For Subsea Applications
- Publication number 20170365535
- Publication date Dec 21, 2017
- ABB Schweiz AG
- David Guillon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GENERATING A POWER SEMICONDUCTOR MODULE
- Publication number 20170323801
- Publication date Nov 9, 2017
- ABB Schweiz AG
- Venkatesh Sivasubramaniam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ULTRASONIC WELDING WITH PARTICLES TRAPPING
- Publication number 20160193678
- Publication date Jul 7, 2016
- ABB TECHNOLOGY AG
- Venkatesh Sivasubramaniam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE WITH ULTRASONICALLY WELDED TERMINALS
- Publication number 20160007485
- Publication date Jan 7, 2016
- ABB TECHNOLOGY AG
- Samuel HARTMANN
- H01 - BASIC ELECTRIC ELEMENTS

David GUILLON

Person

Patents Grantslast 30 patents

Metal substrate structure for a semiconductor power module

Power semiconductor device with free-floating packaging concept

Power semiconductor module embedded in a mold compounded with an op...

Power semiconductor module

High voltage power electronics module for subsea applications under...

Method for ultrasonic welding with particles trapping

Semiconductor module with ultrasonically welded terminals

Patents Applicationslast 30 patents

SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...

SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...

SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...

Metal Substrate Structure for a Semiconductor Power Module

Power Semiconductor Module and Method of Forming the Same

Power Semiconductor Device with Free-Floating Packaging Concept

POWER SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE

High Voltage Power Electronics Module For Subsea Applications

METHOD OF GENERATING A POWER SEMICONDUCTOR MODULE

METHOD FOR ULTRASONIC WELDING WITH PARTICLES TRAPPING

SEMICONDUCTOR MODULE WITH ULTRASONICALLY WELDED TERMINALS