David Palagashvili

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma processing system workpiece carrier with thermally isolated...
- Patent number 11,322,337
- Issue date May 3, 2022
- Applied Materials, Inc.
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber apparatus for chemical etching of dielectric materials
- Patent number 11,302,520
- Issue date Apr 12, 2022
- Applied Materials, Inc.
- Tien Fak Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded lid heater assembly
- Patent number 10,083,816
- Issue date Sep 25, 2018
- Applied Materials, Inc.
- Michael D. Willwerth
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component temperature control by coolant flow control and heater du...
- Patent number 9,639,097
- Issue date May 2, 2017
- Applied Materials, Inc.
- Chetan Mahadeswaraswamy
- G05 - CONTROLLING REGULATING
Information Patent Grant
Apparatus for controlling the flow of a gas in a process chamber
- Patent number 9,443,753
- Issue date Sep 13, 2016
- Applied Materials, Inc.
- David Palagashvili
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Shielded lid heater assembly
- Patent number 9,362,148
- Issue date Jun 7, 2016
- Applied Materials, Inc.
- Michael D. Willwerth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma reactor electrostatic chuck with cooled process ring and hea...
- Patent number 9,070,536
- Issue date Jun 30, 2015
- Applied Materials, Inc.
- Michael D. Willwerth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component temperature control by coolant flow control and heater du...
- Patent number 8,880,227
- Issue date Nov 4, 2014
- Applied Materials, Inc.
- Chetan Mahadeswaraswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber with uniform flow and plasma distribution
- Patent number 8,840,725
- Issue date Sep 23, 2014
- Applied Materials, Inc.
- David Palagashvili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low force substrate lift
- Patent number 8,757,603
- Issue date Jun 24, 2014
- Applied Materials, Inc.
- Michael D. Willwerth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature enhanced electrostatic chucking in plasma processing ap...
- Patent number 8,580,693
- Issue date Nov 12, 2013
- Applied Materials, Inc.
- Sergey G. Belostotskiy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for high temperature etching a high-K material gate structure
- Patent number 8,501,626
- Issue date Aug 6, 2013
- Applied Materials, Inc.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded lid heater assembly
- Patent number 8,419,893
- Issue date Apr 16, 2013
- Applied Materials, Inc.
- Michael D. Willwerth
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing a workpiece in a plasma reactor with independe...
- Patent number 8,383,002
- Issue date Feb 26, 2013
- Applied Materials, Inc.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck with reduced arcing
- Patent number 8,270,141
- Issue date Sep 18, 2012
- Applied Materials, Inc.
- Michael D. Willwerth
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plasma reactor with center-fed multiple zone gas distribution for i...
- Patent number 8,236,133
- Issue date Aug 7, 2012
- Applied Materials, Inc.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece in a plasma reactor with independe...
- Patent number 7,879,250
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cathode liner with wafer edge gas injection in a plasma reactor cha...
- Patent number 7,832,354
- Issue date Nov 16, 2010
- Applied Materials, Inc.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for wafer backside polymer removal with a ring of plasma un...
- Patent number 7,552,736
- Issue date Jun 30, 2009
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tandem etch chamber plasma processing system
- Patent number 6,962,644
- Issue date Nov 8, 2005
- Applied Materials, Inc.
- Alexander Paterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor electrode
- Patent number 6,818,096
- Issue date Nov 16, 2004
- Michael Barnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning apparatus and method
- Patent number 6,692,903
- Issue date Feb 17, 2004
- Applied Materials, Inc.
- Haojiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas distribution plate
- Patent number 6,444,040
- Issue date Sep 3, 2002
- Applied Materials Inc.
- Harald Herchen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microwave plasma applicator having a thermal transfer medium betwee...
- Patent number 6,369,493
- Issue date Apr 9, 2002
- Applied Materials, Inc.
- Dmitry Lubomirsky
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Workpiece support platen for semiconductor process chamber
- Patent number 6,120,608
- Issue date Sep 19, 2000
- Applied Materials, Inc.
- Norman Shendon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESSING SYSTEM WORKPIECE CARRIER WITH THERMALLY ISOLATED...
- Publication number 20170250060
- Publication date Aug 31, 2017
- Dmitry Lubomirsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS R...
- Publication number 20170011891
- Publication date Jan 12, 2017
- Applied Materials, Inc.
- Edward P. HAMMOND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LID HEATER ASSEMBLY
- Publication number 20160254123
- Publication date Sep 1, 2016
- Applied Materials, Inc.
- Michael D. WILLWERTH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER APPARATUS FOR CHEMICAL ETCHING OF DIELECTRIC MATERIALS
- Publication number 20150380220
- Publication date Dec 31, 2015
- Applied Materials, Inc.
- Tien Fak TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT TEMPERATURE CONTROL BY COOLANT FLOW CONTROL AND HEATER DU...
- Publication number 20150134128
- Publication date May 14, 2015
- Applied Materials, Inc.
- Chetan MAHADESWARASWAMY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION SHIELD FOR PLASMA ENHANCED SUBSTRATE PROCESSING
- Publication number 20140151331
- Publication date Jun 5, 2014
- Applied Materials, Inc.
- VALENTIN N. TODOROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE ENHANCED ELECTROSTATIC CHUCKING IN PLASMA PROCESSING AP...
- Publication number 20140034241
- Publication date Feb 6, 2014
- Sergy G. Belostotskiy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K GATE STRUCTURE
- Publication number 20130344701
- Publication date Dec 26, 2013
- Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR ELECTROSTATIC CHUCK WITH COOLED PROCESS RING AND HEA...
- Publication number 20130277339
- Publication date Oct 24, 2013
- Michael D. Willwerth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LID HEATER ASSEMBLY
- Publication number 20130189848
- Publication date Jul 25, 2013
- Michael D. WILLWERTH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW FORCE SUBSTRATE LIFT
- Publication number 20120097908
- Publication date Apr 26, 2012
- Applied Materials, Inc.
- MICHAEL D. WILLWERTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE ENHANCED ELECTROSTATIC CHUCKING IN PLASMA PROCESSING AP...
- Publication number 20120052690
- Publication date Mar 1, 2012
- Applied Materials, Inc.
- Sergey G. BELOSTOTSKIY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT TEMPERATURE CONTROL BY COOLANT FLOW CONTROL AND HEATER DU...
- Publication number 20120048467
- Publication date Mar 1, 2012
- Applied Materials, Inc.
- Chetan Mahadeswaraswamy
- G05 - CONTROLLING REGULATING
Information Patent Application
APPARATUS FOR CONTROLLING THE FLOW OF A GAS IN A PROCESS CHAMBER
- Publication number 20120024479
- Publication date Feb 2, 2012
- Applied Materials, Inc.
- DAVID PALAGASHVILI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER WITH UNIFORM FLOW AND PLASMA DISTRIBUTION
- Publication number 20110162803
- Publication date Jul 7, 2011
- Applied Materials, Inc.
- DAVID PALAGASHVILI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK WITH REDUCED ARCING
- Publication number 20110157760
- Publication date Jun 30, 2011
- Applied Materials, Inc.
- MICHAEL D. WILLWERTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOWERHEAD ASSEMBLY WITH IMPROVED IMPACT PROTECTION
- Publication number 20110120651
- Publication date May 26, 2011
- Applied Materials, Inc.
- ALEX ERENSTEIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR WITH INDEPENDE...
- Publication number 20110068082
- Publication date Mar 24, 2011
- Applied Materials, Inc.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR ELECTROSTATIC CHUCK HAVING A COAXIAL RF FEED AND MUL...
- Publication number 20090274590
- Publication date Nov 5, 2009
- Applied Materials, Inc.
- MICHAEL D. WILLWERTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESS EMPLOYING MULTIPLE ZONE GAS DISTRIBUTION FOR IMPROVE...
- Publication number 20090275206
- Publication date Nov 5, 2009
- Applied Materials, Inc.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA REACTOR WITH CENTER-FED MULTIPLE ZONE GAS DISTRIBUTION FOR I...
- Publication number 20090272492
- Publication date Nov 5, 2009
- Applied Materials, Inc.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LID HEATER ASSEMBLY
- Publication number 20090236315
- Publication date Sep 24, 2009
- Applied Materials, Inc.
- Michael D. Willwerth
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS R...
- Publication number 20090221150
- Publication date Sep 3, 2009
- Applied Materials, Inc.
- Edward P. Hammond, IV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PORT GAS INJECTION SYSTEM UTILIZED IN A SEMICONDUCTOR PROC...
- Publication number 20090221149
- Publication date Sep 3, 2009
- Edward P. Hammond, IV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cathode liner with wafer edge gas injection in a plasma reactor cha...
- Publication number 20090056629
- Publication date Mar 5, 2009
- APPLIED MATERIALS, INC.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of processing a workpiece in a plasma reactor with independe...
- Publication number 20090057269
- Publication date Mar 5, 2009
- APPLIED MATERIALS, INC.
- Dan Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K MATERIAL GATE STRUCTURE
- Publication number 20090004870
- Publication date Jan 1, 2009
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTOR FOR WAFER BACKSIDE POLYMER REMOVAL HAVING AN ETCH PLASMA JE...
- Publication number 20080179009
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH WAFER FRONT SIDE GA...
- Publication number 20080179287
- Publication date Jul 31, 2008
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH A RING OF PLASMA UN...
- Publication number 20080178913
- Publication date Jul 31, 2008
- KENNETH S. COLLINS
- H01 - BASIC ELECTRIC ELEMENTS

David Palagashvili

Person

Patents Grantslast 30 patents

Plasma processing system workpiece carrier with thermally isolated...

Chamber apparatus for chemical etching of dielectric materials

Shielded lid heater assembly

Component temperature control by coolant flow control and heater du...

Apparatus for controlling the flow of a gas in a process chamber

Shielded lid heater assembly

Plasma reactor electrostatic chuck with cooled process ring and hea...

Component temperature control by coolant flow control and heater du...

Chamber with uniform flow and plasma distribution

Low force substrate lift

Temperature enhanced electrostatic chucking in plasma processing ap...

Methods for high temperature etching a high-K material gate structure

Shielded lid heater assembly

Method of processing a workpiece in a plasma reactor with independe...

Electrostatic chuck with reduced arcing

Plasma reactor with center-fed multiple zone gas distribution for i...

Method of processing a workpiece in a plasma reactor with independe...

Cathode liner with wafer edge gas injection in a plasma reactor cha...

Process for wafer backside polymer removal with a ring of plasma un...

Tandem etch chamber plasma processing system

Plasma reactor electrode

Substrate cleaning apparatus and method

Gas distribution plate

Microwave plasma applicator having a thermal transfer medium betwee...

Workpiece support platen for semiconductor process chamber

Patents Applicationslast 30 patents

PLASMA PROCESSING SYSTEM WORKPIECE CARRIER WITH THERMALLY ISOLATED...

ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS R...

SHIELDED LID HEATER ASSEMBLY

CHAMBER APPARATUS FOR CHEMICAL ETCHING OF DIELECTRIC MATERIALS

COMPONENT TEMPERATURE CONTROL BY COOLANT FLOW CONTROL AND HEATER DU...

DEPOSITION SHIELD FOR PLASMA ENHANCED SUBSTRATE PROCESSING

TEMPERATURE ENHANCED ELECTROSTATIC CHUCKING IN PLASMA PROCESSING AP...

METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K GATE STRUCTURE

PLASMA REACTOR ELECTROSTATIC CHUCK WITH COOLED PROCESS RING AND HEA...

SHIELDED LID HEATER ASSEMBLY

LOW FORCE SUBSTRATE LIFT

TEMPERATURE ENHANCED ELECTROSTATIC CHUCKING IN PLASMA PROCESSING AP...

COMPONENT TEMPERATURE CONTROL BY COOLANT FLOW CONTROL AND HEATER DU...

APPARATUS FOR CONTROLLING THE FLOW OF A GAS IN A PROCESS CHAMBER

CHAMBER WITH UNIFORM FLOW AND PLASMA DISTRIBUTION

ELECTROSTATIC CHUCK WITH REDUCED ARCING

SHOWERHEAD ASSEMBLY WITH IMPROVED IMPACT PROTECTION

METHOD OF PROCESSING A WORKPIECE IN A PLASMA REACTOR WITH INDEPENDE...

PLASMA REACTOR ELECTROSTATIC CHUCK HAVING A COAXIAL RF FEED AND MUL...

PLASMA PROCESS EMPLOYING MULTIPLE ZONE GAS DISTRIBUTION FOR IMPROVE...

PLASMA REACTOR WITH CENTER-FED MULTIPLE ZONE GAS DISTRIBUTION FOR I...

SHIELDED LID HEATER ASSEMBLY

ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS R...

MULTIPLE PORT GAS INJECTION SYSTEM UTILIZED IN A SEMICONDUCTOR PROC...

Cathode liner with wafer edge gas injection in a plasma reactor cha...

Method of processing a workpiece in a plasma reactor with independe...

METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K MATERIAL GATE STRUCTURE

REACTOR FOR WAFER BACKSIDE POLYMER REMOVAL HAVING AN ETCH PLASMA JE...

PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH WAFER FRONT SIDE GA...

PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL WITH A RING OF PLASMA UN...