David O'Sullivan

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Fan out packaging pop mechanical attach method
- Patent number 11,735,570
- Issue date Aug 22, 2023
- Intel Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package-on-package with adhesive die attach
- Patent number 11,380,616
- Issue date Jul 5, 2022
- Intel IP Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240395655
- Publication date Nov 28, 2024
- Intel Corporation
- Avi Tsarfati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
- Publication number 20230343766
- Publication date Oct 26, 2023
- Intel Corporation
- David O'SULLIVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE
- Publication number 20230317621
- Publication date Oct 5, 2023
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE REDISTRIBUTION LAYERS WITH METAL-INSULAT...
- Publication number 20220310777
- Publication date Sep 29, 2022
- Intel Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP), FLIP-CHIP CHIP SCALE...
- Publication number 20200098698
- Publication date Mar 26, 2020
- Intel Corporation
- Richard PATTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGE-ON-PACKAGE WITH ADHESIVE DIE ATTACH
- Publication number 20190355659
- Publication date Nov 21, 2019
- Intel IP Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD
- Publication number 20190312016
- Publication date Oct 10, 2019
- Intel IP Corporation
- David O'Sullivan
- H01 - BASIC ELECTRIC ELEMENTS

David O'Sullivan

Person

Patents Grantslast 30 patents

Fan out packaging pop mechanical attach method

Fan out package-on-package with adhesive die attach

Patents Applicationslast 30 patents

HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD

GLASS SUBSTRATE PACKAGE WITH HYBRID BONDED DIE

INTEGRATED CIRCUIT PACKAGE REDISTRIBUTION LAYERS WITH METAL-INSULAT...

NOVEL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP), FLIP-CHIP CHIP SCALE...

FAN OUT PACKAGE-ON-PACKAGE WITH ADHESIVE DIE ATTACH

FAN OUT PACKAGING POP MECHANICAL ATTACH METHOD