David J. Dougherty

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 12,087,671
- Issue date Sep 10, 2024
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier packages and systems incorporating design-flexible...
- Patent number 11,621,673
- Issue date Apr 4, 2023
- NXP USA, INC.
- Jean-Christophe Nanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier devices containing frontside heat extraction struct...
- Patent number 11,196,390
- Issue date Dec 7, 2021
- NXP USA, INC.
- Edward Christian Mares
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier packages containing peripherally-encapsulated dies...
- Patent number 11,128,268
- Issue date Sep 21, 2021
- NXP USA, INC.
- Sharan Kishore
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 10,998,255
- Issue date May 4, 2021
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package design providing reduced electromagnetic coup...
- Patent number 10,573,594
- Issue date Feb 25, 2020
- NXP USA, INC.
- Peter H. Aaen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package design providing reduced electromagnetic coup...
- Patent number 9,312,817
- Issue date Apr 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Peter H. Aaen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Die assemblies
- Patent number 7,989,951
- Issue date Aug 2, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Betty H. Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical die singulation technique
- Patent number 7,332,414
- Issue date Feb 19, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress semiconductor die attach
- Patent number 7,042,103
- Issue date May 9, 2006
- Motorola, Inc.
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly for an electronic component
- Patent number 5,889,658
- Issue date Mar 30, 1999
- Motorola, Inc.
- Paul L. Sullivan
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a package assembly
- Patent number 5,659,950
- Issue date Aug 26, 1997
- Motorola, Inc.
- Victor J. Adams
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
POWER AMPLIFIER DEVICES CONTAINING FRONTSIDE HEAT EXTRACTION STRUCT...
- Publication number 20210336585
- Publication date Oct 28, 2021
- NXP USA, Inc.
- Edward Christian Mares
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...
- Publication number 20210217685
- Publication date Jul 15, 2021
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES AND SYSTEMS INCORPORATING DESIGN-FLEXIBLE...
- Publication number 20200328721
- Publication date Oct 15, 2020
- NXP USA, Inc.
- Jean-Christophe Nanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...
- Publication number 20200020614
- Publication date Jan 16, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DESIGN PROVIDING REDUCED ELECTROMAGNETIC COUP...
- Publication number 20160225713
- Publication date Aug 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Peter H. Aaen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DESIGN PROVIDING REDUCED ELECTROMAGNETIC COUP...
- Publication number 20140022020
- Publication date Jan 23, 2014
- Peter H. Aaen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ASSEMBLIES
- Publication number 20100142168
- Publication date Jun 10, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Betty H. Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage-reducing packaging design
- Publication number 20070175660
- Publication date Aug 2, 2007
- Betty H. Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical die singulation technique
- Publication number 20060292827
- Publication date Dec 28, 2006
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low stress semiconductor die attach
- Publication number 20040124543
- Publication date Jul 1, 2004
- MOTOROLA INC.
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS

David J. Dougherty

Person

Patents Grantslast 30 patents

Overmolded microelectronic packages containing knurled flanges and...

Power amplifier packages and systems incorporating design-flexible...

Power amplifier devices containing frontside heat extraction struct...

Power amplifier packages containing peripherally-encapsulated dies...

Overmolded microelectronic packages containing knurled flanges and...

Semiconductor package design providing reduced electromagnetic coup...

Semiconductor package design providing reduced electromagnetic coup...

Die assemblies

Chemical die singulation technique

Low stress semiconductor die attach

Package assembly for an electronic component

Method of forming a package assembly

Patents Applicationslast 30 patents

POWER AMPLIFIER DEVICES CONTAINING FRONTSIDE HEAT EXTRACTION STRUCT...

OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...

POWER AMPLIFIER PACKAGES AND SYSTEMS INCORPORATING DESIGN-FLEXIBLE...

OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...

SEMICONDUCTOR PACKAGE DESIGN PROVIDING REDUCED ELECTROMAGNETIC COUP...

SEMICONDUCTOR PACKAGE DESIGN PROVIDING REDUCED ELECTROMAGNETIC COUP...

DIE ASSEMBLIES

Warpage-reducing packaging design

Chemical die singulation technique

Low stress semiconductor die attach