David Lam

Person

  • San Carlos, CA, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110086469
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110087356
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110084371
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110084376
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110087353
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS