David T. Price

Person

Gresham, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Global shutter sensor systems and related methods
- Patent number 12,080,739
- Issue date Sep 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Manuel H. Innocent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with single-photon avalanche diodes and isola...
- Patent number 12,034,025
- Issue date Jul 9, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge seals for semiconductor packages
- Patent number 11,961,859
- Issue date Apr 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illumination image sensors
- Patent number 11,756,977
- Issue date Sep 12, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge seals for semiconductor packages
- Patent number 11,670,655
- Issue date Jun 6, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,506,687
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Kevin Alexander Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transistor assembly with dual middle mounting clips
- Patent number 11,075,148
- Issue date Jul 27, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge seals for semiconductor packages
- Patent number 10,431,614
- Issue date Oct 1, 2019
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor capacitors and related methods
- Patent number 10,403,659
- Issue date Sep 3, 2019
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked image sensor capacitors and related methods
- Patent number 10,090,342
- Issue date Oct 2, 2018
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor structure having metal-filled trench con...
- Patent number 9,711,556
- Issue date Jul 18, 2017
- Semiconductor Components Industries, LLC
- Rick Jerome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor image sensor device
- Patent number 9,570,494
- Issue date Feb 14, 2017
- Semiconductor Components Industries, LLC
- Rick Jerome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer-less transistor integration scheme for high-K gate dielectri...
- Patent number 7,955,919
- Issue date Jun 7, 2011
- LSI Corporation
- David Pritchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for redirecting void diffusion away from vias in an integrat...
- Patent number 7,582,566
- Issue date Sep 1, 2009
- LSI Logic Corporation
- Derryl D. J. Allman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for SRAM bitmap verification
- Patent number 7,467,363
- Issue date Dec 16, 2008
- LSI Corporation
- David T. Price
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and apparatus for diverting void diffusion in integrated cir...
- Patent number 7,436,040
- Issue date Oct 14, 2008
- LSI Corporation
- Derryl D. J. Allman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for redirecting void diffusion away from vias...
- Patent number 7,361,965
- Issue date Apr 22, 2008
- LSI Logic Corporation
- Derryl D. J. Allman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microchannel formation for fuses, interconnects, capacitors, and in...
- Patent number 6,784,045
- Issue date Aug 31, 2004
- LSI Logic Corporation
- David T. Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementation of Si-Ge HBT with CMOS process
- Patent number 6,767,842
- Issue date Jul 27, 2004
- LSI Logic Corporation
- Robi Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance Si-Ge device module with CMOS technology
- Patent number 6,707,132
- Issue date Mar 16, 2004
- LSI Logic Corporation
- Robi Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a bonding pad on a substrate
- Patent number 6,678,950
- Issue date Jan 20, 2004
- LSI Logic Corporation
- Derryl D. J. Allman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GLOBAL SHUTTER SENSOR SYSTEMS AND RELATED METHODS
- Publication number 20240387581
- Publication date Nov 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Manuel H. INNOCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING WITH BOND PAD ABOVE A BONDLINE
- Publication number 20240371905
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Swarnal BORTHAKUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND ISOLA...
- Publication number 20240321924
- Publication date Sep 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE SEALS FOR SEMICONDUCTOR PACKAGES
- Publication number 20240194710
- Publication date Jun 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED SEALS FOR SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANC...
- Publication number 20240145504
- Publication date May 2, 2024
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS RELATED TO CONTROLLABLE THIN FILM RESISTORS FO...
- Publication number 20230352518
- Publication date Nov 2, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Rick Carlton JEROME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATION IMAGE SENSORS
- Publication number 20230352515
- Publication date Nov 2, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE SEALS FOR SEMICONDUCTOR PACKAGES
- Publication number 20230261015
- Publication date Aug 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND ISOLA...
- Publication number 20220367534
- Publication date Nov 17, 2022
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS RELATED TO CONTROLLABLE THIN FILM RESISTORS FO...
- Publication number 20220271118
- Publication date Aug 25, 2022
- Semiconductor Components Industries, LLC
- Rick Carlton JEROME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN TRANSISTORS WITH SEMICONDUCTOR SPACERS
- Publication number 20220181462
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLOBAL SHUTTER SENSOR SYSTEMS AND RELATED METHODS
- Publication number 20220093667
- Publication date Mar 24, 2022
- Semiconductor Components Industries, LLC
- Manuel H. INNOCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20220003800
- Publication date Jan 6, 2022
- Semiconductor Components Industries, LLC
- Kevin Alexander STEWART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS
- Publication number 20210111106
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITORS
- Publication number 20200328271
- Publication date Oct 15, 2020
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICES AND RELATED METHODS
- Publication number 20200273896
- Publication date Aug 27, 2020
- Semiconductor Components Industries, LLC
- Manuel H. INNOCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATION IMAGE SENSORS
- Publication number 20190393257
- Publication date Dec 26, 2019
- Semiconductor Components Industries, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE SEALS FOR SEMICONDUCTOR PACKAGES
- Publication number 20190363124
- Publication date Nov 28, 2019
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSOR CAPACITORS AND RELATED METHODS
- Publication number 20190043903
- Publication date Feb 7, 2019
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE SEALS FOR SEMICONDUCTOR PACKAGES
- Publication number 20180219038
- Publication date Aug 2, 2018
- Semiconductor Components Industries, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR STRUCTURE HAVING METAL-FILLED TRENCH CON...
- Publication number 20170092669
- Publication date Mar 30, 2017
- Semiconductor Components Industries, LLC
- Rick JEROME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDIRECTING VOID DIFFUSION AWAY FROM VIAS IN AN INTEGRAT...
- Publication number 20080132065
- Publication date Jun 5, 2008
- Derryl D. J. Allman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER-LESS TRANSISTOR INTEGRATION SCHEME FOR HIGH-K GATE DIELECTRI...
- Publication number 20080102583
- Publication date May 1, 2008
- LSI Logic Corporation
- David Pritchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for diverting void diffusion in integrated cir...
- Publication number 20070259518
- Publication date Nov 8, 2007
- LSI Logic Corporation
- Derryl D. J. Allman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for redirecting void diffusion away from vias...
- Publication number 20070155160
- Publication date Jul 5, 2007
- LSI Logic Corporation
- Derryl D. J. Allman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of memory bitmap verification for finished product
- Publication number 20070124628
- Publication date May 31, 2007
- LSI Logic Corporation
- David T. Price
- G11 - INFORMATION STORAGE
Information Patent Application
Method for sram bitmap verification
- Publication number 20070083834
- Publication date Apr 12, 2007
- LSI Logic Corporation
- David T. Price
- G11 - INFORMATION STORAGE
Information Patent Application
Spacer-less transistor integration scheme for high-k gate dielectri...
- Publication number 20050191812
- Publication date Sep 1, 2005
- LSI Logic Corporation
- David Pritchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Implementation of Si-Ge HBT module with CMOS process
- Publication number 20040203212
- Publication date Oct 14, 2004
- LSI Logic Corporation
- Robi Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad design
- Publication number 20040089938
- Publication date May 13, 2004
- LSI Logic Corporation
- Derryl D.J. Allman
- H01 - BASIC ELECTRIC ELEMENTS

David T. Price

Person

Patents Grantslast 30 patents

Global shutter sensor systems and related methods

Semiconductor devices with single-photon avalanche diodes and isola...

Edge seals for semiconductor packages

Backside illumination image sensors

Edge seals for semiconductor packages

Method of forming a semiconductor device

Stacked transistor assembly with dual middle mounting clips

Edge seals for semiconductor packages

Stacked image sensor capacitors and related methods

Stacked image sensor capacitors and related methods

Semiconductor image sensor structure having metal-filled trench con...

Method for forming a semiconductor image sensor device

Spacer-less transistor integration scheme for high-K gate dielectri...

Method for redirecting void diffusion away from vias in an integrat...

Method for SRAM bitmap verification

Method and apparatus for diverting void diffusion in integrated cir...

Method and apparatus for redirecting void diffusion away from vias...

Microchannel formation for fuses, interconnects, capacitors, and in...

Implementation of Si-Ge HBT with CMOS process

High performance Si-Ge device module with CMOS technology

Method for forming a bonding pad on a substrate

Patents Applicationslast 30 patents

GLOBAL SHUTTER SENSOR SYSTEMS AND RELATED METHODS

CHIP STACKING WITH BOND PAD ABOVE A BONDLINE

SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND ISOLA...

EDGE SEALS FOR SEMICONDUCTOR PACKAGES

IMPROVED SEALS FOR SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANC...

METHOD AND APPARATUS RELATED TO CONTROLLABLE THIN FILM RESISTORS FO...

BACKSIDE ILLUMINATION IMAGE SENSORS

EDGE SEALS FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND ISOLA...

METHOD AND APPARATUS RELATED TO CONTROLLABLE THIN FILM RESISTORS FO...

FIN TRANSISTORS WITH SEMICONDUCTOR SPACERS

GLOBAL SHUTTER SENSOR SYSTEMS AND RELATED METHODS

METHOD OF FORMING A SEMICONDUCTOR DEVICE

STACKED TRANSISTOR ASSEMBLY WITH DUAL MIDDLE MOUNTING CLIPS

METAL INSULATOR METAL (MIM) CAPACITORS

IMAGE SENSOR DEVICES AND RELATED METHODS

BACKSIDE ILLUMINATION IMAGE SENSORS

EDGE SEALS FOR SEMICONDUCTOR PACKAGES

STACKED IMAGE SENSOR CAPACITORS AND RELATED METHODS

EDGE SEALS FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR IMAGE SENSOR STRUCTURE HAVING METAL-FILLED TRENCH CON...

METHOD FOR REDIRECTING VOID DIFFUSION AWAY FROM VIAS IN AN INTEGRAT...

SPACER-LESS TRANSISTOR INTEGRATION SCHEME FOR HIGH-K GATE DIELECTRI...

Method and apparatus for diverting void diffusion in integrated cir...

Method and apparatus for redirecting void diffusion away from vias...

Methods of memory bitmap verification for finished product

Method for sram bitmap verification

Spacer-less transistor integration scheme for high-k gate dielectri...

Implementation of Si-Ge HBT module with CMOS process

Bonding pad design