Davide CHIOLA

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic module including a semiconductor package connected to a...
- Patent number 11,955,407
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baseplate for an electronic module
- Patent number 10,109,544
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing baseplate for an electronic module
- Patent number 9,716,018
- Issue date Jul 25, 2017
- Infineon Technologies AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baseplate for an electronic module and method of manufacturing the...
- Patent number 9,305,874
- Issue date Apr 5, 2016
- Infineon Technologies AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules and methods of formation thereof
- Patent number 8,766,430
- Issue date Jul 1, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component
- Patent number 8,304,305
- Issue date Nov 6, 2012
- Infineon Technologies Austria AG
- Davide Chiola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor component
- Patent number 8,003,456
- Issue date Aug 23, 2011
- Infineon Technologies Austria AG
- Davide Chiola
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON...
- Publication number 20240194566
- Publication date Jun 13, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A...
- Publication number 20210225734
- Publication date Jul 22, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Baseplate for an electronic module and method of manufacturing the...
- Publication number 20170287798
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Fabio BRUCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Baseplate for an electronic module and method of manufacturing the...
- Publication number 20160196989
- Publication date Jul 7, 2016
- INFINEON TECHNOLOGIES AG
- Fabio BRUCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Baseplate for an electronic module and method of manufacturing the...
- Publication number 20150294931
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Fabio BRUCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND CHIP PACKAGE
- Publication number 20140210061
- Publication date Jul 31, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20130334677
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT
- Publication number 20110233728
- Publication date Sep 29, 2011
- Infineon Technologies Austria AG
- DAVIDE CHIOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT, AND A SEMICONDUCTOR...
- Publication number 20080315363
- Publication date Dec 25, 2008
- Infineon Technologies Austria AG
- DAVIDE CHIOLA
- H01 - BASIC ELECTRIC ELEMENTS

Davide CHIOLA

Person

Patents Grantslast 30 patents

Electronic module including a semiconductor package connected to a...

Baseplate for an electronic module

Method of manufacturing baseplate for an electronic module

Baseplate for an electronic module and method of manufacturing the...

Semiconductor modules and methods of formation thereof

Semiconductor component

Method for producing a semiconductor component

Patents Applicationslast 30 patents

AN ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE DISPOSED ON...

ELECTRONIC MODULE INCLUDING A SEMICONDUCTOR PACKAGE CONNECTED TO A...

Baseplate for an electronic module and method of manufacturing the...

Baseplate for an electronic module and method of manufacturing the...

Baseplate for an electronic module and method of manufacturing the...

CHIP ARRANGEMENT AND CHIP PACKAGE

Semiconductor Modules and Methods of Formation Thereof

SEMICONDUCTOR COMPONENT

METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT, AND A SEMICONDUCTOR...