David Peter Van Heerden

Person

Baltimore, MD, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for low temperature bonding of electronic components
- Patent number 8,882,301
- Issue date Nov 11, 2014
- Nanofoil Corporation
- David Van Heerden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Reactive composite material structures with electrostatic discharge...
- Publication number 20110070460
- Publication date Mar 24, 2011
- Reactive NanoTechnologies, Inc.
- Timothy P. Weihs
- F42 - AMMUNITION BLASTING
Information Patent Application
Methods of making reactive composite materials and resulting products
- Publication number 20110027547
- Publication date Feb 3, 2011
- Reactive NanoTechnologies, Inc.
- Yuwei Xun
- B32 - LAYERED PRODUCTS
Information Patent Application
Methods and device for controlling pressure in reactive multilayer...
- Publication number 20090065554
- Publication date Mar 12, 2009
- David Van Heerden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multifunctional Reactive Composite Structures Fabricated From React...
- Publication number 20080093418
- Publication date Apr 24, 2008
- Timothy P. Weihs
- F42 - AMMUNITION BLASTING
Information Patent Application
Method of controlling thermal waves in reactive multilayer joining...
- Publication number 20050136270
- Publication date Jun 23, 2005
- Etienne Besnoin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and device for controlling pressure in reactive multilayer...
- Publication number 20050121499
- Publication date Jun 9, 2005
- David Van Heerden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of bonding and resulting product
- Publication number 20050003228
- Publication date Jan 6, 2005
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite reactive multilayer foil
- Publication number 20040247930
- Publication date Dec 9, 2004
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of bonding bodies
- Publication number 20040247931
- Publication date Dec 9, 2004
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reactive multilayer foil with conductive and nonconductive final pr...
- Publication number 20040151939
- Publication date Aug 5, 2004
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of connecting semiconductor or microelectronic device to a s...
- Publication number 20040149372
- Publication date Aug 5, 2004
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of bonding a first body to a second body
- Publication number 20040149373
- Publication date Aug 5, 2004
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making reactive multilayer foil
- Publication number 20040149813
- Publication date Aug 5, 2004
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

David Peter Van Heerden

Person

Patents Grantslast 30 patents

Method for low temperature bonding of electronic components

Patents Applicationslast 30 patents

Reactive composite material structures with electrostatic discharge...

Methods of making reactive composite materials and resulting products

Methods and device for controlling pressure in reactive multilayer...

Multifunctional Reactive Composite Structures Fabricated From React...

Method of controlling thermal waves in reactive multilayer joining...

Methods and device for controlling pressure in reactive multilayer...

Method of bonding and resulting product

Composite reactive multilayer foil

Method of bonding bodies

Reactive multilayer foil with conductive and nonconductive final pr...

Method of connecting semiconductor or microelectronic device to a s...

Method of bonding a first body to a second body

Method of making reactive multilayer foil