David Lee DeWire

Person

  • Superior, CO, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    All-in-on Getters

    • Publication number 20250108356
    • Publication date Apr 3, 2025
    • Hua Xia
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    MULTI-GAS GETTERS

    • Publication number 20250091030
    • Publication date Mar 20, 2025
    • hua Xia
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    Broad-Spectrum HC/VOC Getter for Emission Control in Electronics

    • Publication number 20250073666
    • Publication date Mar 6, 2025
    • hua Xia
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    HERMETICALLY SEALED ELECTRONIC PACKAGES WITH ELECTRICALLY POWERED M...

    • Publication number 20210014986
    • Publication date Jan 14, 2021
    • PA&E, Hermetic Solutions Group, LLC
    • Hua Xia
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110086469
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110087356
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110084371
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110084376
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY

    • Publication number 20110087353
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS