David Sawoska

Person

Watertown, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number RE45881
- Issue date Feb 9, 2016
- Ronald Redline
- 001 -
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number RE45842
- Issue date Jan 12, 2016
- Ronald Redline
- 001 -
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number RE45297
- Issue date Dec 23, 2014
- Ronald Redline
- 228 - Metal fusion bonding
Information Patent Grant
Method for the manufacture of printed circuit boards with plated re...
- Patent number 7,279,108
- Issue date Oct 9, 2007
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 7,267,259
- Issue date Sep 11, 2007
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the manufacture of printed circuit boards with plated re...
- Patent number 7,034,231
- Issue date Apr 25, 2006
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 6,905,587
- Issue date Jun 14, 2005
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the manufacture of printed circuit boards with integral...
- Patent number 6,767,445
- Issue date Jul 27, 2004
- Peter Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the manufacture of printed circuit boards with plated re...
- Patent number 6,585,904
- Issue date Jul 1, 2003
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 6,544,397
- Issue date Apr 8, 2003
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 6,444,109
- Issue date Sep 3, 2002
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for enhancing the solderability of a surface
- Patent number 6,200,451
- Issue date Mar 13, 2001
- MacDermid, Incorporated
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oxidizing accelerator
- Patent number 4,608,275
- Issue date Aug 26, 1986
- MacDermid, Incorporated
- Peter E. Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper deposition solution using a hypophosphite reduci...
- Patent number 4,279,948
- Issue date Jul 21, 1981
- MacDermid Incorporated
- Peter E. Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper composition solution using a hypophosphite reduc...
- Patent number 4,209,331
- Issue date Jun 24, 1980
- MacDermid Incorporated
- Peter E. Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
UV inkjet resist
- Publication number 20080308003
- Publication date Dec 18, 2008
- Andrew M. Krol
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for the manufacture of printed circuit boards with plated re...
- Publication number 20080003351
- Publication date Jan 3, 2008
- MacDermid, Incorporated
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for creating a pattern on a copper surface
- Publication number 20070237899
- Publication date Oct 11, 2007
- David Sawoska
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for the manufacture of printed circuit boards with plated re...
- Publication number 20060124583
- Publication date Jun 15, 2006
- MacDermid, Incorporated
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the manufacture of printed circuit boards with embedded...
- Publication number 20040245210
- Publication date Dec 9, 2004
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the manufacture of printed circuit boards with integral...
- Publication number 20040076743
- Publication date Apr 22, 2004
- Peter Kukanskis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for enhancing the solderability of a surface
- Publication number 20030209446
- Publication date Nov 13, 2003
- MacDermid Incorporated
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the manufacture of printed circuit boards with plated re...
- Publication number 20030205551
- Publication date Nov 6, 2003
- MacDermid, Incorporated
- Peter Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for enhancing the solderability of a surface
- Publication number 20030118742
- Publication date Jun 26, 2003
- MacDermid, Incorporated
- Ronald Redline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the manufacture of printed circuit boards with plated re...
- Publication number 20020135459
- Publication date Sep 26, 2002
- Peter Kukanskis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for selectively plating areas of a substrate
- Publication number 20020068127
- Publication date Jun 6, 2002
- Francis Durso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for enhancing the solderability of a surface
- Publication number 20010016232
- Publication date Aug 23, 2001
- Ronald Redline
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

David Sawoska

Person

Patents Grantslast 30 patents

Method for enhancing the solderability of a surface

Method for enhancing the solderability of a surface

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with integral...

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface

Method for enhancing the solderability of a surface

Method for enhancing the solderability of a surface

Oxidizing accelerator

Electroless copper deposition solution using a hypophosphite reduci...

Electroless copper composition solution using a hypophosphite reduc...

Patents Applicationslast 30 patents

UV inkjet resist

Method for the manufacture of printed circuit boards with plated re...

Process for creating a pattern on a copper surface

Method for the manufacture of printed circuit boards with plated re...

Method for the manufacture of printed circuit boards with embedded...

Method for the manufacture of printed circuit boards with integral...

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with plated re...

Method for enhancing the solderability of a surface

Method for the manufacture of printed circuit boards with plated re...

Process for selectively plating areas of a substrate

Method for enhancing the solderability of a surface