David W. Song

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
System for thermal management of device under test (DUT)
- Patent number 10,281,521
- Issue date May 7, 2019
- Intel Corporation
- David Won-jun Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant thermal contact device and method
- Patent number 9,791,501
- Issue date Oct 17, 2017
- Intel Corporation
- Paul Diglio
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation lid having direct liquid contact conduits
- Patent number 9,686,888
- Issue date Jun 20, 2017
- Intel Corporation
- David W. Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solution for circuit products
- Patent number 9,477,275
- Issue date Oct 25, 2016
- Intel Corporation
- Arnab Choudhury
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal interface material handling for thermal control of an elect...
- Patent number 9,377,486
- Issue date Jun 28, 2016
- Intel Corporation
- David Won-jun Song
- G01 - MEASURING TESTING
Information Patent Grant
Heat dissipation lid having direct liquid contact conduits
- Patent number 9,165,857
- Issue date Oct 20, 2015
- Intel Corporation
- David W. Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR THERMAL MANAGEMENT OF DEVICE UNDER TEST (DUT)
- Publication number 20180156863
- Publication date Jun 7, 2018
- Intel Corporation
- David Won-jun Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS
- Publication number 20160007499
- Publication date Jan 7, 2016
- Intel Corporation
- David W. Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIAL HANDLING FOR THERMAL CONTROL OF AN ELECT...
- Publication number 20150276798
- Publication date Oct 1, 2015
- David Won-jun Song
- G01 - MEASURING TESTING
Information Patent Application
THERMAL MANAGEMENT SOLUTION FOR CIRCUIT PRODUCTS
- Publication number 20140204534
- Publication date Jul 24, 2014
- Arnab Choudhury
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS
- Publication number 20140126150
- Publication date May 8, 2014
- David W. Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT THERMAL CONTACT DEVICE AND METHOD
- Publication number 20140084953
- Publication date Mar 27, 2014
- Paul Diglio
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Microelectronic package including thermally conductive sealant betw...
- Publication number 20080237843
- Publication date Oct 2, 2008
- Ashish Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-elastomer hybrid thermal interface material to cool under-su...
- Publication number 20080160330
- Publication date Jul 3, 2008
- David Song
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

David W. Song

Person

Patents Grantslast 30 patents

System for thermal management of device under test (DUT)

Compliant thermal contact device and method

Heat dissipation lid having direct liquid contact conduits

Thermal management solution for circuit products

Thermal interface material handling for thermal control of an elect...

Heat dissipation lid having direct liquid contact conduits

Patents Applicationslast 30 patents

SYSTEM FOR THERMAL MANAGEMENT OF DEVICE UNDER TEST (DUT)

HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS

THERMAL INTERFACE MATERIAL HANDLING FOR THERMAL CONTROL OF AN ELECT...

THERMAL MANAGEMENT SOLUTION FOR CIRCUIT PRODUCTS

HEAT DISSIPATION LID HAVING DIRECT LIQUID CONTACT CONDUITS

COMPLIANT THERMAL CONTACT DEVICE AND METHOD

Microelectronic package including thermally conductive sealant betw...

Copper-elastomer hybrid thermal interface material to cool under-su...