David R. Scheid

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Eau Claire, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package including wire bond and electrically con...
- Patent number 8,907,482
- Issue date Dec 9, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including a thermally and electrically c...
- Patent number 8,362,607
- Issue date Jan 29, 2013
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tiered integrated circuit package
- Patent number 8,354,743
- Issue date Jan 15, 2013
- Honeywell International Inc.
- Ronald James Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-dual lockstep processor assemblies and modules
- Patent number 7,979,746
- Issue date Jul 12, 2011
- Honeywell International Inc.
- Brian Cornelius
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing flexible semiconductor assemblies
- Patent number 7,790,502
- Issue date Sep 7, 2010
- Honeywell International Inc.
- David R. Scheid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical integrated package apparatus and method
- Patent number 7,067,352
- Issue date Jun 27, 2006
- David Ralph Scheid
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING WIRE BOND AND ELECTRICALLY CON...
- Publication number 20140124962
- Publication date May 8, 2014
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIERED INTEGRATED CIRCUIT PACKAGE
- Publication number 20110180919
- Publication date Jul 28, 2011
- Honeywell International Inc.
- Ronald James Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package including a thermally and electrically c...
- Publication number 20100308453
- Publication date Dec 9, 2010
- Honeywell International Inc.
- David Scheid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DUAL LOCKSTEP PROCESSOR ASSEMBLIES AND MODULES
- Publication number 20100275065
- Publication date Oct 28, 2010
- Honeywell International Inc.
- Brian Cornelius
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Manufacturing Flexible Semiconductor Assemblies
- Publication number 20090148983
- Publication date Jun 11, 2009
- Honeywell International Inc.
- David R. Scheid
- B81 - MICRO-STRUCTURAL TECHNOLOGY