David J. Lewison

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Coolant-cooled heat sink(s) with associated ultra-violet light asse...
- Patent number 12,005,148
- Issue date Jun 11, 2024
- International Business Machines Corporation
- Hongqing Zhang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
High power device fault localization via die surface contouring
- Patent number 11,940,271
- Issue date Mar 26, 2024
- International Business Machines Corporation
- David J. Lewison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-respondent assemblies with porous heat transfer element(s)
- Patent number 11,716,808
- Issue date Aug 1, 2023
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Non-destructive bond line thickness measurement of thermal interfac...
- Patent number 11,614,324
- Issue date Mar 28, 2023
- International Business Machines Corporation
- Hongqing Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid/heat spreader having targeted flexibility
- Patent number 11,430,710
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal integrated circuit (IC) device package lid
- Patent number 11,158,562
- Issue date Oct 26, 2021
- International Business Machines Corporation
- David J. Lewison
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Coolant-cooled heat sinks with internal thermally-conductive fins j...
- Patent number 11,156,409
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fabricating coolant-cooled heat sinks with internal thermally-condu...
- Patent number 10,842,043
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Hongqing Zhang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Selectively soluble standoffs for chip joining
- Patent number 9,673,177
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSE...
- Publication number 20220347327
- Publication date Nov 3, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)
- Publication number 20220192011
- Publication date Jun 16, 2022
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HIGH POWER DEVICE FAULT LOCALIZATION VIA DIE SURFACE CONTOURING
- Publication number 20220155049
- Publication date May 19, 2022
- International Business Machines Corporation
- David J. Lewison
- G01 - MEASURING TESTING
Information Patent Application
Conformal Integrated Circuit (IC) Device Package Lid
- Publication number 20210249333
- Publication date Aug 12, 2021
- International Business Machines Corporation
- David J. Lewison
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY
- Publication number 20210233825
- Publication date Jul 29, 2021
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS J...
- Publication number 20210222956
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Hongqing ZHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
NON-DESTRUCTIVE BOND LINE THICKNESS MEASUREMENT OF THERMAL INTERFAC...
- Publication number 20210123729
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Hongqing Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY SOLUBLE STANDOFFS FOR CHIP JOINING
- Publication number 20170170148
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS

David J. Lewison

Person

Patents Grantslast 30 patents

Coolant-cooled heat sink(s) with associated ultra-violet light asse...

High power device fault localization via die surface contouring

Tamper-respondent assemblies with porous heat transfer element(s)

Non-destructive bond line thickness measurement of thermal interfac...

Lid/heat spreader having targeted flexibility

Conformal integrated circuit (IC) device package lid

Coolant-cooled heat sinks with internal thermally-conductive fins j...

Fabricating coolant-cooled heat sinks with internal thermally-condu...

Selectively soluble standoffs for chip joining

Patents Applicationslast 30 patents

COOLANT-COOLED HEAT SINK(S) WITH ASSOCIATED ULTRA-VIOLET LIGHT ASSE...

TAMPER-RESPONDENT ASSEMBLIES WITH POROUS HEAT TRANSFER ELEMENT(S)

HIGH POWER DEVICE FAULT LOCALIZATION VIA DIE SURFACE CONTOURING

Conformal Integrated Circuit (IC) Device Package Lid

LID/HEAT SPREADER HAVING TARGETED FLEXIBILITY

COOLANT-COOLED HEAT SINKS WITH INTERNAL THERMALLY-CONDUCTIVE FINS J...

NON-DESTRUCTIVE BOND LINE THICKNESS MEASUREMENT OF THERMAL INTERFAC...

SELECTIVELY SOLUBLE STANDOFFS FOR CHIP JOINING