David Hockanson

Person

Boulder Creek, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power integrity circuits with EMI benefits
- Patent number 8,514,549
- Issue date Aug 20, 2013
- Oracle America, Inc.
- David Hockanson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power integrity circuits with EMI benefits
- Patent number 7,969,712
- Issue date Jun 28, 2011
- Oracle America, Inc.
- Leesa Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect design for reducing radiated emissions
- Patent number 7,411,283
- Issue date Aug 12, 2008
- Sun Microsystems, Inc.
- David M. Hockanson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dispersive interconnect system for EMI reduction
- Patent number 7,265,993
- Issue date Sep 4, 2007
- Sun Microsystems, Inc.
- Rodney D. Slone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
EMI grounding pins for CPU/ASIC chips
- Patent number 6,956,285
- Issue date Oct 18, 2005
- Sun Microsystems, Inc.
- Sergiu Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding apparatus
- Patent number 6,944,025
- Issue date Sep 13, 2005
- Sun Microsystems, Inc.
- David M. Hockanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for determining the required decoupling capacitor...
- Patent number 6,850,878
- Issue date Feb 1, 2005
- Sun Microsystems, Inc.
- Larry D. Smith
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package with EMI containment features
- Patent number 6,573,590
- Issue date Jun 3, 2003
- Sun Microsystems, Inc.
- Sergiu Radu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER INTEGRITY CIRCUITS WITH EMI BENEFITS
- Publication number 20110164392
- Publication date Jul 7, 2011
- David Hockanson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER INTEGRITY CIRCUITS WITH EMI BENEFITS
- Publication number 20080259521
- Publication date Oct 23, 2008
- SUN MICROSYSTEMS, INC.
- David Hockanson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect design for reducing radiated emissions
- Publication number 20070188997
- Publication date Aug 16, 2007
- SUN MICROSYSTEMS, INC.
- David M. Hockanson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMI grounding pins for CPU/ASIC chips
- Publication number 20040135238
- Publication date Jul 15, 2004
- Sergiu Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI shield for an integrated circuit
- Publication number 20040062020
- Publication date Apr 1, 2004
- Winnie C. Leung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMI shielding apparatus
- Publication number 20040037042
- Publication date Feb 26, 2004
- David M. Hockanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for determining the required decoupling capacitor...
- Publication number 20020169590
- Publication date Nov 14, 2002
- Larry D. Smith
- G06 - COMPUTING CALCULATING COUNTING

David Hockanson

Person

Patents Grantslast 30 patents

Power integrity circuits with EMI benefits

Power integrity circuits with EMI benefits

Interconnect design for reducing radiated emissions

Dispersive interconnect system for EMI reduction

EMI grounding pins for CPU/ASIC chips

EMI shielding apparatus

System and method for determining the required decoupling capacitor...

Integrated circuit package with EMI containment features

Patents Applicationslast 30 patents

POWER INTEGRITY CIRCUITS WITH EMI BENEFITS

POWER INTEGRITY CIRCUITS WITH EMI BENEFITS

Interconnect design for reducing radiated emissions

EMI grounding pins for CPU/ASIC chips

EMI shield for an integrated circuit

EMI shielding apparatus

System and method for determining the required decoupling capacitor...