David J. Lischka

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing system with contactless platen edge control
- Patent number 11,919,120
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- David J. Lischka
- B24 - GRINDING POLISHING
Information Patent Grant
Peak-based endpointing for chemical mechanical polishing
- Patent number 9,799,578
- Issue date Oct 24, 2017
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Peak-based endpointing for chemical mechanical polishing
- Patent number 9,564,377
- Issue date Feb 7, 2017
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Path for probe of spectrographic metrology system
- Patent number 9,056,383
- Issue date Jun 16, 2015
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatus for sensing a substrate in a load cup
- Patent number 9,013,176
- Issue date Apr 21, 2015
- Applied Materials, Inc.
- David J. Lischka
- G01 - MEASURING TESTING
Information Patent Grant
Load cup substrate sensing
- Patent number 8,734,202
- Issue date May 27, 2014
- Applied Materials, Inc.
- David James Lischka
- B24 - GRINDING POLISHING
Information Patent Grant
Peak-based endpointing for chemical mechanical polishing
- Patent number 8,591,698
- Issue date Nov 26, 2013
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Load cup substrate sensing
- Patent number 8,454,408
- Issue date Jun 4, 2013
- Applied Materials, Inc.
- David James Lischka
- B24 - GRINDING POLISHING
Information Patent Grant
Reducing polishing pad deformation
- Patent number 8,287,330
- Issue date Oct 16, 2012
- Applied Materials, Inc.
- Doyle E. Bennett
- B24 - GRINDING POLISHING
Information Patent Grant
Peak-based endpointing for chemical mechanical polishing
- Patent number 7,998,358
- Issue date Aug 16, 2011
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Reducing polishing pad deformation
- Patent number 7,621,798
- Issue date Nov 24, 2009
- Applied Materials, Inc.
- Doyle E. Bennett
- B24 - GRINDING POLISHING
Information Patent Grant
Sealed polishing pad, system and methods
- Patent number 7,210,980
- Issue date May 1, 2007
- Applied Materials, Inc.
- Bogdan Swedek
- B24 - GRINDING POLISHING
Information Patent Grant
System with sealed polishing pad
- Patent number 7,163,437
- Issue date Jan 16, 2007
- Applied Materials, Inc.
- Bogdan Swedek
- B24 - GRINDING POLISHING
Information Patent Grant
Sealed polishing pad methods
- Patent number 7,112,119
- Issue date Sep 26, 2006
- Applied Materials, Inc.
- Bogdan Swedek
- B24 - GRINDING POLISHING
Information Patent Grant
Load cup for chemical mechanical polishing
- Patent number 7,044,832
- Issue date May 16, 2006
- Applied Materials
- Alpay Yilmaz
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioning mechanism for chemical mechanical polishing
- Patent number 6,905,399
- Issue date Jun 14, 2005
- Applied Materials, Inc.
- David J. Lischka
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR UPPER PLATEN MANUFACTURING
- Publication number 20240307963
- Publication date Sep 19, 2024
- Applied Materials, Inc.
- Ximeng XUE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONTROL OF CARRIER HEAD SWEEP AND PLATEN SHAPE
- Publication number 20240139906
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD WITH LOCAL INNER RING DOWNFORCE CONTROL
- Publication number 20230356355
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SYSTEM WITH CONTACTLESS PLATEN EDGE CONTROL
- Publication number 20220266413
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- David J. Lischka
- B24 - GRINDING POLISHING
Information Patent Application
PLATEN ASSEMBLY AND METHOD OF ASSEMBLING A PLATEN ASSEMBLY
- Publication number 20200101576
- Publication date Apr 2, 2020
- Applied Materials, Inc.
- Jay GURUSAMY
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF IDENTIFYING AND TRACKING ROLL TO ROLL POLISHING PAD MATER...
- Publication number 20190030677
- Publication date Jan 31, 2019
- Applied Materials, Inc.
- Jeonghoon OH
- B24 - GRINDING POLISHING
Information Patent Application
PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20170092551
- Publication date Mar 30, 2017
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATH FOR PROBE OF SPECTROGRAPHIC METROLOGY SYSTEM
- Publication number 20140242879
- Publication date Aug 28, 2014
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Application
DETERMINATION OF WAFER ANGULAR POSITION FOR IN-SEQUENCE METROLOGY
- Publication number 20140242883
- Publication date Aug 28, 2014
- Applied Materials, Inc.
- Benjamin Cherian
- B24 - GRINDING POLISHING
Information Patent Application
PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20140080232
- Publication date Mar 20, 2014
- Applied Materials, Inc.
- Dominic J. Benvegnu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD CUP SUBSTRATE SENSING
- Publication number 20130260646
- Publication date Oct 3, 2013
- Applied Materials, Inc.
- David James LISCHKA
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND APPARATUS FOR SENSING A SUBSTRATE IN A LOAD CUP
- Publication number 20130193956
- Publication date Aug 1, 2013
- Applied Materials, Inc.
- David J. Lischka
- G01 - MEASURING TESTING
Information Patent Application
PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20110287694
- Publication date Nov 24, 2011
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
LOAD CUP SUBSTRATE SENSING
- Publication number 20100130102
- Publication date May 27, 2010
- Applied Materials, Inc.
- David James Lischka
- B24 - GRINDING POLISHING
Information Patent Application
PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20080099443
- Publication date May 1, 2008
- APPLIED MATERIALS, INC.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Application
SEALED POLISHING PAD, SYSTEM AND METHODS
- Publication number 20070049167
- Publication date Mar 1, 2007
- APPLIED MATERIALS, INC.
- Bogdan Swedek
- B24 - GRINDING POLISHING
Information Patent Application
Load cup for chemical mechanical polishing
- Publication number 20050176349
- Publication date Aug 11, 2005
- APPLIED MATERIALS, INC.
- Alpay Yilmaz
- B24 - GRINDING POLISHING
Information Patent Application
Conditioning mechanism for chemical mechanical polishing
- Publication number 20040203326
- Publication date Oct 14, 2004
- APPLIED MATERIALS, INC.
- David J. Lischka
- B24 - GRINDING POLISHING

David J. Lischka

Person

Patents Grantslast 30 patents

Polishing system with contactless platen edge control

Peak-based endpointing for chemical mechanical polishing

Peak-based endpointing for chemical mechanical polishing

Path for probe of spectrographic metrology system

Methods and apparatus for sensing a substrate in a load cup

Load cup substrate sensing

Peak-based endpointing for chemical mechanical polishing

Load cup substrate sensing

Reducing polishing pad deformation

Peak-based endpointing for chemical mechanical polishing

Reducing polishing pad deformation

Sealed polishing pad, system and methods

System with sealed polishing pad

Sealed polishing pad methods

Load cup for chemical mechanical polishing

Conditioning mechanism for chemical mechanical polishing

Patents Applicationslast 30 patents

METHODS FOR UPPER PLATEN MANUFACTURING

CONTROL OF CARRIER HEAD SWEEP AND PLATEN SHAPE

POLISHING HEAD WITH LOCAL INNER RING DOWNFORCE CONTROL

POLISHING SYSTEM WITH CONTACTLESS PLATEN EDGE CONTROL

PLATEN ASSEMBLY AND METHOD OF ASSEMBLING A PLATEN ASSEMBLY

METHOD OF IDENTIFYING AND TRACKING ROLL TO ROLL POLISHING PAD MATER...

PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING

PATH FOR PROBE OF SPECTROGRAPHIC METROLOGY SYSTEM

DETERMINATION OF WAFER ANGULAR POSITION FOR IN-SEQUENCE METROLOGY

PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING

LOAD CUP SUBSTRATE SENSING

METHODS AND APPARATUS FOR SENSING A SUBSTRATE IN A LOAD CUP

PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING

LOAD CUP SUBSTRATE SENSING

PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING

SEALED POLISHING PAD, SYSTEM AND METHODS

Load cup for chemical mechanical polishing

Conditioning mechanism for chemical mechanical polishing