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David W. Peters
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Fort Collins, CO, US
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Patents Grants
last 30 patents
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Patent Grant
Integrated circuit device package including multiple stacked compon...
Patent number
6,477,058
Issue date
Nov 5, 2002
Hewlett-Packard Company
Richard J Luebs
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Underfill injection mold
Publication number
20060046321
Publication date
Mar 2, 2006
Hewlett-Packard Development Company, L.P.
David W. Peters
H01 - BASIC ELECTRIC ELEMENTS