David W. Hula

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Ft. Collins, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit metallization using a titanium/aluminum alloy
- Patent number 6,903,017
- Issue date Jun 7, 2005
- Agilent Technologies, Inc.
- Ricky D. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit metallization using a titanium/aluminum alloy
- Patent number 6,646,346
- Issue date Nov 11, 2003
- Agilent Technologies, Inc.
- Ricky D. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical barrier and methods for forming the optical barrier without...
- Patent number 6,627,866
- Issue date Sep 30, 2003
- Agilent Technologies, Inc.
- David W. Hula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic optical barrier for photo-detector array is also interconn...
- Patent number 6,455,836
- Issue date Sep 24, 2002
- Agilent Technologies, Inc.
- David W Hula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical barrier
- Patent number 6,326,601
- Issue date Dec 4, 2001
- Agilent Technologies, Inc.
- David W Hula
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FBAR mass loading process using selective dry etching
- Publication number 20040189424
- Publication date Sep 30, 2004
- David W. Hula
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Integrated circuit metallization using a titanium/alminum alloy
- Publication number 20040038453
- Publication date Feb 26, 2004
- Ricky D. Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical barrier
- Publication number 20020092968
- Publication date Jul 18, 2002
- David W. Hula
- H01 - BASIC ELECTRIC ELEMENTS