David R. Campbell Sr.

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Rochester, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods that provide custom region scan with preview im...
- Patent number 7,864,347
- Issue date Jan 4, 2011
- Xerox Corporation
- Jared Walton Moran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic interconnect material with adhesion promotion layer...
- Patent number 6,645,847
- Issue date Nov 11, 2003
- CVC Products, Inc.
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic interconnect material with adhesion promotion layer...
- Patent number 6,627,995
- Issue date Sep 30, 2003
- CVC Products, Inc.
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper film on a substrate
- Patent number 6,461,675
- Issue date Oct 8, 2002
- CVC Products, Inc.
- Ajit P. Paranjpe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microelectronic interconnect material with adhesion promotion layer...
- Patent number 6,365,502
- Issue date Apr 2, 2002
- CVC Products, Inc.
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Systems and methods that provide custom region scan with preview im...
- Publication number 20060291017
- Publication date Dec 28, 2006
- XEROX Corporation
- Jared Walton Moran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Microelectronic interconnect material with adhesion promotion layer...
- Publication number 20020137332
- Publication date Sep 26, 2002
- CVC Products, Inc., a Delware corporation
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic interconnect material with adhesion promotion layer...
- Publication number 20020102838
- Publication date Aug 1, 2002
- CVC Products, Inc., a Delaware corporation
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A COPPER FILM ON A SUBSTRATE
- Publication number 20020006468
- Publication date Jan 17, 2002
- AJIT P. PARANJPE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...