David Robert Russell Jr.

Person

New Hope, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Glass cloth including attached fibers
- Patent number 10,801,137
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Bruce J. Chamberlin
- D03 - WEAVING
Information Patent Grant
Reduced-warpage laminate structure
- Patent number 10,685,919
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating for limiting substrate damage due to discrete failure
- Patent number 10,492,289
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating for limiting substrate damage due to discrete failure
- Patent number 10,470,290
- Issue date Nov 5, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface for limiting substrate damage due to discrete failure
- Patent number 10,342,122
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 10,276,534
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contacts of an electronic package structure t...
- Patent number 10,276,535
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface for limiting substrate damage due to discrete failure
- Patent number 10,206,278
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Bruce J. Chamberlain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and methods to enhance reliability
- Patent number 10,172,243
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate substrate thermal warpage prediction for designing a lamin...
- Patent number 10,108,753
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interface for limiting substrate damage due to discrete failure
- Patent number 10,080,283
- Issue date Sep 18, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image analysis methods for plated through hole reliability
- Patent number 9,990,707
- Issue date Jun 5, 2018
- International Business Machines Corporation
- Sarah K. Czaplewski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Glass interposer with embedded thermoelectric devices
- Patent number 9,913,405
- Issue date Mar 6, 2018
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 9,865,557
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper feature design for warpage control of substrates
- Patent number 9,659,131
- Issue date May 23, 2017
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduced-warpage laminate structure
- Patent number 9,613,915
- Issue date Apr 4, 2017
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a glass interposer with thermal vias
- Patent number 9,585,257
- Issue date Feb 28, 2017
- GLOBALFOUNDRIES Inc.
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-plane copper imbalance for warpage prediction
- Patent number 9,563,732
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduced-warpage laminate structure
- Patent number 9,543,255
- Issue date Jan 10, 2017
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial carrier dicing of semiconductor wafers
- Patent number 9,484,239
- Issue date Nov 1, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial carrier dicing of semiconductor wafers
- Patent number 9,478,453
- Issue date Oct 25, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer stack for contact formation
- Patent number 9,401,336
- Issue date Jul 26, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under ball metallurgy (UBM) for improved electromigration
- Patent number 9,142,501
- Issue date Sep 22, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper feature design for warpage control of substrates
- Patent number 9,105,535
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 9,099,458
- Issue date Aug 4, 2015
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Construction of reliable stacked via in electronic substrates—verti...
- Patent number 8,866,026
- Issue date Oct 21, 2014
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming coreless flip chip ball grid array (FCBGA) subst...
- Patent number 8,841,209
- Issue date Sep 23, 2014
- International Business Machines Corporation
- Sylvie Allard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underbump metallurgy employing an electrolytic Cu / electorlytic Ni...
- Patent number 8,587,112
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact alignment posts
- Patent number 8,530,345
- Issue date Sep 10, 2013
- International Business Machines Corporation
- David Justin West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clustered stacked vias for reliable electronic substrates
- Patent number 8,522,430
- Issue date Sep 3, 2013
- International Business Macines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Interface for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180332701
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coating for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180324944
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interface for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180324945
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180318968
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180318969
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coating for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180324946
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHODS TO ENHANCE RELIABILITY
- Publication number 20180139852
- Publication date May 17, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCTION OF SOLDER INTERCONNECT STRESS
- Publication number 20180061799
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF SOLDER INTERCONNECT STRESS
- Publication number 20180061800
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CLOTH INCLUDING ATTACHED FIBERS
- Publication number 20180023225
- Publication date Jan 25, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- D03 - WEAVING
Information Patent Application
LAMINATE SUBSTRATE THERMAL WARPAGE PREDICTION FOR DESIGNING A LAMIN...
- Publication number 20170351783
- Publication date Dec 7, 2017
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE ANALYSIS METHODS FOR PLATED THROUGH HOLE RELIABILITY
- Publication number 20170330316
- Publication date Nov 16, 2017
- International Business Machines Corporation
- Sarah K. CZAPLEWSKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
- Publication number 20170148749
- Publication date May 25, 2017
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS INTERPOSER WITH THERMAL VIAS
- Publication number 20160286660
- Publication date Sep 29, 2016
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS INTERPOSER WITH EMBEDDED THERMOELECTRIC DEVICES
- Publication number 20160286686
- Publication date Sep 29, 2016
- International Business Machines Corporation
- Jeffrey P. Gambino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
- Publication number 20160155708
- Publication date Jun 2, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED-WARPAGE LAMINATE STRUCTURE
- Publication number 20160157357
- Publication date Jun 2, 2016
- International Business Machines Corporation
- Mark C. Lamorey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL LAYER STACK FOR CONTACT FORMATION
- Publication number 20160126201
- Publication date May 5, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Carrier Dicing of Semiconductor Wafers
- Publication number 20160079117
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Carrier Dicing of Semiconductor Wafers
- Publication number 20160079111
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Feature Design for Warpage Control of Substrates
- Publication number 20150317423
- Publication date Nov 5, 2015
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140339699
- Publication date Nov 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Feature Design for Warpage Control of Substrates
- Publication number 20130334711
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electrical Contact Alignment Posts
- Publication number 20130157455
- Publication date Jun 20, 2013
- International Buiness Machines Corporation
- David Justin West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CORELESS FLIP CHIP BALL GRID ARRAY (FCBGA) SUBST...
- Publication number 20130043060
- Publication date Feb 21, 2013
- International Business Machines Corporation
- Sylvie Allard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...
- Publication number 20120299195
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLUSTERED STACKED VIAS FOR RELIABLE ELECTRONIC SUBSTRATES
- Publication number 20120279061
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...
- Publication number 20120267158
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Karan Kacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING AN ELECTROLYTIC Cu / ELECTORLYTIC Ni...
- Publication number 20120198692
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Contact Alignment Posts
- Publication number 20120032321
- Publication date Feb 9, 2012
- International Business Machines Corporation
- David J. West
- H01 - BASIC ELECTRIC ELEMENTS

David Robert Russell Jr.

Person

Patents Grantslast 30 patents

Glass cloth including attached fibers

Reduced-warpage laminate structure

Coating for limiting substrate damage due to discrete failure

Coating for limiting substrate damage due to discrete failure

Interface for limiting substrate damage due to discrete failure

Reduction of solder interconnect stress

Method of fabricating contacts of an electronic package structure t...

Interface for limiting substrate damage due to discrete failure

Printed circuit board and methods to enhance reliability

Laminate substrate thermal warpage prediction for designing a lamin...

Interface for limiting substrate damage due to discrete failure

Image analysis methods for plated through hole reliability

Glass interposer with embedded thermoelectric devices

Reduction of solder interconnect stress

Copper feature design for warpage control of substrates

Reduced-warpage laminate structure

Method of forming a glass interposer with thermal vias

In-plane copper imbalance for warpage prediction

Reduced-warpage laminate structure

Sacrificial carrier dicing of semiconductor wafers

Sacrificial carrier dicing of semiconductor wafers

Dual layer stack for contact formation

Under ball metallurgy (UBM) for improved electromigration

Copper feature design for warpage control of substrates

Construction of reliable stacked via in electronic substrates—verti...

Construction of reliable stacked via in electronic substrates—verti...

Method for forming coreless flip chip ball grid array (FCBGA) subst...

Underbump metallurgy employing an electrolytic Cu / electorlytic Ni...

Electrical contact alignment posts

Clustered stacked vias for reliable electronic substrates

Patents Applicationslast 30 patents

Interface for Limiting Substrate Damage Due to Discrete Failure

Coating for Limiting Substrate Damage Due to Discrete Failure

Interface for Limiting Substrate Damage Due to Discrete Failure

Solder for Limiting Substrate Damage Due to Discrete Failure

Solder for Limiting Substrate Damage Due to Discrete Failure

Coating for Limiting Substrate Damage Due to Discrete Failure

PRINTED CIRCUIT BOARD AND METHODS TO ENHANCE RELIABILITY

REDUCTION OF SOLDER INTERCONNECT STRESS

REDUCTION OF SOLDER INTERCONNECT STRESS

GLASS CLOTH INCLUDING ATTACHED FIBERS

LAMINATE SUBSTRATE THERMAL WARPAGE PREDICTION FOR DESIGNING A LAMIN...

IMAGE ANALYSIS METHODS FOR PLATED THROUGH HOLE RELIABILITY

REDUCED-WARPAGE LAMINATE STRUCTURE

GLASS INTERPOSER WITH THERMAL VIAS

GLASS INTERPOSER WITH EMBEDDED THERMOELECTRIC DEVICES

REDUCED-WARPAGE LAMINATE STRUCTURE

REDUCED-WARPAGE LAMINATE STRUCTURE

DUAL LAYER STACK FOR CONTACT FORMATION

Sacrificial Carrier Dicing of Semiconductor Wafers

Sacrificial Carrier Dicing of Semiconductor Wafers

Copper Feature Design for Warpage Control of Substrates

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

Copper Feature Design for Warpage Control of Substrates

Electrical Contact Alignment Posts

METHOD FOR FORMING CORELESS FLIP CHIP BALL GRID ARRAY (FCBGA) SUBST...

CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...

CLUSTERED STACKED VIAS FOR RELIABLE ELECTRONIC SUBSTRATES

CONSTRUCTION OF RELIABLE STACKED VIA IN ELECTRONIC SUBSTRATES - VER...

UNDERBUMP METALLURGY EMPLOYING AN ELECTROLYTIC Cu / ELECTORLYTIC Ni...

Electrical Contact Alignment Posts