David L. Rath

Person

Stormville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal surface protection
- Patent number 11,857,997
- Issue date Jan 2, 2024
- International Business Machines Corporation
- Ali Afzali-Ardakani
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Microfabricated air bridges for quantum circuits
- Patent number 11,575,077
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Vivekananda P. Adiga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High throughput insulation of 3D in-silicon high volumetric energy...
- Patent number 11,316,154
- Issue date Apr 26, 2022
- International Business Machines Corporation
- John Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive core subtractive liner for metal cut etch processes
- Patent number 11,276,767
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive core subtractive liner for metal cut etch processes
- Patent number 11,152,489
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmon qubits with self defined junctions
- Patent number 11,094,873
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Vivekananda Adiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive core subtractive liner for metal cut etch processes
- Patent number 11,075,281
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch formulation for silicon oxide
- Patent number 11,024,512
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Ali Afzali-Ardakani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low aspect ratio interconnect
- Patent number 10,672,707
- Issue date Jun 2, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with fully aligned vias
- Patent number 10,607,933
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive core subtractive liner for metal cut etch processes
- Patent number 10,600,884
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etch removal of Ru selective to other metals
- Patent number 10,242,909
- Issue date Mar 26, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low aspect ratio interconnect
- Patent number 10,211,153
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with fully aligned vias
- Patent number 10,204,856
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for uniform metal semiconductor alloy formation for front...
- Patent number 10,170,644
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Kathryn C. Fisher
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device formed by wet etch removal of Ru selective to...
- Patent number 10,090,247
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned contact structure
- Patent number 10,074,562
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning magnetic films using self-stop electro-etching
- Patent number 10,049,802
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Eugene J. O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced defect reduction for heteroepitaxy by seed shape engineering
- Patent number 10,043,663
- Issue date Aug 7, 2018
- International Business Machines Corporation
- Cheng-Wei Cheng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Selective and non-selective barrier layer wet removal
- Patent number 10,002,831
- Issue date Jun 19, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with fully aligned vias
- Patent number 9,911,690
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier planarization for interconnect metallization
- Patent number 9,881,833
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective and non-selective barrier layer wet removal
- Patent number 9,806,023
- Issue date Oct 31, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning magnetic films using self-stop electro-etching
- Patent number 9,735,224
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Eugene J. O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective and non-selective barrier layer wet removal
- Patent number 9,685,406
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for uniform metal semiconductor alloy formation for front...
- Patent number 9,608,134
- Issue date Mar 28, 2017
- International Business Machines Corporation
- Kathryn C. Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced defect reduction for heteroepitaxy by seed shape engineering
- Patent number 9,564,494
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Cheng-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact structure
- Patent number 9,548,244
- Issue date Jan 17, 2017
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with fully aligned vias
- Patent number 9,324,650
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact structure
- Patent number 9,252,053
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SACRIFICIAL MATERIAL FACILITATING PROTECTION OF A SUBSTRATE IN A QU...
- Publication number 20220123195
- Publication date Apr 21, 2022
- International Business Machines Corporation
- Vivekananda P. Adiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SURFACE PROTECTION
- Publication number 20210394229
- Publication date Dec 23, 2021
- International Business Machines Corporation
- Ali Afzali-Ardakani
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MICROFABRICATED AIR BRIDGES FOR QUANTUM CIRCUITS
- Publication number 20210217947
- Publication date Jul 15, 2021
- International Business Machines Corporation
- Vivekananda P. Adiga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH THROUGHPUT INSULATION OF 3D IN-SILICON HIGH VOLUMETRIC ENERGY...
- Publication number 20210167370
- Publication date Jun 3, 2021
- International Business Machines Corporation
- John Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMON QUBITS WITH SELF DEFINED JUNCTIONS
- Publication number 20210151659
- Publication date May 20, 2021
- International Business Machines Corporation
- Vivekananda Adiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW ASPECT RATIO INTERCONNECT
- Publication number 20200328156
- Publication date Oct 15, 2020
- Tessera, Inc.
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES
- Publication number 20200083350
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES
- Publication number 20200083349
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS
- Publication number 20190157201
- Publication date May 23, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW ASPECT RATIO INTERCONNECT
- Publication number 20190148296
- Publication date May 16, 2019
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH REMOVAL OF Ru SELECTIVE TO OTHER METALS
- Publication number 20180323151
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES
- Publication number 20180269305
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES
- Publication number 20180269306
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER PLANARIZATION FOR INTERCONNECT METALLIZATION
- Publication number 20180114718
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER PLANARIZATION FOR INTERCONNECT METALLIZATION
- Publication number 20180114719
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING MAGNETIC FILMS USING SELF-STOP ELECTRO-ETCHING
- Publication number 20180102207
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Eugene J. O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS
- Publication number 20180102317
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW ASPECT RATIO INTERCONNECT
- Publication number 20180061761
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AND NON-SELECTIVE BARRIER LAYER WET REMOVAL
- Publication number 20170317026
- Publication date Nov 2, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AND NON-SELECTIVE BARRIER LAYER WET REMOVAL
- Publication number 20170301624
- Publication date Oct 19, 2017
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR UNIFORM METAL SEMICONDUCTOR ALLOY FORMATION FOR FRONT...
- Publication number 20170200838
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Kathryn C. Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED DEFECT REDUCTION FOR HETEROEPITAXY BY SEED SHAPE ENGINEERING
- Publication number 20170140919
- Publication date May 18, 2017
- International Business Machines Corporation
- Cheng-Wei Cheng
- C30 - CRYSTAL GROWTH
Information Patent Application
SELF ALIGNED CONTACT STRUCTURE
- Publication number 20160336266
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Particle removal with minimal etching of silicon-germanium
- Publication number 20160181087
- Publication date Jun 23, 2016
- INTERMOLECULAR INC.
- John Foster
- B08 - CLEANING
Information Patent Application
INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS
- Publication number 20160163640
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIMETAL INTERLAYER INTERCONNECTS
- Publication number 20160071791
- Publication date Mar 10, 2016
- GLOBALFOUNDRIES INC.
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS
- Publication number 20160049364
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT STRUCTURE
- Publication number 20150371948
- Publication date Dec 24, 2015
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCH CHEMISTRY FOR GATE ELECTRODE MATERIALS
- Publication number 20150275376
- Publication date Oct 1, 2015
- International Business Machines Corporation
- John A. Fitzsimmons
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-ALIGNED CONTACT STRUCTURE
- Publication number 20150200137
- Publication date Jul 16, 2015
- International Business Machines Corporation
- Rosa A. Orozco-Teran
- H01 - BASIC ELECTRIC ELEMENTS

David L. Rath

Person

Patents Grantslast 30 patents

Metal surface protection

Microfabricated air bridges for quantum circuits

High throughput insulation of 3D in-silicon high volumetric energy...

Additive core subtractive liner for metal cut etch processes

Additive core subtractive liner for metal cut etch processes

Transmon qubits with self defined junctions

Additive core subtractive liner for metal cut etch processes

Selective etch formulation for silicon oxide

Low aspect ratio interconnect

Interconnect structures with fully aligned vias

Additive core subtractive liner for metal cut etch processes

Wet etch removal of Ru selective to other metals

Low aspect ratio interconnect

Interconnect structures with fully aligned vias

Processes for uniform metal semiconductor alloy formation for front...

Semiconductor device formed by wet etch removal of Ru selective to...

Self aligned contact structure

Patterning magnetic films using self-stop electro-etching

Enhanced defect reduction for heteroepitaxy by seed shape engineering

Selective and non-selective barrier layer wet removal

Interconnect structures with fully aligned vias

Barrier planarization for interconnect metallization

Selective and non-selective barrier layer wet removal

Patterning magnetic films using self-stop electro-etching

Selective and non-selective barrier layer wet removal

Processes for uniform metal semiconductor alloy formation for front...

Enhanced defect reduction for heteroepitaxy by seed shape engineering

Self-aligned contact structure

Interconnect structures with fully aligned vias

Self-aligned contact structure

Patents Applicationslast 30 patents

SACRIFICIAL MATERIAL FACILITATING PROTECTION OF A SUBSTRATE IN A QU...

METAL SURFACE PROTECTION

MICROFABRICATED AIR BRIDGES FOR QUANTUM CIRCUITS

HIGH THROUGHPUT INSULATION OF 3D IN-SILICON HIGH VOLUMETRIC ENERGY...

TRANSMON QUBITS WITH SELF DEFINED JUNCTIONS

LOW ASPECT RATIO INTERCONNECT

ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES

ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES

INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS

LOW ASPECT RATIO INTERCONNECT

WET ETCH REMOVAL OF Ru SELECTIVE TO OTHER METALS

ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES

ADDITIVE CORE SUBTRACTIVE LINER FOR METAL CUT ETCH PROCESSES

BARRIER PLANARIZATION FOR INTERCONNECT METALLIZATION

BARRIER PLANARIZATION FOR INTERCONNECT METALLIZATION

PATTERNING MAGNETIC FILMS USING SELF-STOP ELECTRO-ETCHING

INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS

LOW ASPECT RATIO INTERCONNECT

SELECTIVE AND NON-SELECTIVE BARRIER LAYER WET REMOVAL

SELECTIVE AND NON-SELECTIVE BARRIER LAYER WET REMOVAL

PROCESSES FOR UNIFORM METAL SEMICONDUCTOR ALLOY FORMATION FOR FRONT...

ENHANCED DEFECT REDUCTION FOR HETEROEPITAXY BY SEED SHAPE ENGINEERING

SELF ALIGNED CONTACT STRUCTURE

Particle removal with minimal etching of silicon-germanium

INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS

MULTIMETAL INTERLAYER INTERCONNECTS

INTERCONNECT STRUCTURES WITH FULLY ALIGNED VIAS

SELF-ALIGNED CONTACT STRUCTURE

SELECTIVE ETCH CHEMISTRY FOR GATE ELECTRODE MATERIALS

SELF-ALIGNED CONTACT STRUCTURE