David Leroy Sutton

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Wake Forest, NC, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming via holes in multilayer circuits
- Patent number 5,294,567
- Issue date Mar 15, 1994
- E. I. Du Pont de Nemours and Company
- Jay R. Dorfman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power module
- Publication number 20070284731
- Publication date Dec 13, 2007
- Toyota Jidosha Kabushiki Kaisha
- Takashi Atsumi
- H01 - BASIC ELECTRIC ELEMENTS