David M. Isaacson

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Boston, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming low defect density alloy graded layers and struc...
- Patent number 7,682,952
- Issue date Mar 23, 2010
- Massachusetts Institute of Technology
- David Michael Isaacson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strained silicon-on-silicon by wafer bonding and layer transfer
- Patent number 7,495,266
- Issue date Feb 24, 2009
- Massachusetts Institute of Technology
- David M. Isaacson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming low defect density alloy graded layers and struc...
- Publication number 20060113542
- Publication date Jun 1, 2006
- Massachusetts Institute of Technology
- David Michael Isaacson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices having bonded interfaces and methods for maki...
- Publication number 20050280081
- Publication date Dec 22, 2005
- Massachusetts Institute of Technology
- David M. Isaacson
- C30 - CRYSTAL GROWTH
Information Patent Application
Strained silicon-on-silicon by wafer bonding and layer transfer
- Publication number 20050280026
- Publication date Dec 22, 2005
- David M. Isaacson
- H01 - BASIC ELECTRIC ELEMENTS