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David M. Fryauf
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Rio Rancho, NM, US
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Patent Application
BILAYER ENCAPSULATION OF A MEMORY CELL
Publication number
20230380307
Publication date
Nov 23, 2023
Intel Corporation
Errol Todd Ryan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TECHNOLOGIES FOR SEMICONDUCTOR DEVICES INCLUDING AMORPHOUS SILICON
Publication number
20230363297
Publication date
Nov 9, 2023
Intel Corporation
Luca Fumagalli
H01 - BASIC ELECTRIC ELEMENTS