David W. Shortt

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Determining information for defects on wafers
- Patent number 10,571,407
- Issue date Feb 25, 2020
- KLA-Tencor Corp.
- Stefano Palomba
- G01 - MEASURING TESTING
Information Patent Grant
Determining information for defects on wafers
- Patent number 10,317,347
- Issue date Jun 11, 2019
- KLA-Tencor Corp.
- Stefano Palomba
- G01 - MEASURING TESTING
Information Patent Grant
Defect marking for semiconductor wafer inspection
- Patent number 10,082,470
- Issue date Sep 25, 2018
- KLA-Tencor Corporation
- David Shortt
- G01 - MEASURING TESTING
Information Patent Grant
TDI sensor in a darkfield system
- Patent number 9,891,177
- Issue date Feb 13, 2018
- KLA-Tencor Corporation
- Jijen Vazhaeparambil
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for controlling convective flow in a light-sustai...
- Patent number 9,887,076
- Issue date Feb 6, 2018
- KLA-Tencor Corporation
- Ilya Bezel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting defects on a wafer using defect-specific and multi-channe...
- Patent number 9,846,930
- Issue date Dec 19, 2017
- KLA-Tencor Corp.
- Kenong Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for imaging a sample with a laser sustained plasm...
- Patent number 9,558,858
- Issue date Jan 31, 2017
- KLA-Tencor Corporation
- David W. Shortt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Detecting defects on a wafer using defect-specific and multi-channe...
- Patent number 9,552,636
- Issue date Jan 24, 2017
- KLA-Tencor Corp.
- Kenong Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for controlling convective flow in a light-sustai...
- Patent number 9,390,902
- Issue date Jul 12, 2016
- KLA-Tencor Corporation
- Ilya Bezel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing aliasing in TDI based imaging
- Patent number 9,297,769
- Issue date Mar 29, 2016
- KLA-Tencor Corporation
- Andrew V. Hill
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Detecting defects on a wafer using defect-specific and multi-channe...
- Patent number 9,092,846
- Issue date Jul 28, 2015
- KLA-Tencor Corp.
- Kenong Wu
- G01 - MEASURING TESTING
Information Patent Grant
Method for reducing aliasing in TDI based imaging
- Patent number 8,947,521
- Issue date Feb 3, 2015
- KLA-Tencor Corporation
- Andrew V. Hill
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods for inspecting specimens including specimens th...
- Patent number 8,582,094
- Issue date Nov 12, 2013
- KLA-Tencor Technologies Corp.
- David Shortt
- G01 - MEASURING TESTING
Information Patent Grant
Defect detection
- Patent number 7,796,805
- Issue date Sep 14, 2010
- KLA-Tencor Corporation
- Michael D. Kirk
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for inspecting a wafer with increased sensitivity
- Patent number 7,697,129
- Issue date Apr 13, 2010
- KLA-Tencor Technologies Corp.
- Kurt L. Haller
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for scanning, stitching and damping measuremen...
- Patent number 7,663,746
- Issue date Feb 16, 2010
- KLA-Tencor Techologies Corporation
- Paul J. Sullivan
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for inspection of a wafer
- Patent number 7,554,656
- Issue date Jun 30, 2009
- KLA-Tencor Technologies Corp.
- David Shortt
- G01 - MEASURING TESTING
Information Patent Grant
System and method for conducting adaptive fourier filtering to dete...
- Patent number 7,505,619
- Issue date Mar 17, 2009
- KLA-Tencor Technologies Corporation
- Evan R. Mapoles
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced simultaneous multi-spot inspection and imaging
- Patent number 7,489,393
- Issue date Feb 10, 2009
- KLA-Tencor Technologies Corporation
- Stephen Biellak
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for determining a characteristic of a specimen
- Patent number 7,463,349
- Issue date Dec 9, 2008
- KLA-Tencor Technologies Corp.
- Stephen Biellak
- G01 - MEASURING TESTING
Information Patent Grant
Computer-implemented methods and systems for determining a configur...
- Patent number 7,436,505
- Issue date Oct 14, 2008
- KLA-Tencor Technologies Corp.
- Alexander Belyaev
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for scanning, stitching, and damping measureme...
- Patent number 7,436,506
- Issue date Oct 14, 2008
- KLA-Tencor Corporation
- Paul J. Sullivan
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for inspecting a wafer with increased sensitivity
- Patent number 7,372,559
- Issue date May 13, 2008
- KLA-Tencor Technologies Corp.
- Kurt L. Haller
- G01 - MEASURING TESTING
Information Patent Grant
Methods and systems for inspecting a specimen using light scattered...
- Patent number 7,304,310
- Issue date Dec 4, 2007
- KLA-Tencor Technologies Corp.
- David Shortt
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for determining surface layer thickness using...
- Patent number 7,271,921
- Issue date Sep 18, 2007
- KLA-Tencor Technologies Corporation
- David W. Shortt
- G01 - MEASURING TESTING
Information Patent Grant
Darkfield inspection system having a programmable light selection a...
- Patent number 7,199,874
- Issue date Apr 3, 2007
- KLA-Tencor Technologies Corporation
- Christopher F. Bevis
- G01 - MEASURING TESTING
Information Patent Grant
Surface inspection system and method for using photo detector array...
- Patent number 7,106,432
- Issue date Sep 12, 2006
- KLA-Tencor Technologies Corporation
- Evan R. Mapoles
- G01 - MEASURING TESTING
Information Patent Grant
Darkfield inspection system having photodetector array
- Patent number 7,061,598
- Issue date Jun 13, 2006
- KLA-Tencor Technologies Corporation
- Christopher F. Bevis
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for scanning, stitching, and damping measureme...
- Patent number 7,009,696
- Issue date Mar 7, 2006
- KLA-Tencor Corporation
- Paul J. Sullivan
- G01 - MEASURING TESTING
Information Patent Grant
Darkfield inspection system having a programmable light selection a...
- Patent number 7,002,677
- Issue date Feb 21, 2006
- KLA-Tencor Technologies Corporation
- Christopher F. Bevis
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Determining Information for Defects on Wafers
- Publication number 20190257768
- Publication date Aug 22, 2019
- KLA-Tencor Corporation
- Stefano Palomba
- G01 - MEASURING TESTING
Information Patent Application
Defect Marking For Semiconductor Wafer Inspection
- Publication number 20180088056
- Publication date Mar 29, 2018
- KLA-Tencor Corporation
- David Shortt
- G01 - MEASURING TESTING
Information Patent Application
Detecting Defects on a Wafer Using Defect-Specific and Multi-Channe...
- Publication number 20170091925
- Publication date Mar 30, 2017
- KLA-Tencor Corporation
- Kenong Wu
- G01 - MEASURING TESTING
Information Patent Application
Method and System for Controlling Convective Flow in a Light-Sustai...
- Publication number 20160322211
- Publication date Nov 3, 2016
- KLA-Tencor Corporation
- Ilya Bezel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TDI Sensor in a Darkfield System
- Publication number 20160097727
- Publication date Apr 7, 2016
- KLA-Tencor Corporation
- Jijen Vazhaeparambil
- G01 - MEASURING TESTING
Information Patent Application
Detecting Defects on a Wafer Using Defect-Specific and Multi-Channe...
- Publication number 20160027165
- Publication date Jan 28, 2016
- KLA-Tencor Corporation
- Kenong Wu
- G01 - MEASURING TESTING
Information Patent Application
DEFECT DETECTION USING SURFACE ENHANCED ELECTRIC FIELD
- Publication number 20150377795
- Publication date Dec 31, 2015
- KLA-Tencor Corporation
- Guoheng Zhao
- G01 - MEASURING TESTING
Information Patent Application
Determining Information for Defects on Wafers
- Publication number 20150123014
- Publication date May 7, 2015
- KLA-Tencor Corporation
- Stefano Palomba
- G01 - MEASURING TESTING
Information Patent Application
System and Method for Imaging a Sample with a Laser Sustained Plasm...
- Publication number 20150048741
- Publication date Feb 19, 2015
- KLA-Tencor Corporation
- David W. Shortt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and System for Controlling Convective Flow in a Light-Sustai...
- Publication number 20140291546
- Publication date Oct 2, 2014
- KLA-Tencor Corporation
- Ilya Bezel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Detecting Defects on a Wafer Using Defect-Specific and Multi-Channe...
- Publication number 20140219544
- Publication date Aug 7, 2014
- KLA-Tencor Corporation
- Kenong Wu
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for scanning, stitching and damping measuremen...
- Publication number 20090040514
- Publication date Feb 12, 2009
- KLA-Tencor Technologies Corporation
- Paul J. Sullivan
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR INSPECTING A WAFER WITH INCREASED SENSITIVITY
- Publication number 20090009754
- Publication date Jan 8, 2009
- KLA-Tencor Technologies Corporation
- Kurt L. Haller
- G01 - MEASURING TESTING
Information Patent Application
Computer-Implemented Methods and Systems for Determining a Configur...
- Publication number 20070229809
- Publication date Oct 4, 2007
- KLA-TENCOR TECHNOLOGIES CORP.
- Alexander Belyaev
- G01 - MEASURING TESTING
Information Patent Application
Systems and methods for inspecting a wafer with increased sensitivity
- Publication number 20070132987
- Publication date Jun 14, 2007
- Kurt L. Haller
- G01 - MEASURING TESTING
Information Patent Application
Methods and systems for inspection of a wafer
- Publication number 20070081151
- Publication date Apr 12, 2007
- David Shortt
- G01 - MEASURING TESTING
Information Patent Application
System and method for conducting adaptive fourier filtering to dete...
- Publication number 20070081154
- Publication date Apr 12, 2007
- KLA-Tencor Technologies Corporation
- Evan R. Mapoles
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for scanning, stitching, and damping measureme...
- Publication number 20060232770
- Publication date Oct 19, 2006
- Paul J. Sullivan
- G01 - MEASURING TESTING
Information Patent Application
Enhanced simultaneous multi-spot inspection and imaging
- Publication number 20060197946
- Publication date Sep 7, 2006
- Stephen Biellak
- G01 - MEASURING TESTING
Information Patent Application
Darkfield inspection system having a programmable light selection a...
- Publication number 20060082767
- Publication date Apr 20, 2006
- KLA-Tencor Technologies Corporation
- Christopher F. Bevis
- G01 - MEASURING TESTING
Information Patent Application
Darkfield inspection system having a programmable light selection a...
- Publication number 20050018179
- Publication date Jan 27, 2005
- KLA-Tencor Technologies Corporation
- Christopher F. Bevis
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for determining surface layer thickness using...
- Publication number 20050018183
- Publication date Jan 27, 2005
- David W. Shortt
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for scanning, stitching, and damping measureme...
- Publication number 20040145733
- Publication date Jul 29, 2004
- KLA-Tencor Corporation
- Paul J. Sullivan
- G01 - MEASURING TESTING
Information Patent Application
Process for identifying defects in a substrate having non-uniform s...
- Publication number 20040066507
- Publication date Apr 8, 2004
- KLA-Tencor Technologies Corporation
- George J. Kren
- G01 - MEASURING TESTING
Information Patent Application
Method and apparatus for scanning, stitching, and damping measureme...
- Publication number 20020154296
- Publication date Oct 24, 2002
- KLA-Tencor Corporation
- Paul J. Sullivan
- G01 - MEASURING TESTING

David W. Shortt

Person

Patents Grantslast 30 patents

Determining information for defects on wafers

Determining information for defects on wafers

Defect marking for semiconductor wafer inspection

TDI sensor in a darkfield system

Method and system for controlling convective flow in a light-sustai...

Detecting defects on a wafer using defect-specific and multi-channe...

System and method for imaging a sample with a laser sustained plasm...

Detecting defects on a wafer using defect-specific and multi-channe...

Method and system for controlling convective flow in a light-sustai...

Method for reducing aliasing in TDI based imaging

Detecting defects on a wafer using defect-specific and multi-channe...

Method for reducing aliasing in TDI based imaging

Systems and methods for inspecting specimens including specimens th...

Defect detection

Systems and methods for inspecting a wafer with increased sensitivity

Method and apparatus for scanning, stitching and damping measuremen...

Methods and systems for inspection of a wafer

System and method for conducting adaptive fourier filtering to dete...

Enhanced simultaneous multi-spot inspection and imaging

Systems and methods for determining a characteristic of a specimen

Computer-implemented methods and systems for determining a configur...

Method and apparatus for scanning, stitching, and damping measureme...

Systems and methods for inspecting a wafer with increased sensitivity

Methods and systems for inspecting a specimen using light scattered...

Method and apparatus for determining surface layer thickness using...

Darkfield inspection system having a programmable light selection a...

Surface inspection system and method for using photo detector array...

Darkfield inspection system having photodetector array

Method and apparatus for scanning, stitching, and damping measureme...

Darkfield inspection system having a programmable light selection a...

Patents Applicationslast 30 patents

Determining Information for Defects on Wafers

Defect Marking For Semiconductor Wafer Inspection

Detecting Defects on a Wafer Using Defect-Specific and Multi-Channe...

Method and System for Controlling Convective Flow in a Light-Sustai...

TDI Sensor in a Darkfield System

Detecting Defects on a Wafer Using Defect-Specific and Multi-Channe...

DEFECT DETECTION USING SURFACE ENHANCED ELECTRIC FIELD

Determining Information for Defects on Wafers

System and Method for Imaging a Sample with a Laser Sustained Plasm...

Method and System for Controlling Convective Flow in a Light-Sustai...

Detecting Defects on a Wafer Using Defect-Specific and Multi-Channe...

Method and apparatus for scanning, stitching and damping measuremen...

SYSTEMS AND METHODS FOR INSPECTING A WAFER WITH INCREASED SENSITIVITY

Computer-Implemented Methods and Systems for Determining a Configur...

Systems and methods for inspecting a wafer with increased sensitivity

Methods and systems for inspection of a wafer

System and method for conducting adaptive fourier filtering to dete...

Method and apparatus for scanning, stitching, and damping measureme...

Enhanced simultaneous multi-spot inspection and imaging

Darkfield inspection system having a programmable light selection a...

Darkfield inspection system having a programmable light selection a...

Method and apparatus for determining surface layer thickness using...

Method and apparatus for scanning, stitching, and damping measureme...

Process for identifying defects in a substrate having non-uniform s...

Method and apparatus for scanning, stitching, and damping measureme...