David Ovrutsky

Person

Ashkelon, IL

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor chips with array
- Patent number 8,569,876
- Issue date Oct 29, 2013
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Patent number 7,935,568
- Issue date May 3, 2011
- Tessera Technologies Ireland Limited
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip packaging
- Patent number 7,936,062
- Issue date May 3, 2011
- Tessera Technologies Ireland Limited
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Patent number 7,807,508
- Issue date Oct 5, 2010
- Tessera Technologies Hungary Kft
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips
- Patent number 7,791,199
- Issue date Sep 7, 2010
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having compliancy and methods therefor
- Patent number 7,749,886
- Issue date Jul 6, 2010
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a wafer level package
- Publication number 20090162975
- Publication date Jun 25, 2009
- Tessera, Inc.
- Kenneth Allen Honer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assemblies having compliancy and methods therefor
- Publication number 20080150121
- Publication date Jun 26, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor chips with array
- Publication number 20080116544
- Publication date May 22, 2008
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor chips
- Publication number 20080116545
- Publication date May 22, 2008
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Publication number 20080099900
- Publication date May 1, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Publication number 20080099907
- Publication date May 1, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip packaging
- Publication number 20070190691
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level packaging to lidded chips
- Publication number 20070190747
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY

David Ovrutsky

Person

Patents Grantslast 30 patents

Packaged semiconductor chips with array

Wafer-level fabrication of lidded chips with electrodeposited diele...

Wafer level chip packaging

Wafer-level fabrication of lidded chips with electrodeposited diele...

Packaged semiconductor chips

Microelectronic assemblies having compliancy and methods therefor

Patents Applicationslast 30 patents

Method of forming a wafer level package

Microelectronic assemblies having compliancy and methods therefor

Packaged semiconductor chips with array

Packaged semiconductor chips

Wafer-level fabrication of lidded chips with electrodeposited diele...

Wafer-level fabrication of lidded chips with electrodeposited diele...

Wafer level chip packaging

Wafer level packaging to lidded chips