David Kaz

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Oakland, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for edge-of-wafer inspection and review
- Patent number 10,770,258
- Issue date Sep 8, 2020
- KLA-Tencor Corporation
- Xinrong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for edge-of-wafer inspection and review
- Patent number 10,056,224
- Issue date Aug 21, 2018
- KLA-Tencor Corporation
- Xinrong Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and System for Edge-of-Wafer Inspection and Review
- Publication number 20190006143
- Publication date Jan 3, 2019
- KLA-Tencor Corporation
- Xinrong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Edge-of-Wafer Inspection and Review
- Publication number 20170047193
- Publication date Feb 16, 2017
- KLA-Tencor Corporation
- Xinrong Jiang
- H01 - BASIC ELECTRIC ELEMENTS