David R. DiMilia

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Layer transfer of low defect SiGe using an etch-back process
- Patent number 7,786,468
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Jack O. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
- Patent number 7,784,669
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
- Patent number 7,703,661
- Issue date Apr 27, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer transfer of low defect SiGe using an etch-back process
- Patent number 7,427,773
- Issue date Sep 23, 2008
- International Business Machines Corporation
- Jack Oon Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer transfer of low defect SiGe using an etch-back process
- Patent number 6,890,835
- Issue date May 10, 2005
- International Business Machines Corporation
- Jack Oon Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scanning heat flow probe
- Patent number 6,866,415
- Issue date Mar 15, 2005
- International Business Machines Corporation
- Steven Alan Cordes
- G01 - MEASURING TESTING
Information Patent Grant
Scanning heat flow probe
- Patent number 6,817,761
- Issue date Nov 16, 2004
- International Business Machines Corporation
- Steven Alan Cordes
- G01 - MEASURING TESTING
Information Patent Grant
Scanning heat flow probe
- Patent number 6,679,625
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Steven Alan Cordes
- G01 - MEASURING TESTING
Information Patent Grant
Scanning heat flow probe and the method of fabricating the same
- Patent number 6,652,139
- Issue date Nov 25, 2003
- International Business Machines Corporation
- Steven Alan Cordes
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for forming a thermoelement for a thermoelectric...
- Patent number 6,613,602
- Issue date Sep 2, 2003
- International Business Machines Corporation
- Emanuel Israel Cooper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermoelectric coolers with enhanced structured interfaces
- Patent number 6,384,312
- Issue date May 7, 2002
- International Business Machines Corporation
- Uttam Shyamalindu Ghoshal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
- Publication number 20100155456
- Publication date Jun 24, 2010
- International Business Machines Corp.
- GARETH G. HOUGHAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYER TRANSFER OF LOW DEFECT SiGe USING AN ETCH-BACK PROCESS
- Publication number 20090267052
- Publication date Oct 29, 2009
- International Business Machines Corporation
- Jack Oon Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER TRANSFER OF LOW DEFECT SiGe USING AN ETCH-BACK PROCESS
- Publication number 20090026495
- Publication date Jan 29, 2009
- International Business Machines Corporation
- Jack Oon Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
- Publication number 20080290142
- Publication date Nov 27, 2008
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layer transfer of low defect SiGe using an etch-back process
- Publication number 20050104067
- Publication date May 19, 2005
- International Business Machines Corporation
- Jack Oon Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scanning heat flow probe
- Publication number 20040028117
- Publication date Feb 12, 2004
- Steven Alan Cordes
- G01 - MEASURING TESTING
Information Patent Application
Scanning heat flow probe
- Publication number 20030169798
- Publication date Sep 11, 2003
- Steven Alan Cordes
- G01 - MEASURING TESTING
Information Patent Application
Scanning heat flow probe
- Publication number 20030156623
- Publication date Aug 21, 2003
- Steven Alan Cordes
- G01 - MEASURING TESTING
Information Patent Application
Scanning heat flow probe
- Publication number 20030112844
- Publication date Jun 19, 2003
- International Business Machines Corporation
- Steven Alan Cordes
- G01 - MEASURING TESTING
Information Patent Application
MONOLITHICALLY INTEGRATED COLD POINT THERMOELECTRIC COOLER
- Publication number 20030113950
- Publication date Jun 19, 2003
- International Business Machines Corp.
- Emanuel Israel Cooper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

David R. DiMilia

Person

Patents Grantslast 30 patents

Layer transfer of low defect SiGe using an etch-back process

Method and process for reducing undercooling in a lead-free tin-ric...

Method and process for reducing undercooling in a lead-free tin-ric...

Layer transfer of low defect SiGe using an etch-back process

Layer transfer of low defect SiGe using an etch-back process

Scanning heat flow probe

Scanning heat flow probe

Scanning heat flow probe

Scanning heat flow probe and the method of fabricating the same

Method and system for forming a thermoelement for a thermoelectric...

Thermoelectric coolers with enhanced structured interfaces

Patents Applicationslast 30 patents

METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...

LAYER TRANSFER OF LOW DEFECT SiGe USING AN ETCH-BACK PROCESS

LAYER TRANSFER OF LOW DEFECT SiGe USING AN ETCH-BACK PROCESS

METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...

Layer transfer of low defect SiGe using an etch-back process

Scanning heat flow probe

Scanning heat flow probe

Scanning heat flow probe

Scanning heat flow probe

MONOLITHICALLY INTEGRATED COLD POINT THERMOELECTRIC COOLER