David Wang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Extracted material for forward osmosis, preparation method thereof,...
- Patent number 11,273,410
- Issue date Mar 15, 2022
- Industrial Technology Research Institute
- Yi-Chun Chen
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Ionic liquid and forward osmosis process employing the same
- Patent number 11,235,283
- Issue date Feb 1, 2022
- Industrial Technology Research Institute
- Po-I Liu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Thermally enhanced electronic package
- Patent number 9,307,676
- Issue date Apr 5, 2016
- ChipMOS Technologies Inc.
- Tzu Hsin Huang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermally enhanced electronic package utilizing carbon nanocapsules...
- Patent number 8,338,935
- Issue date Dec 25, 2012
- ChipMOS Technologies Inc.
- An Hong Liu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Multi-chip stack package structure
- Patent number 8,269,351
- Issue date Sep 18, 2012
- ChipMOS Technologies Inc.
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stack package structure
- Patent number 8,269,352
- Issue date Sep 18, 2012
- ChipMOS Technologies Inc.
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stack package structure
- Patent number 8,264,068
- Issue date Sep 11, 2012
- ChipMOS Technologies Inc.
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating process of a chip package structure
- Patent number 7,981,725
- Issue date Jul 19, 2011
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 7,973,310
- Issue date Jul 5, 2011
- ChipMOS Technologies Inc.
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 7,960,214
- Issue date Jun 14, 2011
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 7,847,414
- Issue date Dec 7, 2010
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating process of a chip package structure
- Patent number 7,749,806
- Issue date Jul 6, 2010
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 7,638,880
- Issue date Dec 29, 2009
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible IC layout method
- Patent number 5,741,730
- Issue date Apr 21, 1998
- Holtek Microelectronics Inc.
- Hsin-Min Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD OF TREATING WASTE WATER
- Publication number 20220204375
- Publication date Jun 30, 2022
- Industrial Technology Research Institute
- Chia-Hua Ho
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
IONIC LIQUID AND FORWARD OSMOSIS PROCESS EMPLOYING THE SAME
- Publication number 20210197122
- Publication date Jul 1, 2021
- Industrial Technology Research Institute
- Po-I LIU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
EXTRACTED MATERIAL FOR FORWARD OSMOSIS, PREPARATION METHOD THEREOF,...
- Publication number 20210197123
- Publication date Jul 1, 2021
- Industrial Technology Research Institute
- Yi-Chun CHEN
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
THERMALLY ENHANCED ELECTRONIC PACKAGE
- Publication number 20130294033
- Publication date Nov 7, 2013
- TZU HSIN HUANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
THERMALLY ENHANCED PACKAGING STRUCTURE
- Publication number 20130119530
- Publication date May 16, 2013
- CHIPMOS TECHNOLOGIES INC.
- AN HONG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED LIGHT EMITTING DEVICE PACKAGE
- Publication number 20120299036
- Publication date Nov 29, 2012
- CHIPMOS TECHNOLOGIES INC.
- AN HONG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack package structure
- Publication number 20110309497
- Publication date Dec 22, 2011
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack package structure
- Publication number 20110309496
- Publication date Dec 22, 2011
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip stack package structure
- Publication number 20110309495
- Publication date Dec 22, 2011
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING T...
- Publication number 20110304045
- Publication date Dec 15, 2011
- CHIPMOS TECHNOLOGIES INC.
- AN HONG LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY ENHANCED ELECTRONIC PACKAGE
- Publication number 20110304991
- Publication date Dec 15, 2011
- CHIPMOS TECHNOLOGIES INC.
- TZU HSIN HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer structure and multi-chip stack structure
- Publication number 20110291267
- Publication date Dec 1, 2011
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer structure and multi-chip stack structure
- Publication number 20110291268
- Publication date Dec 1, 2011
- David Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING PROCESS OF A CHIP PACKAGE STRUCTURE
- Publication number 20100151624
- Publication date Jun 17, 2010
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100007001
- Publication date Jan 14, 2010
- David Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20080308915
- Publication date Dec 18, 2008
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20080308914
- Publication date Dec 18, 2008
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20080308916
- Publication date Dec 18, 2008
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING PROCESS OF A CHIP PACKAGE STRUCTURE
- Publication number 20080268570
- Publication date Oct 30, 2008
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20080268572
- Publication date Oct 30, 2008
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20080251948
- Publication date Oct 16, 2008
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Extracted material for forward osmosis, preparation method thereof,...

Ionic liquid and forward osmosis process employing the same

Thermally enhanced electronic package

Thermally enhanced electronic package utilizing carbon nanocapsules...

Multi-chip stack package structure

Multi-chip stack package structure

Multi-chip stack package structure

Fabricating process of a chip package structure

Semiconductor package structure and method for manufacturing the same

Chip package

Chip package structure

Fabricating process of a chip package structure

Chip package

Flexible IC layout method

Patents Applicationslast 30 patents

SYSTEM AND METHOD OF TREATING WASTE WATER

IONIC LIQUID AND FORWARD OSMOSIS PROCESS EMPLOYING THE SAME

EXTRACTED MATERIAL FOR FORWARD OSMOSIS, PREPARATION METHOD THEREOF,...

THERMALLY ENHANCED ELECTRONIC PACKAGE

THERMALLY ENHANCED PACKAGING STRUCTURE

THERMALLY ENHANCED LIGHT EMITTING DEVICE PACKAGE

Multi-chip stack package structure

Multi-chip stack package structure

Multi-chip stack package structure

THERMALLY ENHANCED ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING T...

THERMALLY ENHANCED ELECTRONIC PACKAGE

Semiconductor wafer structure and multi-chip stack structure

Semiconductor wafer structure and multi-chip stack structure

FABRICATING PROCESS OF A CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE

CHIP PACKAGE

CHIP PACKAGE

FABRICATING PROCESS OF A CHIP PACKAGE STRUCTURE

CHIP PACKAGE

CHIP PACKAGE STRUCTURE