David Lee DeWire

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Superior, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
Hermetically sealed electronic packages with electrically powered m...
- Patent number 11,382,224
- Issue date Jul 5, 2022
- PA&E, HERMETIC SOLUTIONS GROUP, LLC
- Hua Xia
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Modular low stress package technology
- Patent number 8,759,965
- Issue date Jun 24, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,639,373
- Issue date Jan 28, 2014
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,560,104
- Issue date Oct 15, 2013
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,283,769
- Issue date Oct 9, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular low stress package technology
- Patent number 8,153,474
- Issue date Apr 10, 2012
- STMicroelectronics, Inc.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HERMETICALLY SEALED ELECTRONIC PACKAGES WITH ELECTRICALLY POWERED M...
- Publication number 20210014986
- Publication date Jan 14, 2021
- PA&E, Hermetic Solutions Group, LLC
- Hua Xia
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110086469
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087356
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084371
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110084376
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR LOW STRESS PACKAGE TECHNOLOGY
- Publication number 20110087353
- Publication date Apr 14, 2011
- STMICROELECTRONICS, INC.
- Craig J. Rotay
- H01 - BASIC ELECTRIC ELEMENTS