David R. Kee

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally enhanced semiconductor ball grid array device and method...
- Patent number 6,365,980
- Issue date Apr 2, 2002
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with depressions for receiving solder bal...
- Patent number 6,365,976
- Issue date Apr 2, 2002
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed leadframe for semiconductor packages and bend forming metho...
- Patent number 6,072,230
- Issue date Jun 6, 2000
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic wire bonding using friction welding process
- Patent number 5,715,989
- Issue date Feb 10, 1998
- Texas Instruments Incorporated
- David R. Kee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Downset exposed die mount pad leadframe and package
- Patent number 5,594,234
- Issue date Jan 14, 1997
- Texas Instruments Incorporated
- Buford H. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bond header
- Patent number 5,545,846
- Issue date Aug 13, 1996
- Texas Instruments Incorporated
- Charles E. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leads for semiconductor chip assembly and method
- Patent number 5,308,797
- Issue date May 3, 1994
- Texas Instruments Incorporated
- David R. Kee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit using a pre-served dam bar t...
- Patent number 5,070,039
- Issue date Dec 3, 1991
- Texas Instruments Incorporated
- Richard E. Johnson
- H01 - BASIC ELECTRIC ELEMENTS

David R. Kee

Person

Patents Grantslast 30 patents

Thermally enhanced semiconductor ball grid array device and method...

Integrated circuit device with depressions for receiving solder bal...

Exposed leadframe for semiconductor packages and bend forming metho...

Microelectronic wire bonding using friction welding process

Downset exposed die mount pad leadframe and package

Laser bond header

Leads for semiconductor chip assembly and method

Method of making an integrated circuit using a pre-served dam bar t...