David Pratt

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Assemblies having conductive interconnects which are laterally and...
- Patent number 12,014,983
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming conductive vias, and associated devices and sys...
- Patent number 11,990,370
- Issue date May 21, 2024
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,978,527
- Issue date May 7, 2024
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer overlay marks, overlay measurement systems, and related methods
- Patent number 11,784,077
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Denzil S. Frost
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for forming conductive vias, and associated devices and sys...
- Patent number 11,574,842
- Issue date Feb 7, 2023
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,545,391
- Issue date Jan 3, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming conductive vias, and associated devices and sys...
- Patent number 11,515,204
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having conductive interconnects which are laterally and...
- Patent number 11,482,492
- Issue date Oct 25, 2022
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive interconnects and methods of forming conductive intercon...
- Patent number 11,328,749
- Issue date May 10, 2022
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming through substrate interconnects
- Patent number 10,685,882
- Issue date Jun 16, 2020
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pass-through interconnect structure for microelectronic dies and as...
- Patent number 10,020,287
- Issue date Jul 10, 2018
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices
- Patent number 9,842,806
- Issue date Dec 12, 2017
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with recessed interconnects
- Patent number 9,711,457
- Issue date Jul 18, 2017
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming through substrate interconnects
- Patent number 9,685,375
- Issue date Jun 20, 2017
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for releasably attaching support members to mic...
- Patent number 9,595,504
- Issue date Mar 14, 2017
- Micron Technology, Inc.
- David Pratt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution layers for microfeature workpieces, and associated s...
- Patent number 9,418,970
- Issue date Aug 16, 2016
- Micron Technology, Inc.
- David Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus providing integrated circuit having redistribu...
- Patent number 9,355,934
- Issue date May 31, 2016
- Micron Technology, Inc.
- David Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch-halving integrated circuit process
- Patent number 9,324,721
- Issue date Apr 26, 2016
- Nanya Technology Corporation
- David Storrs Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch-halving integrated circuit process and integrated circuit str...
- Patent number 9,245,844
- Issue date Jan 26, 2016
- Nanya Technology Corporation
- David Storrs Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers for microfeature workpieces, and associated s...
- Patent number 9,230,859
- Issue date Jan 5, 2016
- Micron Technology, Inc.
- David Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pass-through 3D interconnect for microelectronic dies and associate...
- Patent number 9,209,158
- Issue date Dec 8, 2015
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies, stacked semiconductor devices, and method...
- Patent number 9,209,166
- Issue date Dec 8, 2015
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of creating alignment/centering guides for small diameter, h...
- Patent number 9,136,259
- Issue date Sep 15, 2015
- Micron Technology, Inc.
- Dave Pratt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor devices including a through-substrate conductive memb...
- Patent number 9,054,165
- Issue date Jun 9, 2015
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for releasably attaching support members to mic...
- Patent number 8,999,498
- Issue date Apr 7, 2015
- Micron Technology, Inc.
- David Pratt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assemblies, stacked semiconductor devices, and method...
- Patent number 8,994,163
- Issue date Mar 31, 2015
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming through substrate interconnects
- Patent number 8,927,410
- Issue date Jan 6, 2015
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including sub-resolution alignment marks
- Patent number 8,853,868
- Issue date Oct 7, 2014
- Micron Technology, Inc.
- David S. Pratt
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method and apparatus providing integrated circuit having redistribu...
- Patent number 8,779,605
- Issue date Jul 15, 2014
- Micron Technology, Inc.
- David Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface depressions for die-to-die interconnects and associated sys...
- Patent number 8,766,458
- Issue date Jul 1, 2014
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Assemblies having Conductive Interconnects which are Laterally and...
- Publication number 20240282702
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...
- Publication number 20240258167
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...
- Publication number 20230163030
- Publication date May 25, 2023
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...
- Publication number 20230113573
- Publication date Apr 13, 2023
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20230058288
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies having Conductive Interconnects which are Laterally and...
- Publication number 20230021072
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...
- Publication number 20220336277
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...
- Publication number 20220208606
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Trupti D. Gawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20220199123
- Publication date Jun 23, 2022
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE
Information Patent Application
Assemblies having Conductive Interconnects which are Laterally and...
- Publication number 20220013449
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20210249304
- Publication date Aug 12, 2021
- Micron Technology, Inc.
- Raju Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Interconnects and Methods of Forming Conductive Intercon...
- Publication number 20210193189
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Raju Ahmed
- G11 - INFORMATION STORAGE
Information Patent Application
WAFER OVERLAY MARKS, OVERLAY MEASUREMENT SYSTEMS, AND RELATED METHODS
- Publication number 20210193493
- Publication date Jun 24, 2021
- Micron Technology, Inc.
- Denzil S. Frost
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20170317028
- Publication date Nov 2, 2017
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Through Substrate Interconnects
- Publication number 20170256452
- Publication date Sep 7, 2017
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS FOR MICROFEATURE WORKPIECES, AND ASSOCIATED S...
- Publication number 20160118367
- Publication date Apr 28, 2016
- Micron Technology, Inc.
- David Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASS-THROUGH INTERCONNECT STRUCTURE FOR MICROELECTRONIC DIES AND AS...
- Publication number 20160086926
- Publication date Mar 24, 2016
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-HALVING INTEGRATED CIRCUIT PROCESS
- Publication number 20160079249
- Publication date Mar 17, 2016
- NANYA TECHNOLOGY CORPORATION
- David Storrs Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20160013134
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MIC...
- Publication number 20150214185
- Publication date Jul 30, 2015
- Micron Technology, Inc.
- David Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES, STACKED SEMICONDUCTOR DEVICES, AND METHOD...
- Publication number 20150194415
- Publication date Jul 9, 2015
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Through Substrate Interconnects
- Publication number 20150087147
- Publication date Mar 26, 2015
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-HALVING INTEGRATED CIRCUIT PROCESS AND INTEGRATED CIRCUIT STR...
- Publication number 20140264893
- Publication date Sep 18, 2014
- NANYA TECHNOLOGY CORPORATION
- David Storrs Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT HAVING REDISTRIBU...
- Publication number 20140225254
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Through Substrate Interconnects
- Publication number 20140099786
- Publication date Apr 10, 2014
- Micron Technology, Inc.
- Dave Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING SUB-RESOLUTION ALIGNMENT MARKS
- Publication number 20140048953
- Publication date Feb 20, 2014
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SELF-ALIGNED OVERLAY MARK
- Publication number 20130210213
- Publication date Aug 15, 2013
- Vinay Nair
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR ASSEMBLIES, STACKED SEMICONDUCTOR DEVICES, AND METHOD...
- Publication number 20130134605
- Publication date May 30, 2013
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MIC...
- Publication number 20130136898
- Publication date May 30, 2013
- Micron Technology, Inc.
- David Pratt
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE DEPRESSIONS FOR DIE-TO-DIE INTERCONNECTS AND ASSOCIATED SYS...
- Publication number 20130075898
- Publication date Mar 28, 2013
- Micron Technology, Inc.
- David S. Pratt
- H01 - BASIC ELECTRIC ELEMENTS

David Pratt

Person

Patents Grantslast 30 patents

Assemblies having conductive interconnects which are laterally and...

Methods for forming conductive vias, and associated devices and sys...

Conductive interconnects and methods of forming conductive intercon...

Wafer overlay marks, overlay measurement systems, and related methods

Methods for forming conductive vias, and associated devices and sys...

Conductive interconnects and methods of forming conductive intercon...

Methods for forming conductive vias, and associated devices and sys...

Assemblies having conductive interconnects which are laterally and...

Conductive interconnects and methods of forming conductive intercon...

Methods of forming through substrate interconnects

Pass-through interconnect structure for microelectronic dies and as...

Stacked semiconductor devices

Semiconductor devices with recessed interconnects

Methods of forming through substrate interconnects

Methods and systems for releasably attaching support members to mic...

Redistribution layers for microfeature workpieces, and associated s...

Method and apparatus providing integrated circuit having redistribu...

Pitch-halving integrated circuit process

Pitch-halving integrated circuit process and integrated circuit str...

Redistribution layers for microfeature workpieces, and associated s...

Pass-through 3D interconnect for microelectronic dies and associate...

Semiconductor assemblies, stacked semiconductor devices, and method...

Method of creating alignment/centering guides for small diameter, h...

Semiconductor devices including a through-substrate conductive memb...

Methods and systems for releasably attaching support members to mic...

Semiconductor assemblies, stacked semiconductor devices, and method...

Methods of forming through substrate interconnects

Semiconductor structures including sub-resolution alignment marks

Method and apparatus providing integrated circuit having redistribu...

Surface depressions for die-to-die interconnects and associated sys...

Patents Applicationslast 30 patents

Assemblies having Conductive Interconnects which are Laterally and...

METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...

METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...

METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...

Conductive Interconnects and Methods of Forming Conductive Intercon...

Assemblies having Conductive Interconnects which are Laterally and...

METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...

METHODS FOR FORMING CONDUCTIVE VIAS, AND ASSOCIATED DEVICES AND SYS...

Conductive Interconnects and Methods of Forming Conductive Intercon...

Assemblies having Conductive Interconnects which are Laterally and...

Conductive Interconnects and Methods of Forming Conductive Intercon...

Conductive Interconnects and Methods of Forming Conductive Intercon...

WAFER OVERLAY MARKS, OVERLAY MEASUREMENT SYSTEMS, AND RELATED METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

Methods of Forming Through Substrate Interconnects

REDISTRIBUTION LAYERS FOR MICROFEATURE WORKPIECES, AND ASSOCIATED S...

PASS-THROUGH INTERCONNECT STRUCTURE FOR MICROELECTRONIC DIES AND AS...

PITCH-HALVING INTEGRATED CIRCUIT PROCESS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MIC...

SEMICONDUCTOR ASSEMBLIES, STACKED SEMICONDUCTOR DEVICES, AND METHOD...

Methods of Forming Through Substrate Interconnects

PITCH-HALVING INTEGRATED CIRCUIT PROCESS AND INTEGRATED CIRCUIT STR...

METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT HAVING REDISTRIBU...

Methods Of Forming Through Substrate Interconnects

SEMICONDUCTOR STRUCTURES INCLUDING SUB-RESOLUTION ALIGNMENT MARKS

METHOD FOR FORMING SELF-ALIGNED OVERLAY MARK

SEMICONDUCTOR ASSEMBLIES, STACKED SEMICONDUCTOR DEVICES, AND METHOD...

METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MIC...

SURFACE DEPRESSIONS FOR DIE-TO-DIE INTERCONNECTS AND ASSOCIATED SYS...