David Pays-Volard

Person

St. Petersburg, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 11,488,865
- Issue date Nov 1, 2022
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,741,447
- Issue date Aug 11, 2020
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,707,060
- Issue date Jul 7, 2020
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,573,557
- Issue date Feb 25, 2020
- Plasma-Therm LLC
- David Pays-Volard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing a substrate with back metal
- Patent number 10,497,621
- Issue date Dec 3, 2019
- Plasma-Therm LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,297,427
- Issue date May 21, 2019
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,911,654
- Issue date Mar 6, 2018
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,711,406
- Issue date Jul 18, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number RE46339
- Issue date Mar 14, 2017
- Plasma-Therm LLC
- Rich Gauldin
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,564,366
- Issue date Feb 7, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,496,177
- Issue date Nov 15, 2016
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing a substrate with back metal
- Patent number 9,368,404
- Issue date Jun 14, 2016
- Plasma-Therm LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,343,365
- Issue date May 17, 2016
- Plasma-Therm LLC
- Thierry Lazerand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,721
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,737
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,720
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Linnell Martinez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,105,705
- Issue date Aug 11, 2015
- Plasma-Therm LLC
- David Pays-Volard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,082,839
- Issue date Jul 14, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,070,760
- Issue date Jun 30, 2015
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,980,764
- Issue date Mar 17, 2015
- Plasma-Therm LLC
- Linnell Martinez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,946,058
- Issue date Feb 3, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,802,545
- Issue date Aug 12, 2014
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,796,154
- Issue date Aug 5, 2014
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,785,332
- Issue date Jul 22, 2014
- Plasma-Therm LLC
- Chris Johnson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,778,806
- Issue date Jul 15, 2014
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,691,702
- Issue date Apr 8, 2014
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230020438
- Publication date Jan 19, 2023
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20190244859
- Publication date Aug 8, 2019
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20190013243
- Publication date Jan 10, 2019
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20180254215
- Publication date Sep 6, 2018
- PLASMA-THERM, LLC
- Peter Falvo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20180190542
- Publication date Jul 5, 2018
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20170033008
- Publication date Feb 2, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20170025311
- Publication date Jan 26, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20160254189
- Publication date Sep 1, 2016
- PLASMA-THERM, LLC
- Peter Falvo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20160111332
- Publication date Apr 21, 2016
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150371878
- Publication date Dec 24, 2015
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150270121
- Publication date Sep 24, 2015
- Plasma-Therm LLC
- David Pays-Volard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150270154
- Publication date Sep 24, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150255297
- Publication date Sep 10, 2015
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150255347
- Publication date Sep 10, 2015
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20140235034
- Publication date Aug 21, 2014
- Plasma-Therm LLC
- David Pays-Volard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20140154869
- Publication date Jun 5, 2014
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20140094018
- Publication date Apr 3, 2014
- PLASMA-THERM, LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130344683
- Publication date Dec 26, 2013
- Plasma-Therm LLC
- Thierry Lazerand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230968
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230972
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230974
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230969
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230971
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230973
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230970
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS

David Pays-Volard

Person

Patents Grantslast 30 patents

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method for dicing a substrate with back metal

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method for dicing a substrate with back metal

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Method for Dicing a Substrate with Back Metal

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method for Dicing a Substrate with Back Metal

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method for Dicing a Substrate with Back Metal

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer