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David Michael Passante
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Endicott, NY, US
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last 30 patents
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Patent Grant
Apparatus and process for improved die adhesion to organic chip car...
Patent number
5,955,782
Issue date
Sep 21, 1999
International Business Machines Corporation
Stephen John Kosteva
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method and structure for constraining the flow of incapsulant appli...
Patent number
5,869,356
Issue date
Feb 9, 1999
International Business Machines Corporation
James W. Fuller
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Structure for constraining the flow of encapsulant applied to an I/...
Patent number
5,784,260
Issue date
Jul 21, 1998
International Business Machines Corporation
James W. Fuller
H01 - BASIC ELECTRIC ELEMENTS