David Perry

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Kinburn, CA

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Patents Grantslast 30 patents

Information Patent Grant
Supplemental heat conduction path for card to chassis heat dissipation
- Patent number 6,873,528
- Issue date Mar 29, 2005
- Dy 4 Systems Ltd.
- Jamie Hulan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded heat pipe for a conduction cooled circuit card assembly
- Patent number 6,839,235
- Issue date Jan 4, 2005
- Dy 4 Systems Inc.
- Chad St. Louis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED HEAT PIPE FOR A CONDUCTION COOLED CIRCUIT CARD ASSEMBLY
- Publication number 20040120116
- Publication date Jun 24, 2004
- Chad St. Louis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Supplemental heat conduction path for card to chassis heat dissipation
- Publication number 20030223197
- Publication date Dec 4, 2003
- Dy-04 Systems Ltd.
- Jamie Hulan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR