David R. Hembree

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for internal heat spreading for packaged se...
- Patent number 11,329,026
- Issue date May 10, 2022
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 11,239,095
- Issue date Feb 1, 2022
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 10,923,447
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with improved thermal performa...
- Patent number 10,461,059
- Issue date Oct 29, 2019
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 10,424,495
- Issue date Sep 24, 2019
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 10,163,755
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for heat transfer from packaged semiconduct...
- Patent number 10,068,875
- Issue date Sep 4, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 10,008,395
- Issue date Jun 26, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for transferring heat from stacked microfeature devices
- Patent number 9,960,148
- Issue date May 1, 2018
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 9,837,396
- Issue date Dec 5, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 9,691,746
- Issue date Jun 27, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for releasably attaching support members to mic...
- Patent number 9,595,504
- Issue date Mar 14, 2017
- Micron Technology, Inc.
- David Pratt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state lights with thermal control elements
- Patent number 9,548,286
- Issue date Jan 17, 2017
- Micron Technology, Inc.
- Scott E. Sills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with high efficiency thermal p...
- Patent number 9,443,744
- Issue date Sep 13, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with improved thermal performa...
- Patent number 9,269,700
- Issue date Feb 23, 2016
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for releasably attaching support members to mic...
- Patent number 8,999,498
- Issue date Apr 7, 2015
- Micron Technology, Inc.
- David Pratt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lens master devices, lens structures, imaging devices, and methods...
- Patent number 8,982,469
- Issue date Mar 17, 2015
- Micron Technology, Inc.
- David R. Hembree
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,669,179
- Issue date Mar 11, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Stacked semiconductor components having conductive interconnects
- Patent number 8,546,931
- Issue date Oct 1, 2013
- Micron Technology, Inc.
- Alan G. Wood
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stacked semiconductor component having through wire interconnect (T...
- Patent number 8,513,797
- Issue date Aug 20, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,502,353
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20220157624
- Publication date May 19, 2022
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20210167030
- Publication date Jun 3, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20200020547
- Publication date Jan 16, 2020
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20180342475
- Publication date Nov 29, 2018
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20180308785
- Publication date Oct 25, 2018
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20180294169
- Publication date Oct 11, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20180108592
- Publication date Apr 19, 2018
- Micron Technology, Inc.
- David R. Hembree
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR INTERNAL HEAT SPREADING FOR PACKAGED SE...
- Publication number 20170236804
- Publication date Aug 17, 2017
- Micron Technology, Inc.
- DAVID R. HEMBREE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20170229439
- Publication date Aug 10, 2017
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR HEAT TRANSFER FROM PACKAGED SEMICONDUCT...
- Publication number 20170117254
- Publication date Apr 27, 2017
- Micron Technology, Inc.
- DAVID R. HEMBREE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20160372452
- Publication date Dec 22, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...
- Publication number 20160141270
- Publication date May 19, 2016
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20160013173
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...
- Publication number 20160013115
- Publication date Jan 14, 2016
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...
- Publication number 20150279828
- Publication date Oct 1, 2015
- Micron Technology, Inc.
- Michel Koopmans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MIC...
- Publication number 20150214185
- Publication date Jul 30, 2015
- Micron Technology, Inc.
- David Pratt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20130295766
- Publication date Nov 7, 2013
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MIC...
- Publication number 20130136898
- Publication date May 30, 2013
- Micron Technology, Inc.
- David Pratt
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...
- Publication number 20120228781
- Publication date Sep 13, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR TRANSFERRING HEAT FROM STACKED MICROFEA...
- Publication number 20120135567
- Publication date May 31, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
SOLID STATE LIGHTS WITH THERMAL CONTROL ELEMENTS
- Publication number 20120032182
- Publication date Feb 9, 2012
- Micron Technology, Inc.
- Scott E. Sills
- H01 - BASIC ELECTRIC ELEMENTS

David R. Hembree

Person

Patents Grantslast 30 patents

Semiconductor device assembly with die support structures

Methods of manufacturing stacked semiconductor die assemblies with...

Apparatuses and methods for internal heat spreading for packaged se...

Stacked semiconductor die assemblies with high efficiency thermal p...

Semiconductor device assembly with die support structures

Stacked semiconductor die assemblies with improved thermal performa...

Stacked semiconductor die assemblies with high efficiency thermal p...

Methods of manufacturing stacked semiconductor die assemblies with...

Apparatuses and methods for heat transfer from packaged semiconduct...

Stacked semiconductor die assemblies with high efficiency thermal p...

Methods for transferring heat from stacked microfeature devices

Stacked semiconductor die assemblies with high efficiency thermal p...

Methods of manufacturing stacked semiconductor die assemblies with...

Methods and systems for releasably attaching support members to mic...

Solid state lights with thermal control elements

Stacked semiconductor die assemblies with high efficiency thermal p...

Stacked semiconductor die assemblies with improved thermal performa...

Interconnect structures for stacked dies, including penetrating str...

Semiconductor module system having encapsulated through wire interc...

Through wire interconnect (TWI) for semiconductor components having...

Methods and systems for releasably attaching support members to mic...

Lens master devices, lens structures, imaging devices, and methods...

Method for fabricating a through wire interconnect (TWI) on a semic...

Interconnect structures for stacked dies, including penetrating str...

Through-wafer interconnects for photoimager and memory wafers

Through wire interconnect (TWI) having bonded connection and encaps...

Stacked semiconductor components having conductive interconnects

Stacked semiconductor component having through wire interconnect (T...

Through-wafer interconnects for photoimager and memory wafers

Interconnect structures for stacked dies, including penetrating str...

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

APPARATUSES AND METHODS FOR INTERNAL HEAT SPREADING FOR PACKAGED SE...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

APPARATUSES AND METHODS FOR HEAT TRANSFER FROM PACKAGED SEMICONDUCT...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL P...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH IMPROVED THERMAL PERFORMA...

METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MIC...

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

Through Wire Interconnect (TWI) For Semiconductor Components Having...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MIC...

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...

METHODS AND APPARATUSES FOR TRANSFERRING HEAT FROM STACKED MICROFEA...

Semiconductor Module System Having Stacked Components With Encapsul...

SOLID STATE LIGHTS WITH THERMAL CONTROL ELEMENTS