David L. Edwards

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling system with integrated fill and drain pump
- Patent number 10,660,239
- Issue date May 19, 2020
- International Business Machines Corporation
- David L. Edwards
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Cooling system with integrated fill and drain pump
- Patent number 9,918,409
- Issue date Mar 13, 2018
- International Business Machines Corporation
- David L. Edwards
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system with integrated fill and drain pump
- Patent number 9,861,013
- Issue date Jan 2, 2018
- International Business Machines Corporation
- David L. Edwards
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid-cooled heat sink configured to facilitate drainage
- Patent number 9,743,562
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Frank M. Desiano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid-cooled heat sink configured to facilitate drainage
- Patent number 9,743,561
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Frank M. Desiano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System to improve an in-line memory module
- Patent number 9,537,237
- Issue date Jan 3, 2017
- International Business Machines Corporation
- Mark A. Brandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-cooled heat sink configured to facilitate drainage
- Patent number 9,420,728
- Issue date Aug 16, 2016
- International Business Machines Corporation
- Frank M. Desiano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Customized thermal interface to optimize mechanical loading and the...
- Patent number 8,582,297
- Issue date Nov 12, 2013
- International Business Machines Corporation
- David L. Edwards
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,531,025
- Issue date Sep 10, 2013
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System to improve an in-line memory module
- Patent number 8,248,805
- Issue date Aug 21, 2012
- International Business Machines Corporation
- Mark A. Brandon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlling power change for a semiconductor module to preserve the...
- Patent number 8,046,616
- Issue date Oct 25, 2011
- International Business Machines Corporation
- David L. Edwards
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,021,925
- Issue date Sep 20, 2011
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solder interconnection array with optimal mechanical integrity
- Patent number 7,900,809
- Issue date Mar 8, 2011
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lid edge capping load
- Patent number 7,733,655
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Martin Beaumier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to improve thermal dissipation from semiconduc...
- Patent number 7,724,527
- Issue date May 25, 2010
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pillow
- Patent number 7,709,951
- Issue date May 4, 2010
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package having automated tolerance compensation
- Patent number 7,687,894
- Issue date Mar 30, 2010
- International Business Machines Corporation
- John S. Corbin, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to provide balanced mechanical loading of devi...
- Patent number 7,518,235
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to improve thermal dissipation from semiconduc...
- Patent number 7,468,886
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming anisotropic heat spreading apparatus for semicond...
- Patent number 7,464,462
- Issue date Dec 16, 2008
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder interconnection array with optimal mechanical integrity
- Patent number 7,445,141
- Issue date Nov 4, 2008
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface apparatus
- Patent number 7,440,281
- Issue date Oct 21, 2008
- Apple Inc.
- Sean Ashley Bailey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board cam-action standoff connector
- Patent number 7,394,666
- Issue date Jul 1, 2008
- International Business Machines Corporation
- David L. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling power change for a semiconductor module
- Patent number 7,376,852
- Issue date May 20, 2008
- International Business Machines Corporation
- David L. Edwards
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Anisotropic heat spreading apparatus and method for semiconductor d...
- Patent number 7,328,508
- Issue date Feb 12, 2008
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 7,268,428
- Issue date Sep 11, 2007
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package having chip extension and method
- Patent number 7,250,576
- Issue date Jul 31, 2007
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexure plate for maintaining contact between a cooling plate/heat...
- Patent number 7,239,516
- Issue date Jul 3, 2007
- International Business Machines Corporation
- David C. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expandable standoff connector with slit collar and related method
- Patent number 7,086,896
- Issue date Aug 8, 2006
- International Business Machines Corporation
- David L. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluidic cooling systems and methods for electronic components
- Patent number 7,079,393
- Issue date Jul 18, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLING SYSTEM WITH INTEGRATED FILL AND DRAIN PUMP
- Publication number 20180084676
- Publication date Mar 22, 2018
- International Business Machines Corporation
- David L. EDWARDS
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
LIQUID-COOLED HEAT SINK CONFIGURED TO FACILITATE DRAINAGE
- Publication number 20160295747
- Publication date Oct 6, 2016
- International Business Machines Corporation
- Frank M. DESIANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLED HEAT SINK CONFIGURED TO FACILITATE DRAINAGE
- Publication number 20160295748
- Publication date Oct 6, 2016
- International Business Machines Corporation
- Frank M. DESIANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM WITH INTEGRATED FILL AND DRAIN PUMP
- Publication number 20160242319
- Publication date Aug 18, 2016
- International Business Machines Corporation
- David L. EDWARDS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM WITH INTEGRATED FILL AND DRAIN PUMP
- Publication number 20160242326
- Publication date Aug 18, 2016
- International Business Machines Corporation
- David L. EDWARDS
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
LIQUID-COOLED HEAT SINK CONFIGURED TO FACILITATE DRAINAGE
- Publication number 20150296659
- Publication date Oct 15, 2015
- International Business Machines Corporation
- Frank M. DESIANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE
- Publication number 20140098482
- Publication date Apr 10, 2014
- International Business Machines Corporation
- Mark A. Brandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING A MULTI-CHIP ELECTRONIC MODULE
- Publication number 20130033820
- Publication date Feb 7, 2013
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR MULTI-CHIP MODULES
- Publication number 20130027885
- Publication date Jan 31, 2013
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOMIZED THERMAL INTERFACE TO OPTIMIZE MECHANICAL LOADING AND THE...
- Publication number 20120199333
- Publication date Aug 9, 2012
- International Business Machines Corporation
- David L. Edwards
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE
- Publication number 20120200997
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Mark A. Brandon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE
- Publication number 20110069456
- Publication date Mar 24, 2011
- International Business Machines Corporation
- Mark A. Brandon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mechanical Barrier Element for Improved Thermal Reliability of Elec...
- Publication number 20110042784
- Publication date Feb 24, 2011
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID EDGE CAPPING LOAD
- Publication number 20100020503
- Publication date Jan 28, 2010
- International Business Machines Corporation
- MARTIN BEAUMIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...
- Publication number 20080310117
- Publication date Dec 18, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20080299707
- Publication date Dec 4, 2008
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY
- Publication number 20080261350
- Publication date Oct 23, 2008
- International Business Machines Corporation
- Glenn G. Daves
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR
- Publication number 20080232072
- Publication date Sep 25, 2008
- David L. Edwards
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL PILLOW
- Publication number 20080225484
- Publication date Sep 18, 2008
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...
- Publication number 20080218971
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING POWER CHANGE FOR A SEMICONDUCTOR MODULE
- Publication number 20080178028
- Publication date Jul 24, 2008
- David L. Edwards
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IC CHIP PACKAGE HAVING AUTOMATED TOLERANCE COMPENSATION
- Publication number 20080073765
- Publication date Mar 27, 2008
- International Business Machines Corporation
- John S. Corbin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC HEAT SPREADING APPARATUS AND METHOD FOR SEMICONDUCTOR D...
- Publication number 20080030960
- Publication date Feb 7, 2008
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT OF ARRAY OF ELECTRICAL INTERCONNECT TO INCREASE I/O DENSITY...
- Publication number 20080029910
- Publication date Feb 7, 2008
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20070222064
- Publication date Sep 27, 2007
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal interface apparatus
- Publication number 20070177367
- Publication date Aug 2, 2007
- Apple Computer, Inc.
- Sean Ashley Bailey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20070045819
- Publication date Mar 1, 2007
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC HEAT SPREADING APPARATUS AND METHOD FOR SEMICONDUCTOR D...
- Publication number 20070009687
- Publication date Jan 11, 2007
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING CHIP EXTENSION AND METHOD
- Publication number 20060261467
- Publication date Nov 23, 2006
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO PROVIDE BALANCED MECHANICAL LOADING OF DEVI...
- Publication number 20060202325
- Publication date Sep 14, 2006
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS

David L. Edwards

Person

Patents Grantslast 30 patents

Cooling system with integrated fill and drain pump

Cooling system with integrated fill and drain pump

Cooling system with integrated fill and drain pump

Liquid-cooled heat sink configured to facilitate drainage

Liquid-cooled heat sink configured to facilitate drainage

System to improve an in-line memory module

Liquid-cooled heat sink configured to facilitate drainage

Customized thermal interface to optimize mechanical loading and the...

Thermal paste containment for semiconductor modules

System to improve an in-line memory module

Controlling power change for a semiconductor module to preserve the...

Thermal paste containment for semiconductor modules

Solder interconnection array with optimal mechanical integrity

Lid edge capping load

Method and structure to improve thermal dissipation from semiconduc...

Thermal pillow

IC chip package having automated tolerance compensation

Method and structure to provide balanced mechanical loading of devi...

Method and structure to improve thermal dissipation from semiconduc...

Method of forming anisotropic heat spreading apparatus for semicond...

Solder interconnection array with optimal mechanical integrity

Thermal interface apparatus

Circuit board cam-action standoff connector

Method for controlling power change for a semiconductor module

Anisotropic heat spreading apparatus and method for semiconductor d...

Thermal paste containment for semiconductor modules

Chip package having chip extension and method

Flexure plate for maintaining contact between a cooling plate/heat...

Expandable standoff connector with slit collar and related method

Fluidic cooling systems and methods for electronic components

Patents Applicationslast 30 patents

COOLING SYSTEM WITH INTEGRATED FILL AND DRAIN PUMP

LIQUID-COOLED HEAT SINK CONFIGURED TO FACILITATE DRAINAGE

LIQUID-COOLED HEAT SINK CONFIGURED TO FACILITATE DRAINAGE

COOLING SYSTEM WITH INTEGRATED FILL AND DRAIN PUMP

COOLING SYSTEM WITH INTEGRATED FILL AND DRAIN PUMP

LIQUID-COOLED HEAT SINK CONFIGURED TO FACILITATE DRAINAGE

SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE

COOLING A MULTI-CHIP ELECTRONIC MODULE

HEAT SPREADER FOR MULTI-CHIP MODULES

CUSTOMIZED THERMAL INTERFACE TO OPTIMIZE MECHANICAL LOADING AND THE...

SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE

SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE

Mechanical Barrier Element for Improved Thermal Reliability of Elec...

LID EDGE CAPPING LOAD

METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY

CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR

THERMAL PILLOW

METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...

CONTROLLING POWER CHANGE FOR A SEMICONDUCTOR MODULE

IC CHIP PACKAGE HAVING AUTOMATED TOLERANCE COMPENSATION

ANISOTROPIC HEAT SPREADING APPARATUS AND METHOD FOR SEMICONDUCTOR D...

LAYOUT OF ARRAY OF ELECTRICAL INTERCONNECT TO INCREASE I/O DENSITY...

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

Thermal interface apparatus

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

ANISOTROPIC HEAT SPREADING APPARATUS AND METHOD FOR SEMICONDUCTOR D...

CHIP PACKAGE HAVING CHIP EXTENSION AND METHOD

METHOD AND STRUCTURE TO PROVIDE BALANCED MECHANICAL LOADING OF DEVI...