David M. Craig

Person

Albany, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Micro electrical mechanical system
- Patent number 8,497,577
- Issue date Jul 30, 2013
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrically connecting substrate with electrical device
- Patent number 7,576,439
- Issue date Aug 18, 2009
- Hewlett-Packard Development Company, L.P.
- David M. Craig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a device package having edge interconnect pad
- Patent number 7,541,209
- Issue date Jun 2, 2009
- Hewlett-Packard Development Company, L.P.
- Charles C Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrically connecting substrate with electrical device
- Patent number 7,476,608
- Issue date Jan 13, 2009
- Hewlett-Packard Development Company, L.P.
- David M. Craig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-optoelectromechanical system packages for a light modulator a...
- Patent number 7,307,773
- Issue date Dec 11, 2007
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Micro electrical mechanical system
- Patent number 7,300,812
- Issue date Nov 27, 2007
- Hewlett-Packard Development Coompany, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembly with a ring and bonding pads formed of a same material on...
- Patent number 7,262,498
- Issue date Aug 28, 2007
- Hewlett-Packard Development Company, L.P.
- David M. Craig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light modulator
- Patent number 7,019,886
- Issue date Mar 28, 2006
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- G02 - OPTICS
Information Patent Grant
Die carrier with fluid chamber
- Patent number 6,917,099
- Issue date Jul 12, 2005
- Hewlett-Packard Development Company, L.P.
- Ronald A. Hellekson
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Electrically Connecting Substrate With Electrical Device
- Publication number 20090014850
- Publication date Jan 15, 2009
- David M. Craig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro Electrical Mechanical System
- Publication number 20080029880
- Publication date Feb 7, 2008
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of forming a device package having edge interconnect pad
- Publication number 20070087462
- Publication date Apr 19, 2007
- Charles C. Haluzak
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrically connecting substrate with electrical device
- Publication number 20070015353
- Publication date Jan 18, 2007
- David M. Craig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-optoelectromechanical system packages for a light modulator a...
- Publication number 20060146426
- Publication date Jul 6, 2006
- Chien-Hua Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Micro electrical mechanical system
- Publication number 20060094149
- Publication date May 4, 2006
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Assembly
- Publication number 20060081994
- Publication date Apr 20, 2006
- David M. Craig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic component packaging
- Publication number 20060033188
- Publication date Feb 16, 2006
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light modulator
- Publication number 20050275925
- Publication date Dec 15, 2005
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- G02 - OPTICS
Information Patent Application
Securing a cover for a device
- Publication number 20050077342
- Publication date Apr 14, 2005
- Chien-Hua Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die carrier
- Publication number 20050045974
- Publication date Mar 3, 2005
- Ronald A. Hellekson
- B81 - MICRO-STRUCTURAL TECHNOLOGY

David M. Craig

Person

Patents Grantslast 30 patents

Micro electrical mechanical system

Electrically connecting substrate with electrical device

Method of forming a device package having edge interconnect pad

Electrically connecting substrate with electrical device

Micro-optoelectromechanical system packages for a light modulator a...

Micro electrical mechanical system

Assembly with a ring and bonding pads formed of a same material on...

Light modulator

Die carrier with fluid chamber

Patents Applicationslast 30 patents

Electrically Connecting Substrate With Electrical Device

Micro Electrical Mechanical System

Method of forming a device package having edge interconnect pad

Electrically connecting substrate with electrical device

Micro-optoelectromechanical system packages for a light modulator a...

Micro electrical mechanical system

Assembly

Electronic component packaging

Light modulator

Securing a cover for a device

Die carrier