David J. Collins

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Pelham, NH, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of back cutting silicon wafers during a dicing procedure
- Patent number 5,668,061
- Issue date Sep 16, 1997
- Xerox Corporation
- Lawrence H. Herko
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for bonding wafer pairs
- Patent number 5,545,283
- Issue date Aug 13, 1996
- Xerox Corporation
- David J. Collins
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of fabricating ink jet printheads
- Patent number 5,368,683
- Issue date Nov 29, 1994
- Xerox Corporation
- Robert P. Altavela
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Hydrophobic coating for a front face of a printhead in an ink jet p...
- Patent number 5,218,381
- Issue date Jun 8, 1993
- Xerox Corporation
- Ram S. Narang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for forming buried oxygen precipitate layers i...
- Publication number 20060115958
- Publication date Jun 1, 2006
- Jason W. Weigold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS device with alternative electrical connections
- Publication number 20040104444
- Publication date Jun 3, 2004
- Bruce K. Wachtmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY