David J. Llapitan

Person

Tacoma, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Rework grid array interposer with direct power
- Patent number 10,211,120
- Issue date Feb 19, 2019
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket loading element and associated techniques and configurations
- Patent number 9,848,510
- Issue date Dec 19, 2017
- Intel Corporation
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CPU package substrates with removable memory mechanical interfaces
- Patent number 9,832,876
- Issue date Nov 28, 2017
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact protection for integrated circuit device loading
- Patent number 9,681,556
- Issue date Jun 13, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly that includes a plurality of electronic packages
- Patent number 9,603,276
- Issue date Mar 21, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-array bottom-side connector using spring bias
- Patent number 9,490,560
- Issue date Nov 8, 2016
- Intel Corporation
- Gaurav Chawla
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector assembly and method
- Patent number 9,385,457
- Issue date Jul 5, 2016
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit connectors
- Patent number 9,265,170
- Issue date Feb 16, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector assembly and method
- Patent number 8,905,794
- Issue date Dec 9, 2014
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two piece wire bale independent load mechanism
- Patent number 8,081,489
- Issue date Dec 20, 2011
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unified retention mechanism for CPU/socket loading and thermal solu...
- Patent number 7,988,459
- Issue date Aug 2, 2011
- Intel Corporation
- Neal Ulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bale independent load mechanism
- Patent number 7,867,003
- Issue date Jan 11, 2011
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies with high capacity heat sinks and methods of...
- Patent number 7,200,934
- Issue date Apr 10, 2007
- Intel Corporation
- Daniel P. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Captive socket actuator
- Patent number 7,050,302
- Issue date May 23, 2006
- Intel Corporation
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention mechanism for an electrical assembly
- Patent number 6,722,908
- Issue date Apr 20, 2004
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies with high capacity curved fin heat sinks
- Patent number 6,671,172
- Issue date Dec 30, 2003
- Intel Corporation
- Daniel P. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention mechanism for an electrical assembly
- Patent number 6,585,534
- Issue date Jul 1, 2003
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retention mechanism and electronic module mounting system
- Patent number 6,327,147
- Issue date Dec 4, 2001
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retention mechanism that can be used with different electronic asse...
- Patent number 6,159,031
- Issue date Dec 12, 2000
- Intel Corporation
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20180007791
- Publication date Jan 4, 2018
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework grid array interposer with direct power
- Publication number 20170186661
- Publication date Jun 29, 2017
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190716
- Publication date Jun 30, 2016
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190717
- Publication date Jun 30, 2016
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
- Publication number 20160183375
- Publication date Jun 23, 2016
- Intel Corporation
- Vijaykumar Krithivasan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS
- Publication number 20160181714
- Publication date Jun 23, 2016
- Intel Corporation
- GAURAV CHAWLA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20160183374
- Publication date Jun 23, 2016
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD
- Publication number 20150249298
- Publication date Sep 3, 2015
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONNECTORS
- Publication number 20150118870
- Publication date Apr 30, 2015
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR ASSEMBLY AND METHOD
- Publication number 20140162475
- Publication date Jun 12, 2014
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PROTECTION FOR INTEGRATED CIRCUIT DEVICE LOADING
- Publication number 20140092573
- Publication date Apr 3, 2014
- David J. LLAPITAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Unified retention mechanism for CPU/socket Loading and thermal solu...
- Publication number 20100330824
- Publication date Dec 30, 2010
- Neal Ulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BALE INDEPENDENT LOAD MECHANISM
- Publication number 20100159730
- Publication date Jun 24, 2010
- David J. LLAPITAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO PIECE WIRE BALE INDEPENDENT LOAD MECHANISM
- Publication number 20100157563
- Publication date Jun 24, 2010
- David J. LLAPITAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid cooling system
- Publication number 20060067052
- Publication date Mar 30, 2006
- David J. Llapitan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Captive socket actuator
- Publication number 20050243525
- Publication date Nov 3, 2005
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assemblies with high capacity heat sinks
- Publication number 20040080914
- Publication date Apr 29, 2004
- Intel Corporation
- Daniel P. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assemblies with high capacity heat sinks and methods of...
- Publication number 20040045163
- Publication date Mar 11, 2004
- Intel Corporation
- Daniel P. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Retention mechanism for an electrical assembly
- Publication number 20030096524
- Publication date May 22, 2003
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLIES WITH HIGH CAPACITY CURVED FIN HEAT SINKS
- Publication number 20030048612
- Publication date Mar 13, 2003
- Intel Corporation
- Daniel P. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETENTION MECHANISM FOR AN ELECTRICAL ASSEMBLY
- Publication number 20010019913
- Publication date Sep 6, 2001
- DAVID J. LLAPITAN
- H01 - BASIC ELECTRIC ELEMENTS

David J. Llapitan

Person

Patents Grantslast 30 patents

Rework grid array interposer with direct power

Socket loading element and associated techniques and configurations

CPU package substrates with removable memory mechanical interfaces

Contact protection for integrated circuit device loading

Electronic assembly that includes a plurality of electronic packages

Multi-array bottom-side connector using spring bias

Connector assembly and method

Integrated circuit connectors

Connector assembly and method

Two piece wire bale independent load mechanism

Unified retention mechanism for CPU/socket loading and thermal solu...

Wire bale independent load mechanism

Electronic assemblies with high capacity heat sinks and methods of...

Captive socket actuator

Retention mechanism for an electrical assembly

Electronic assemblies with high capacity curved fin heat sinks

Retention mechanism for an electrical assembly

Retention mechanism and electronic module mounting system

Retention mechanism that can be used with different electronic asse...

Patents Applicationslast 30 patents

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

Rework grid array interposer with direct power

SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES

ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES

SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS

MULTI-ARRAY BOTTOM-SIDE CONNECTOR USING SPRING BIAS

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

CONNECTOR ASSEMBLY AND METHOD

INTEGRATED CIRCUIT CONNECTORS

CONNECTOR ASSEMBLY AND METHOD

CONTACT PROTECTION FOR INTEGRATED CIRCUIT DEVICE LOADING

Unified retention mechanism for CPU/socket Loading and thermal solu...

WIRE BALE INDEPENDENT LOAD MECHANISM

TWO PIECE WIRE BALE INDEPENDENT LOAD MECHANISM

Liquid cooling system

Captive socket actuator

Electronic assemblies with high capacity heat sinks

Electronic assemblies with high capacity heat sinks and methods of...

Retention mechanism for an electrical assembly

ELECTRONIC ASSEMBLIES WITH HIGH CAPACITY CURVED FIN HEAT SINKS

RETENTION MECHANISM FOR AN ELECTRICAL ASSEMBLY